US CMS Silicon Tracker Project Joe Incandela University

US CMS Silicon Tracker Project Joe Incandela University of California Santa Barbara Status and schedule CMS Weekly Meeting Fermilab May 14, 2004

North American Group • Fermilab (FNAL) • M. Demarteau, A. Ronzhin, K. Sogut, L. Spiegel, S. Tkaczyk + technicians • Kansas State University (KSU): T. Bolton, W. Kahl, R. Sidwell, N. Stanton • University of California, Riverside (UCR) • P. Gartung, G. Hanson, G. Pasztor • University of California, Santa Barbara (UCSB) • A. Affolder, S. Burke, C. Campagnari, D. Hale, (C. Hill), J. Incandela, S. Kyre, J. Lamb, S. Stromberg, (D. Stuart), R. Taylor, D. White + technicians. • University of Illinois, Chicago (UIC) • E. Chabalina, C. Gerber, T. Ten • University of Kansas (KU) • P. Baringer, A. Bean, L. Christofek, D. Coppage • University of Rochester (UR) • R. Demina, R. Eusebi, E. Groves, E. Halkiadakis, A. Hocker, S. Korjenevski, P. Tipton • Mexico Consortium: • Cinvestav: H. Castilla, R. Perez, A. Sanchez • Puebla: E. Medel, H. Salazar • San Luis Potosi: A. Morelos • Brown University • R. Hooper, G. Landsberg, H. Nguyen, C. Nguyen Tracker status - Fermilab - May 14, 2004 - J. Incandela 2

Tracking Requirements • Efficient & robust • Fine granularity to resolve nearby tracks • Fast response time to resolve bunch crossings • Radiation resistant devices for 10 y of LHC operation • ~1 -2% PT resolution at ~ 100 Ge. V • Asymptotic impact parameter sd ~ 20 mm • MOST IMPORTANTLY – We want it to be there and useable as early as possible! Tracker status - Fermilab - May 14, 2004 - J. Incandela 3

US Responsibilities NEW: End Caps (TEC) Outer Barrel (TOB) ~105 m 2 2. 4 m 50% Modules for Rings 5 and 6 and hybrid processing for Rings 2, 5, 6 5. 4 Tracker status - Fermilab - May 14, 2004 - J. Incandela m 4

Outer Barrel Production • Outer Barrel • Modules • 4128 Axial (Installed) • 1080 Stereo (“ “) • Rods • 508 Single-sided (“ “) • 180 Double-sided (“ “) ~20 cm Modules Built & Tested in US • US Tasks • All hybrid bonding & test • All Module assembly & test • All Rod assembly & test • Joint Responsibilities with CERN • Installation & Commissioning • Maintenance and Operation Tracker status - Fermilab - May 14, 2004 - J. Incandela 5

End Cap Construction First TEC Module Built at UCSB • Central European Consortium requested US help • We agreed to produce up to 2000 R 5 and R 6 modules • After 10 weeks UCSB successfully built the R 6 module seen above. • UCSB has built 27 R 6 and 3 R 5 modules to date Tracker status - Fermilab - May 14, 2004 - J. Incandela 6

Sensors: factories Frames: Brussels US in the tracker Pitch adapter: Hybrid: Brussels CF carrier Hybrids: Strasbourg CERN Sensor QAC Module assembly Bonding & testing RU Pisa FNAL UCSB Perugia Wien TOB Assembly CERN/USA Karlsruhe Lyon Wien Bari Padova Pisa Catania Torino Bari Firenze Integration ROD INTEGRATION into FNAL UCSB mechanics Sub-assemblies Perugia TIB-TID INTEGRATION Wien Brussels UCSB Zurich Strasbourg Karlsruhe Aachen Louvain Pisa Louvain Strasbourg Brussels PETALS INTEGRATION Lyon Strasbourg Aachen Karlsruhe TIB-TID Assembly TEC Assembly Pisa Aachen Karlsruhe. --> Lyon TK ASSEMBLY CERN UCSB US carries almost half of the production load

Summary I • Problems continued to plague components this past year • US contributions have been critical • US played major role in finding and fixing a series of flaws • In some cases they would have been fatal • Problems for module components have been addressed • Frames and hybrids: • Yields and rates are high and rising • Sensors • US identified CM Noise and other problems with STM sensors • US advocated shifting order to HPK: • Provided funds for procuring the masks • Pressed for order to be placed with HPK in February – beyond which we would have delayed HPK production • CMS is reviewing STM now • Either STM quality reaches adequately high standards or the remainder of the order will be shifted to HPK • Upshot: no matter what – we’ll have very high delivery rates by July Tracker status - Fermilab - May 14, 2004 - J. Incandela 8

Summary II • These issues have meant that the schedule has slipped • We have lost 6 -8 months in FY 04 due to this last round of problems • We have responded • In parallel with work to resolve component problems we improved our production capacity • Major upgrade of US production lines to achieve significantly higher production capacity to recover lost schedule time. • New and better methods • More and better tooling and hardware • Better software and Quality Control • Both FNAL and UCSB production lines have since demonstrated more than 100% increases in stable, high quality module production • Our production capacity is now extreme: • CDF or D 0 Run 2 silicon detectors ~ 750 k channels each: • We can produce this many channels in 10, 40 -hour weeks • With overtime we’d need only 6 weeks Tracker status - Fermilab - May 14, 2004 - J. Incandela 9

Hybrid Problems • Serious problems were uncovered by US and CERN 1. Flex cable fragility (US) 2. Weak wirebonds (CERN) 3. Power via opens (US) • Found early, solved quickly • • • These could have been fatal Excellent communication between US and Europe Great relationships with vendors Problems typically have been diagnosed, understood, and removed in 1 -4 weeks Tracker status - Fermilab - May 14, 2004 - J. Incandela 10

Sensor Production Hamamatsu Photonics (HPK) • Thin Sensors (320 mm) • 6273 of 6877 (91%) delivered • Yield > 99% at CMS QC • Thick Sensors (500 mm) • 7000 ordered from HPK • Deliveries have begun SGS Thomson (STM) • Thick Sensors (500 mm) • Initially ~87% yield at CMS QC • Major efforts by the CMS tracker group and STM yield at CMS QC increased to ~ 98% • Still concerns … • HPK has capacity to make all CMS sensors on schedule Tracker status - Fermilab - May 14, 2004 - J. Incandela 11

1. CMN Noise Issue • Example: Sensors 31215014 and 14308304 • Channels causing the problem • 203 at 70 V • 251 at 130 V CMN problem first reported by US in July 2003. Understood to be a pt. discharge/breakdown effect Tracker status - Fermilab - May 14, 2004 - J. Incandela 12

2. Vacuum – effect (single strip!) First IV in standard Vienna qtc setup: sensor outside specifications (20µA) Vacuum switched on again: Sensor again bad (20µA) Vacuum switched off: Sensor perfect 0. 5 µA with vacuum without vacuum Sensor 30211431541220 Tracker status - Fermilab - May 14, 2004 - J. Incandela 13

3. Time structure in leakage current We identify some sensors with odd noise structure: Good sensor Tracker status - Fermilab - May 14, 2004 - J. Incandela 14

4. Large processing changes Deliveries as of mid February show a new class of sensors: All sensors have currents >1. 5 µA : all grade B (have to be fully tested 100%) IV curve in most cases flat, sensors good? Tracker status - Fermilab - May 14, 2004 - J. Incandela 15

Module Components Summary • We exerted a major positive influence. • Many problems (most found by US) led to delays • Module breakage in transport → 2 months • Hybrid Cable problem → +3 months • ST Sensor issues → +5 months • Hybrid via problem (found April 04) → no added delay • ST sensors are the remaining concern • Shifted order of 7000 (out of 18000 thick sensors) to HPK • Re-qualifying STM final process now with decision in July • Timing such that we can shift all production to HPK without impact on schedule if STM fails qualification Tracker status - Fermilab - May 14, 2004 - J. Incandela 16

Hybrids Progress Yield is stabilizing above 90% Tracker status - Fermilab - May 14, 2004 - J. Incandela 17

Rods • Component issues resolved • Opto. Hybrids • Frames • CCU modules were an issue last month. • Now receiving good devices • Mounting/cabling at CERN is underway • Can reach production rate of 50 rods/month • One issue with potential damage in shipping • Several good solutions under study Tracker status - Fermilab - May 14, 2004 - J. Incandela 18

US Productivity Enhancements • Gantry (robotic) module assembly • Redesigned: more robust, flexible, easily maintained • Surveying and QA • Automated use of independent system (OGP) • More efficient, accurate, fail-safe • Module Wirebonding • Fully automated wirebonding • Faster and more reliable bonding • Negligible damage or rework • Taken together: • Major increase in US capabilities • Higher quality • Could build 750 k channels (equal to CDF or D 0 in Run 2) in 6 weeks! Tracker status - Fermilab - May 14, 2004 - J. Incandela 19

Testing & QA • US has led in many respects • US testing macros and test stand configurations now used everywhere • Critical contributions • Discovered and played lead role in solution of potentially fatal problems • Taken together • Averted disaster • Higher quality Tracker status - Fermilab - May 14, 2004 - J. Incandela 20

Module Mechanical Precision • Tolerances are stringent • Dx of sensors most critical • 97% modules in specs Dx(Frame-Sensor) (mm) • Second order corrections: • All new modules in specs! Dx(Sensor-Sensor) (mm) Dq(Frame-Sensor) (mdeg) Dq(Sensor-Sensor) (mdeg) Tracker status - Fermilab - May 14, 2004 - J. Incandela 21

Bonding • All centers fully operational • UCSB and FNAL both keep pace with 15/d rate with ease! Tracker status - Fermilab - May 14, 2004 - J. Incandela 22

Hybrid & Module Electrical Testing • Specification < 2% faulty channels per module • Module testing has matured significantly • Minimum set of tests is now defined • Fault finding algorithms: • >99% faults found & correctly identified >90% of time • Less than 0. 1% of good channels are flagged faulty • Performance standardization • Easy comparison of results at different sites Tracker status - Fermilab - May 14, 2004 - J. Incandela 23

Module Fault Finding Noise Measurement Pulse Height Measurement (Using Calibration Pulse) Opens Noisy Shorts 1 sensor open Pinhole 2 sensor open Pinholes Bad Channel Flags Tracker status - Fermilab - May 14, 2004 - J. Incandela Bad Channel Flags 24

Module Quality • Goal of less than 1% faulty channels per module • Single Sensor Modules • 0. 20% Faulty Channels Per Module • Production introduced faults at less than 0. 1% rate! • Two Sensor Modules • 0. 55% Faulty Channels Per Module • Production introduced faults at less than 0. 1% rate! • Unprecedented low rate of faulty channels Tracker status - Fermilab - May 14, 2004 - J. Incandela 25

Substructure Integration • Shells, petals, rods underway • Systems tests helping to finalize components and procedures Tracker status - Fermilab - May 14, 2004 - J. Incandela 26

Rod Assembly, Test, Transport • US contributions • • • Tracker status - Fermilab - May 14, 2004 - J. Incandela Module installation Single rod test stands Multi-rod burn-in stands Definition of tests & methods Transportation 27

Rod Testing and Transport Tracker status - Fermilab - May 14, 2004 - J. Incandela 28

Current Tracker Schedule Tracker status - Fermilab - May 14, 2004 - J. Incandela 29

US Module Production (as determined by A. Cattai, J. Incandela, S. Schael) • This is our current module production schedule: • USA module final production • TOB modules: Early June 2004 to May 2005 • TEC modules: Late June 2004 to mid-April 2005 • Paced by sensors & hybrids • Currently it appears they will arrive simultaneously Tracker status - Fermilab - May 14, 2004 - J. Incandela 30

Other Considerations • Rods are expected to keep pace with module assembly • Most system integration will now occur in FY 06 • Meanwhile, we analyzed all systems for potential sources of downtime in production • • Stocked critical spares of fabrication tooling and equipment Cross-training fabrication personnel Developed satellite hybrid processing capacity in Mexico Specialized testing and diagnostics facility at UC Riverside Tracker status - Fermilab - May 14, 2004 - J. Incandela 31

Summary • • • The tracker is one of the main strengths of CMS The US tracker group is making critical contributions Module component problems have been solved We’ve accumulated more delays … … But we’re on much more solid ground Consequence for schedule: • Final assembly of the wheels at CERN slips into FY 06. Tracker status - Fermilab - May 14, 2004 - J. Incandela 32