EE 365 CMOS gates Electrical characteristics and timing
- Slides: 42
EE 365 CMOS gates Electrical characteristics and timing TTL gates
CMOS NAND Gates • Use 2 n transistors for n-input gate
• CMOS NAND -- switch model
• CMOS NAND -- more inputs (3)
• Inherent inversion. • Non-inverting buffer:
• 2 -input AND gate:
CMOS NOR Gates • Like NAND -- 2 n transistors for n-input gate
NAND vs. NOR • For a given silicon area, PMOS transistors are “weaker” than NMOS transistors. NAND NOR • Result: NAND gates are preferred in CMOS.
Limited # of inputs in one gate • 8 -input CMOS NAND
Fancy stuff • CMOS AND-ORINVERT gate
CMOS Electrical Characteristics • Digital analysis works only if circuits are operated in spec: – Power supply voltage – Temperature – Input-signal quality – Output loading • Must do some “analog” analysis to prove that circuits are operated in spec. – Fanout specs – Timing analysis (setup and hold times)
DC Loading • An output must sink current from a load when the output is in the LOW state. • An output must source current to a load when the output is in the HIGH state.
Output-voltage drops • Resistance of “off” transistor is > 1 Megohm, but resistance of “on” transistor is nonzero, – Voltage drops across “on” transistor, V = IR • For “CMOS” loads, current and voltage drop are negligible. • For TTL inputs, LEDs, terminations, or other resistive loads, current and voltage drop are significant and must be calculated.
Example loading calculation • Need to know “on” and “off” resistances of output transistors, and know the characteristics of the load.
Calculate for LOW and HIGH state
Limitation on DC load • If too much load, output voltage will go outside of valid logic-voltage range. • VOHmin, VIHmin • VOLmax, VILmax
Output-drive specs • VOLmax and VOHmin are specified for certain output-current values, IOLmax and IOHmax. – No need to know details about the output circuit, only the load.
Input-loading specs • Each gate input requires a certain amount of current to drive it in the LOW state and in the HIGH state. – IIL and IIH – These amounts are specified by the manufacturer. • Fanout calculation – (LOW state) The sum of the IIL values of the driven inputs may not exceed IOLmax of the driving output. – (HIGH state) The sum of the IIH values of the driven inputs may not exceed IOHmax of the driving output. – Need to do Thevenin-equivalent calculation for nongate loads (LEDs, termination resistors, etc. )
Manufacturer’s data sheet
TTL Electrical Characteristics
TTL LOW-State Behavior
TTL HIGH-State Behavior
TTL Logic Levels and Noise Margins • Asymmetric, unlike CMOS • CMOS can be made compatible with TTL – “T” CMOS logic families
CMOS vs. TTL Levels CMOS levels CMOS with TTL Levels -- HCT, FCT, VHCT, etc. TTL levels
Fig 3 -84
TTL differences from CMOS • Asymmetric input and output characteristics. • Inputs source significant current in the LOW state, leakage current in the HIGH state. • Output can handle much more current in the LOW state (saturated transistor). • Output can source only limited current in the HIGH state (resistor plus partially-on transistor). • TTL has difficulty driving “pure” CMOS inputs because VOH = 2. 4 V (except “T” CMOS).
AC Loading • AC loading has become a critical design factor as industry has moved to pure CMOS systems. – CMOS inputs have very high impedance, DC loading is negligible. – CMOS inputs and related packaging and wiring have significant capacitance. – Time to charge and discharge capacitance is a major component of delay.
Transition times
Circuit for transition-time analysis
HIGH-to-LOW transition
Exponential fall time t = RC time constant exponential formulas, e-t/RC
LOW-to-HIGH transition
Exponential rise time
Transition-time considerations • Higher capacitance ==> more delay • Higher on-resistance ==> more delay • Lower on-resistance requires bigger transistors • Slower transition times ==> more power dissipation (output stage partially shorted) • Faster transition times ==> worse transmission -line effects (Chapter 11) • Higher capacitance ==> more power dissipation (CV 2 f power), regardless of rise and fall time
Open-drain outputs • No PMOS transistor, use resistor pull-up
What good is it? • Open-drain bus • Problem -- really bad rise time
Open-drain transition times • Pull-up resistance is larger than a PMOS transistor’s “on” resistance. • Can reduce rise time by reducing pull-up resistor value – But not too much
Important Tables in Chapter 3
- Or logic gate
- Conduction complement
- Timing diagram of nand gate
- Characteristics of ttl logic family
- Vtc of cmos inverter
- Dc characteristics of cmos inverter
- Characteristics of logic gates
- What is fanout in vlsi
- Device modeling for analog and rf cmos circuit design
- Lod effect in vlsi
- Logic gates and transistors
- Bill gates achievements and awards
- Combinational circuit design and simulation using gates
- Combinational circuit design and simulation using gates
- Binary code
- Python logic gate simulator
- Warren buffett and bill gates
- Logic gates and
- Cmos short circuit current
- Conventional cmos latches
- Cmos cross section
- Small signal model of cmos inverter
- Inverter layout
- Cmos tehnologija
- Skewed gates in vlsi
- Skewed gates in vlsi
- Cmos
- Cmos logic levels
- Diode layout in cmos
- Soi vs bulk cmos
- Cmos process flow
- Layout design rules in vlsi
- Cmos diode
- Ttl cmos ecl comparison table
- Cmos amplifier
- Ccd vs cmos
- Bios vs cmos
- Common source amplifier with current mirror active load
- Cmos op amp
- Latchup in cmos
- Memoria cmos ram
- P well fabrication process
- Cascading dynamic gates