ARLON Secure 1500 FG Application of ARLON Secure

ARLON Secure 1500 FG导热粘接 绝缘膜应用介绍 Application of ARLON Secure 1500 FG Thermal Insulator 深圳市艾为创科技有限公司 Shenzhen Aiweichuang Technology Co. , Ltd. ----AVC----

内容 Contents w w w w ARLON公司简介 ARLON company profile Secure 1500 FG材料特性 Characteristics of Secure 1500 FG材料技术演进 Technology evolution of Secure 1500 FG材料应用 艺简介 Application process of Sucure 1500 FG 同其它功率器件安装方式对比 Comparisons of mounting method between Secure 1500 FG and other power devices 优选应用 艺条件 Preferable conditions of application process Q&A

ARLON公司简介 Arlon Company Profile ARLON STD Arlon-STD has been a leader in silicone rubber and silicone adhesive technologies since 1954. Silicone rubber is a unique elastomer that delivers high performance electrical insulation in low temperature and high temperature environments. Arlon focuses on precision-calendered silicone rubber coated fabric sheets and specialty extruded silicone rubber tapes. By specializing exclusively in silicone, Arlon has developed unmatched technical competence. Arlon pursues the most rigorous quality standards and controls. They have incorporated statistical process control methods throughout our manufacturing operations to assure calendering accuracy and precision. Laser measurement capability ensures precise control of calendered thickness across the roll width for the entire production run. Self-bonding organic silicon insulative tape; Thermal insulator adhesive;

Secure 1500 FG材料特性 Characteristics of Secure 1500 FG w w 材料基本特性 Basic characteristics of the material 1. 专门针对电源产品功率器件的安装需求而开发，集导热、绝缘、粘接 固定等功能于一 身； Secure 1500 FG is intended for power devices with its multifunction of heat conducting, insulating and bonding; 2. 基体材料为添加了导热填料的高性能有机硅橡胶。有机硅材料优异的 高、低温特性，良好的弹性确保了-40℃到 200℃的 作温度范围，并 能承受苛刻的高低温冲击条件； The basic material is organic silicon rubber with heat conductive aditive. Its hot and cold properties and high elasticity ensure its working capability under-40℃~150℃ and thermal shock resistance;

Secure 1500 FG材料特性 Characteristics of Secure 1500 FG 3. 特殊的加� 固化机理确保良好的粘接强度； Unique thermal enhancing mechanism ensures high cohesional strength; 4. 高耐� 、良好�� 性； High dielectric strength and good thermal conductivity; 5. ARLON独有的� 延控制技� 确保材料一致性； Arlon's exclusive calendering control technique ensures material's consistency; 6. 特殊� 整的有机硅配方确保材料�� 易用： � 位� 装----常温加� --加� 固化----完成 Unique formulation of the organic silicon ensures simplicity of process: Assembling----Pressing under normal terperature---Curing under heat

Secure 1500 FG材料特性 Characteristics of Secure 1500 FG w 材料可靠性测试 Reliability test of the material 150℃，1000小时长期高温老化测试，OK； Thermal Aging at 150 C for 1000 hours

Secure 1500 FG材料特性 Characteristics of Secure 1500 FG w 材料可靠性测试 Reliability test of the material 80℃/85 RH，1000小时高温高湿测试，OK； 80 C/85 RH -1000 hours

Secure 1500 FG材料特性 Characteristics of Secure 1500 FG w 材料可靠性测试 Reliability test of the material -40 -150℃，1000 cycles高低温循环测试，OK； Temperature Cycling- 1000 cycles -40 to 150 C

Secure 1500 FG材料技术演进 Technology Evolution of Secure 1500 FG材料的前身：Thermabond thermal Conductive adhesives。 主要用于航太产品、汽车电子等承受苛刻高低温冲击、振动环境条件下 PCBA组件同heatsink的导热粘接，通过材料自身的良好弹性消除组件间的 CTE失配，并将PCBA组件的发热快速传递到heatsink组件上。 The predecessor of Secure 1500 FG was Thermalbond conductive adhesive, which was mainly used on aerospace products and automotive electronics to realize thermal bond between PCBA and heat sink under thermal shock and vibrating environments, eliminating CTE missmatching between modules and quickly conducting heat from PCBA to heat sink by its own elasticity.

Secure 1500 FG材料技术演进 Technology Evolution of Secure 1500 FG

Secure 1500 FG材料应用 艺简介 Application Process of Secure 1500 FG 步� 1：材料准 � Step 1 Prepare the material 步� 6：加� 固化 Step 6 Cure under heat 步� 2：剥去一� 离型膜，而后 � 合与散� 器安装面 Step 2 Peel off a release liner and joint the adhesive to the surface of heat sink 步� 5：常温加� Step 5 Press power packages under normal temperature 步� 3：剥去另一� 离型膜 Step 3 Peel off the other liner 步� 4：放置功率管（可借助� 具 定位） Step 4 Place power packages. A fixture may be needed

同其他功率器件安装方式对比 Comparisons of mounting method between Secure 1500 FG and other power devices w Vs 常规导热绝缘膜+螺钉安装方式 Compared to insulator+ bolts installation 1. 产品设计性能优势； 节省安装安装空间，极大提升电源产品功率密度； 耐压高，7 mil材料标称 4 KVAC，9 mil材料标称 6 KVAC，可用作基本绝缘场景。 而通常螺钉安装方式只能做到 作绝缘； 散热好，导热性能优于业界常用导热绝缘膜； Product design and performance advantages: Less installing space requirement significantly improves power products' power density ; Resistant to high voltage. 7 mil material's nominal voltage is 4 KVAC and 9 mil material 6 KVAC, which can be applied to basic insulation scene, while the insulator + bolts installation can only make operational insulation; Better heat conducting performance than commonly used thermal insulating materials;

同其他功率器件安装方式对比 Comparisons of mounting method between Secure 1500 FG and other power devices 2. 综合成本优势； 散热器不需打孔、攻丝，制造成本低廉。综合成本低于常规导热绝缘膜+螺 钉、弹片、压条等安装方式； Combined cost advantage: No perforating or threading requirement for the heat sink, which lower down the cost; 3. 制造优势； 制造环节质量一致性高，无常规方式操作不当导致经常出现的功率管应力损 伤、绝缘膜刺穿耐压、陶瓷基片破裂等不良问题；可实现自动化无人装配。 Producing advantage: High consistency of quality during the process of production. No stress damage, puncture of voltage resistance or fracture of ceramic substrate and similar problems; automatic assembly is realizable;

同其他功率器件安装方式对比 Comparisons of mounting method between Secure 1500 FG and other power devices w Compared to installation of conventional pressure sensitive adhesive Product design and performance advantages: Good heat conducting performance, much lower integrative thermal resistance than thermal insulating pressure sensitve adhesive; Insensitiveness to planeness eliminates the need for finish milling of heat sink surface, while thermal insulating pressure sensitve adhesive film's 2 um thinckness makes it hard to bond thoroughly to heat sink, affecting the cohesional strength and thermal contact resistance; Working temperature comparison: 150℃ vs 120℃; Cohesional strength comparison: 500 psi vs 200 psi Long-term insulating performance, while pressure sensitive adhesive's viscosity accumulates dust during work process, which is much likely to puncture material's dielectrical strength;

同其他功率器件安装方式对比 Comparisons of mounting method between Secure 1500 FG and other power devices w Compared to similar materials within power industry More pressure is needed when curing similar power industry materials and the cohesional strength is susceptible to fluctuation of variable process parameters, which cause a series of difficulties and problems: 1. 2. A good amount of fixtures are needed; Heat sinks are heated with fixture, which enlarges heating capacity, consuming more heat and requires special heating facility (iron panel reflow oven); Poor voltage withstanding property. Actual voltage endurance is much lower than manufacturer's nominal voltage, failing to serve for basic insulation. Dielectrical strength tests are always needed during process; More application limitations: conductive heating, it is hard to realize toothed heat sinks and the technology of bonding power packages to both sides of heat sink. 3. 4.

优选应用 艺条件 Preferable conditions of application process w Preparation of heat sink and power packages： Make sure the bonding surfaces of both heat sink and power package are dirt free. Absolute alcohol or electronic washing agent may be needed for scrubbing. w Peel off a release liner of Secure 1500 FG and joint the adhesive to the surface of heat sink: Place the adhesive to the heat sink and press it with fingers or a rollerbit by bit till it bonds thoroughly to the heat sink. Avoid bringing in bubbles. If bubbles are actually caused, squeeze them out with fingers;

优选应用 艺条件 Preferable conditions of application process w Peel off the other liner: Pry up a corner of the liner with a tool and peel it off slightly with an angle of approximately 180°, avoid drawing back or wrinkling the material; w Assemble power packages: Place power packages on the adhesive with a locating fixture and press them slightly.

优选应用 艺条件 Preferable conditions of application process w Pre-bonding with pressure under normal terperature: Press the bonding power packages by a forcing press whose pressure level is controllable for a period of time; Parameters recommended: 50~75 psi, 30 s; During this process, uncured organic silicon material stuffs the gapping place by distortion and form a decent moistened adhesive interface.

优选应用 艺条件 Preferable conditions of application process w Thermal curing: Parameters : temperature 150℃, time 5~10 min. Temperature monitoring during curing is suggested. Facilities and methods: hot blast heating, hot air recirculation drying stove, hot air tunnel stove or reflow oven are generally used. Out of consideration for production continuity, hot air tunnel stove and reflow oven are preferable. Specification of equipment is based on production requirements.

优选应用 艺条件 Preferable conditions of application process w w 完成组件检验： 可根据质量管控要求对完成组件进行非破坏性耐压测试、 粘接力测试。 Testing of finished module: Non-destructive dielectric strength test and cohesional strength test according to quality control demands are suggested.

Q&A?

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