Development of the silicon microstrip supermodule prototype for

Development of the silicon microstrip supermodule prototype for the HL-LHC 8 th "Hiroshima" Symposium on Development and Application of Semiconductor Tracking Detectors (HSTD-8), Taipei, Taiwan, December 3 -8, 2011 Outline: 1. Background: HL-LHC and resulting tracking detector upgrades 2. A proposed silicon microstrip implementation for HL-LHC: module and super-module design features 3. Where are we? 4. Comparison with HL-LHC requirements 5. Future design evolution 6. Feasibility for a construction and production success University of Geneva: G. Barbier, F. Cadoux, A. Clark, Y. Favre, D. Ferrère, S. Gonzalez- Sevilla, G. Iacoubucci, D. la Marra, M. Pohl, M. Weber KEK: Y. Ikegami, Y. Takubo. S. Terada, Y. Unno University of Tsukuba: K. Hara Osaka University: M. Endo, K. Hanagaki

HL-LHC Evolution Experimental Implications Machine and Detectors at HL-LHC 2011 √s=7 Te. V L peak ~ 3. 65 x 10 33 cm-2 s-1 Lint ~ 5 fb-1 2012 √s=8 Te. V Lpeak ~ 5 x 1033 cm-2 s-1 2014 - 16 √s=14 Te. V L peak > 5 x 1033 cm-2 s-1 2018 - 20 L peak ~ 2 -3 x 1034 cm-2 s-1 Lint ~ 300 - 400 fb -1 > 2022 Lpeak ~ 5 x 1034 cm-2 s-1 Lint ~ 3000 fb-1 (luminosity levelling) – 25 nsec bunch spacing – Tracking performance should be maintained with up to ~200 collisions per bunch crossing A Clark, HSTD 8 Symposium, Dec 2011 2

HL-LHC Evolution Benchmark layout and performance requirements (1) A Clark, HSTD 8 Symposium, Dec 2011 3

HL-LHC Evolution Benchmark layout and performance requirements (2) Construction requirements A Clark, HSTD 8 Symposium, Dec 2011 4

Design Features Prototype Module Design Features: • Detectors are mounted back-to-back, true stereo reconstruction Space point integrated by the module assembly with the precision of the jigs (~1 µm) Sensor 96 x 96 mm 2, (short) strips 24 x 0. 08 mm 2 • Precise module location on the local structure Thanks to centering bushes: origin + alignment • Bridge hybrid allows FE thermal path different from Si (stabilty consequences) NB: Direct mounting save material and no show stopper in term of thermal performance • Low CTE material and Good thermal conductivity: Si, TPG, CC, Al. N Max Z deformation 1. 4 m @ -35°C • Hybrid pigtails + connector for electrical connections (option) Modularity and flexibility • Module assembly known and simplified in term of procedure and QA: Inherited from SCT barrel A Clark, HSTD 8 Symposium, Dec 2011 5

Design Features Module Assembly Parts – low material budget TPG and Ceramic facings Populated hybrid with CC bridge Sensor to baseboard assembly A Clark, HSTD 8 Symposium, Dec 2011 6

Design Features Module thermal FEA with and without CC bridge Recent FEA calculations investigated by Franck CO 2 based -35°C as coolant temp. 2 mm ID pipe Chip: 0, 3 W Bridge hybrids Hybrid glued on the Si-sensor No wire bonds connected here… Some gap in here… Sensor temperature [-22, -24 °C] Sensor temperature [-19, -22 °C] Temperature offset and distribution is slightly larger but acceptable as compared with the bridged FEA Recall: Thermal run-away was found to be around a factor 4 to the LHC Si power density for bridged design A Clark, HSTD 8 Symposium, Dec 2011 7

Where are we? Modules Module Electrical Performance Modules constructed Module made at KEK Additional modules are under industrialization process with local Japanese companies Essential to survey for future production evaluation A Clark, HSTD 8 Symposium, Dec 2011 8

Where are we? Modules Module Electrical Performance Module Performance Typical noise results from the 4 module test box Hybrid 0 564 to 590 e- Col 0 Col 1 A Clark, HSTD 8 Symposium, Dec 2011 Hybrid 1 Col 0 Col 1 Identical noise inside a single module test box or when combined in the 4 module test box 9

Where are we? Modules Module Electrical Performance Module Irradiation A Clark, HSTD 8 Symposium, Dec 2011 10

Where are we? Super- Modules Super-module Design Features • Modular concept. All parts decoupled from module design and are modular: • cooling, local support, service bus, powering units, SMC • during prototyping, flexibility of evolutions: electronics, service bus, cooling, mechanics versions • parallel assembly at all stages: components prototyping & procurement, fabrication & QA • Full module coverage in Z • Space points: distance to the stereo side of 400 microns: space point resolution equivalent to SCT • Rework : ability to easilyrework up to the commissioning after integration • End-insertion: >1 m 20 stiff Local Support allows simple support structure and service modularity • Low thermo-mechanical stresses: . service bus almost free, cooling pipe uses sliding joins. Super-Module 1. 2 m long with 960 ABCN readout chips Made of 12 double-sided modules assembled on a local support Coolant tube structure Hybrids & FE ABCN Super-Module Controller Bus cab le Local Support A Clark, HSTD 8 Symposium, Dec 2011 11

Where are we? Super- Modules Super-module Mechanical Structure Design CAD view of the SM 2. 0 (Modules have been removed for clarity) Cross beam x 7 (in T 300 prepreg) Cooling Plates x 6 (prototyped in aluminum… CC 2 D at the end) W he n as se mb led … Central pipe in T 300 (key part!) Every sub part assembled with DP 490 glue (with jig and centering pieces) Cross beam (or « wings » ) Guiding pipe (T 300) Cooling pipe Cover (T 300) A Clark, HSTD 8 Symposium, Dec 2011 Modules (TPG, Si, Hybrid, …) Joint pieces in plastic (polycarbonate for proto) 12

Where are we? Super- Modules Super-module Mechanical Structure Design Safe handling End Insertion as a reminder The SM slides w/o stress into the structure (locking in 3 positions) ble Ca bu pe elo nv se End Insertion using a Removable inner guide rail Guide rail A Clark, HSTD 8 Symposium, Dec 2011 End Insertion also developed for “stave” concept 13

Where are we? Whereare we? Super- Modules Super-module Mechanical Prototype Concept validated with endinsertion interfacing dummy barrel locking system Module + Cooling plate and loop independent from LS Light CFRP local support structure (Uni. Ge – Composite Design) Total support 0. 18 X 0 A Clark, HSTD 8 Symposium, Dec 2011 Easy handling… 14

Where are we? Super- Modules Super-module Load Tests and FEA’s outcome on a 1200 mm SM 1 G Carbon fiber Layup (M 55 J) Load case Deflection (micron) Max Stress (Mpa) 16° 77 11 Vertical 80 12 Horizontal 11 10 Eigenvalue f 1: 57 hz - Module material assembly Modal shape A Clark, HSTD 8 Symposium, Dec 2011 Major load and distortion measurements underway to compare/input in FEA, and aid next design iteration Results very positive 15

Where are we? Cooling contact to Modules Cooling and Mechanical Performance Measurements of thermal conductivity cross-checked with FEA (K. Streit) Grease Sample Th. Cond. [W/m. K] Comments DC 340 0. 7 Used on SCT DC 340 irradiated 0. 8 Polymerized @ 1. 1015 1 Mev neq/cm 2 WLPG 1. 2 Colza oil with graphite. Leaking oil… WLPG irradiated 1. 05 Pasty but ok after irradiation WLPF 0. 5 Non-silicone + metal oxyde Electrolube HTCP 1. 5 Non-silicone + Zinc oxyde Focus – IBL baseline Samples of HTCP irradiated up to 1. 2 x 1016 1 Me. V neq/cm 2 for IBL Samples drying and dryer but OK with SCT fluences F A Clark, HSTD 8 Symposium, Dec 2011 F • 2. 3 mm OD Ti-pipe with ~50 -70 micron • Grease area ~70 mm 2 per pipe • Irradiated at 1 x 1015 1 Me. V neq/cm 2 • Thermal conductivity satisfactory • Young Modulus increases from ~40 Mpa to 160 Mpa • Very positive result, being input into FEA calculations 16

Where are we? Whre are we? Super- Modules Super-module Electrical Prototype re tu c u str t r po p su d ide s le ub o D Module removed from 4 Module Box Module support jig Modules with wiggly service buses, BCC boards and DC-DC 1 st module mounted on the structure 4 mounted modules A Clark, HSTD 8 Symposium, Dec 2011 17

Where are we? Super- Modules Super-module Electrical Prototype Performance See talk of Sergio Gonzalez Sevilla at this conference Aim: study of 8 -module readout Status: 4 modules so far read out successfully Hybrid noise versus chip id Hybrid noise versus col Noise is uniform ENC/hybrid < ~ 600 e- S. Gonzalez Sevilla, Y. Takubo) + A Clark, HSTD 8 Symposium, Dec 2011 collaboration for r/o between “supermodule” and “stave” R&D projects 18

Status vs HL-LHC Comparison with HL-LHC Requirements A Clark, HSTD 8 Symposium, Dec 2011 19

Design Evolution Status: Next Steps Close to demonstrating feasibility and practicability of super module solution for ATLAS Phase II tracking detector Will allow technical comparison with competing technologies Evolution: Evolution of sensor design Development of front-end electronics (ABCN 130 nm design) Evolution and implementation of read-out architecture Members of Super Module R&D strongly involved in all these developments Next steps: 2012: Thermal and electrical measurements on 2 nd iteration LS with modules and dummy thermal modules (CO 2 cooling) : 2 nd iteration module design studies : 2013: Development of pre-production LS and module prototypes optimized for material, electrical (ABCN 130) and thermo-mechanical performance after irradiation, and construction simplicity : issues: adapt to layout criteria : optimization of the service bus : LV services (DC-DC or SP powering) : HV services (4 module per HV line? , 1 HV line per LS? ) : tradeoff between performance (material, noise pickup) and robustness (next slides) A Clark, HSTD 8 Symposium, Dec 2011 20

Design Evolution Module Design Evolution 1 st draft layout with ABCN 130, HCC under investigation Cooling plates and tubes GND AC coupling with HVret Flexible pigtail with connector and stiffener Input Filtering Stiffener linking the 2 sides possibly free from the local support HCC Power Card CC + hybrid flex “U” bridge HCC D. Ferrere S. Gonzalez Sevilla Comments: - Symmetry between the two rows is quite important - Power card (DC-DC or SP) implantation is quite challenging and needs study - Pigtail flexibility is essential to pass over the cooling plate - EMI investigation is essential when considering DC-DC A Clark, HSTD 8 Symposium, Dec 2011 21

Design Evolution Super-Module Design Evolution Module #1 Cooling In Module #2 Module #8 TTC, Data & DCS SMB Cooling In Service bus DCDC BCC board DCDC Cooling In BCC board DCDC PS cable HV cable Extrapolated version with ABCN 130 & HCC Module #1 Cooling In TTC, Data & DCS fibers Module #2 Module #12 P S Opto SMC DCS, Interlock Cooling Out PS cable HV cable GBT SCA SMC Hybrid A Clark, HSTD 8 Symposium, Dec 2011 P S HCC HCC Service bus F. Cadoux, Y. Favre, D. Ferrere HCC 22

Design Future Design Evolution – 3 D Models 1 st version of new module design using 3 D Will serve as input for thermal and thermo-mechanical FEA A Clark, HSTD 8 Symposium, Dec 2011 Integration of modules on the cooling plates and optimized LS Integration of supermodule with Local Support 23

Design Evolution Material Budget Estimation Item Rad. length [% X 0] Module with CC bridge (12 mm width) - 1. 59 Module without CC bridge 1. 49 - Local support 0. 18 Cooling plates 0. 25 Bracket, inserts (interface to cylinder) 0. 08 Cooling pipe (Ti 2 mm) 0. 04 Cable bus Al/Cu 0. 19 - - 0. 31 2. 23 2. 45 Cable bus Cu only Total From Y. Unno (evolving) NB: • The sensor thickness is considered 320 m. If 250 m one gains 0. 15%! • The list above does not include the power cards: serial power interface or DC-DC card • Module without CC bridge means that the hybrid flex is directly glued on top of the Si-sensor. This must be investigated. • Al/Cu bus is a multilayer flex which is the IBL baseline. A Clark, HSTD 8 Symposium, Dec 2011 24

Construction feasibility Module Production and Organization Integration Collaborating Institutes Operations SM shipment Assm Sites Operations CERN Module assembly Individual component QA and checks 98% o Module assembly t 96 ~ Module metrology d l Yie Next Wire bonding T SC Thermal cycling Module metrology Electrical QA and inspection Storage Fle SM reception tests xib le Barrel structure assembly Structure alignment survey SM end insertion Commissioning the full barrel SM assembly LS inspections and basics checks Pipe checks Service checks SMC hybrid functionality checks Module assembly on LS with pipe Service assembly SMC hybrid assembly SM metrology SM QA Storage until shipment Parallel prototyping, procurement, assembly possible for all parts of the supermodules • • • Modules/supermodules replaceable at all stages, even when assembled on barrel Simplification and flexibility of prototyping (e. g. prototype changes to SMC-GBT, service bus, LS, pipe) Flexibility to layout and production changes A Clark, HSTD 8 Symposium, Dec 2011 From D. Ferrere 25

Conclusions 1. The double sided-module program is close to demonstrating feasibility for HL-LHC • • The noise performance on single module test box, combined module test box or on the super-module prototypes using DC-DC is as expected and below ~600 e- Expected good mechanical stability for modules, and supermodules on LS (design is optimised for thermal stability) Flexibility in design (true stereo space-points, possibility of z-overlaps etc) Some key questions remain, independent of super module (services, layout, trigger …) 2. New layout considering a realistic “pre-production” design has started • • ABCN 130, HCC and a dedicated service competitive material budget (service material is one of the keys material to be workedout) 1. Assembly parallelism and flexibility • • Possible at all stages of prototyping, assembly and integration Maximizes quality, minimizes risks 2. Much still to be done …… A Clark, HSTD 8 Symposium, Dec 2011 26

A Clark, HSTD 8 Symposium, Dec 2011 BA P U K C 27

Design Features Module Thermo-mechanical FEA Checks Max stress in the TPG ~16 MPa much lower than the TPG tensile strength (40 MPa) Von Mises stresses in TPG plane A module elongation of ~10 microns is probed at the opposite side of the module origin Deflection in the module Max deformation / bow is less than 1. 5 micron in the sensor baseboard Z deformation top side A Clark, HSTD 8 Symposium, Dec 2011 Z deformation bottom side 28

Where are we? Super- Modules Super-module Load Tests and FEA Load testing applied to the Prototype (several weight, locations, …) SM onto the granite table @ Unige (+ its assembly jig) A Clark, HSTD 8 Symposium, Dec 2011 F. Cadoux, G. Barbier 29

Where are we? Super- Modules Super-module Load Tests and FEA Same Load testing applied to the Prototype but “FEA wise” (several weight, locations, …) F 1 C 2 ry a n i m eli Pr Pretty good agreement! (FEA : 0, 5 -0, 6 mm / Test: 0. 65 mm) F 1 How does it compare with tests? ? § Only check / one F 1 location § C 1: OK while… C 2: NOK so far! § Fine tune the wing stiffness § wing rotation (F applied on bridge end) under evaluation… F. Cadoux, G. Barbier A Clark, HSTD 8 Symposium, Dec 2011 30

Design Evolution Service Bus Development Inputs for future design: • HCC integrated on the hybrid together with ABCN 130 • Direct hybrid pigtail connection to service bus – 1 connector for 2 hybrids • Mass optimization to be considered: LV traces (Al vs Cu), connectors, bus dimension • Multi-drop LVDS to think (without LVDS fanout) • Steer the CTE mismatch between service bus and super-module local support • HV line insulation: via + open pads and connectors • Impedance adaptation for LVDS lines: Point-to-point and multi-drop • Shield plane for LVDS and HV. EMI investigation (simulation, measurements, …) • Service bus temperature should be estimated and stay homogenous • DC-DC or SP interface to hybrid, bus and cooling? • Fabrication issue to be investigated: Al mixed with Cu versus service bus length Two types identified: • Multilayer flex with Al-layers for LV supply and Cu-traces for the other lines (Like IBL) • Multi-stack of 2 -layers: 1 with Al for LV supply assembled via connectors to two-layers Cu. NB: Assembly precision need to be better than ~ ¼ of the connector pitch A Clark, HSTD 8 Symposium, Dec 2011 31

References Super-module: • ATLAS public note: ATL-UPGRADE-PUB-2011 -002 “Design and assembly of double-sided silicon strip module prototypes for the ATLAS upgrade strip tracker” • TWEPP Poster (S. Gonzalez Sevilla): 2011 JINST 6 C 11002 http: //iopscience. iop. org/1748 -0221/6/11/C 11002/ Thermal grease: • ATLAS public note: ATL-UPGRADE-PUB-2010 -002 “Thermal Grease Evaluation for ATLAS Upgrade Micro-Strip Detector” A Clark, HSTD 8 Symposium, Dec 2011 32