Particles and Fields Package PFP Instrument Preliminary Design

Particles and Fields Package (PFP) Instrument Preliminary Design Review SWEA David L. Mitchell Paul Turin Ellen Taylor (with many contributions from CESR) PFP IPDR 2010/6/14 - 16 1

CESR / UCB-SSL Collaboration CESR, Toulouse • • Analyzer MCP Anode HVPS SSL, Berkeley • Pedestal • Digital / FPGA • LVPS (same as for STEREO SWEA) PFP IPDR 2010/6/14 - 16 2

SWEA Team – SSL • • David L. Mitchell (Instrument Lead) Paul Turin (Mechanical) Ellen Taylor (Electrical) Chris Smith (Thermal) with support from John Hawk at NASA-GSFC • • • Dorothy Gordon (FPGA) Peter Harvey (FSW [PFDPU]) Peter Berg, Selda Heavner (Power Supplies) Tim Quinn (GSE) Steve Marker (Facilities) Kate Harps, Jim Keenan, Misty Willer (Purchasing, Contracts) PFP IPDR 2010/6/14 - 16 3

SWEA Team – CESR • • • Christian Mazelle (Lead Co. I) Jean-Jacques Thocaven (PM, Electronics) Jean-André Sauvaud, Dominique Toublanc (Co. Is) Andrei Fedorov (Detector simulations, Calibrations) Jean Rouzaud (Mechanics, Environmental tests) Claude Aoustin (CESR Technical Manager) Philippe Rouger (Electronics) Eric Lecomte (Integration, Coating) Qiu Mei Lee (Documentation) David Moirin BTS Industrie (Quality Assurance) Marc Bouyé OMP (Thermal) CNES can bring expertise on request (components, EMC…) PFP IPDR 2010/6/14 - 16 4

SWEA Documentation • Performance Requirements – MAVEN-PM-RQMT-0005, Mission Requirements (Level 2) – MAVEN-PFIS-RQMT-0016, PFP Requirements (Level 3) – MAVEN-PF-SWEA-002, SWEA Specification (Level 4) • Differences from STEREO SWEA – SWEA_STEREOto. MAVENChanges • Interface Documents – MAVEN-PF-SWEA-001 I_CESRto. SSLICD (analyzer to pedestal) – MAV-SWE-ICD-001 SWEA MICD (pedestal to spacecraft) – MAVEN_PF_SYS_0 xx, PFP interfaces and specifications • Environments – MAVEN-SYS-RQMT-0010 (Environmental Requirements Document) – MAVEN_ESC_specification (electrostatic cleanliness) • Software – MAVEN_PF_FSW_002 – MAVEN_PF_SWEA_012 A_FPGA_Specification (Level 5) PFP IPDR 2010/6/14 - 16 5

SWEA Peer Reviews • Analyzer/Front-end peer review at CESR, February 3 -4 – Actions and responses discussed in this presentation: • Analyzer, Front-end Electronics (Mitchell, Turin) – Actions and responses discussed in other presentations: • Thermal (Smith) • Digital/LVPS peer review at UCB/SSL, May 10 -12 – Actions and responses discussed in other presentations: • Digital/FPGA (Taylor, Gordon) • Power Converter (Berg) • Flight Software (Harvey) PFP IPDR 2010/6/14 - 16 6

SWEA Science David L. Mitchell June 15, 2010 PFP IPDR 2010/6/14 - 16 7

MAVEN Level 1 Requirements 4. 1. 8: Solar Wind Electrons Baseline: MAVEN shall determine flux and velocity distributions of solar wind, magnetosheath and ionospheric electrons from 10 -1000 e. V with an energy resolution sufficient to distinguish ionospheric photoelectrons from solar wind electrons and ability to resolve magnetic cusp horizontal spatial scales. Better than 30 o angular resolution; better than 20% energy resolution. PFP IPDR 2010/6/14 - 16 Rationale: Electron energy-distribution measurements determine the electron impact ionization rates, allow distinction to be made between the different regions created by solar-wind interactions with the upper atmosphere, determine magnetic topology near magnetic cusps, and constrain behavior of auroral electrons. 8

SWEA Science Goals Magnetic Topology & Plasma Regime • Crustal Magnetospheres/Cusps o o o • Draped Field Lines PFP IPDR 2010/6/14 - 16 9

SWEA Science Goals MGS MAG/ER Electron Impact Ionization • Magnetic Pileup Region • Ionosphere PFP IPDR 2010/6/14 - 16 10

SWEA Science Goals Mars Express Shadow 2. 35 RM ESCAPE PEB Photo-ionization of CO 2 by solar h @ 304 Å h -electrons MPB 5 R (MSO) 4 3 2 1 0 -3 -2 PFP IPDR 2010/6/14 - 16 -1 0 X (MSO) 1 2 Escape associated with heavy ions (M> 16) 11

PF Level 3 Requirements REQUIREMENT SWEA DESIGN PF 65: SWEA shall measure energy fluxes from 104 to 108 e. V/cm 2 -sec-ster-e. V Compliance. SWEA designed to measure energy fluxes from 103 to 109 e. V/cm 2 -sec-ster-e. V. PF 66: SWEA shall have a geometric factor > 0. 005 cm 2 ster Compliance. Geometric factor from simulations and laboratory calibrations of STEREO SWEA yield a geometric factor of 0. 01 cm 2 -ster. PF 67: SWEA shall measure electrons from 10 – 1000 e. V Compliance. SWEA analyzer range is 5 e. V to 6 ke. V, with full deflections up to 1. 6 ke. V. PF 68: SWEA shall have energy resolution d. E/E of at least 25% Compliance. SWEA designed with an energy resolution of 18%, which can be adjusted down to 9% for energies below 50 e. V. PF 69: SWEA shall have time resolution of at least 20 seconds Compliance. SWEA completes a full analyzer and deflector sweep cycle in 2 seconds. SWEA bit rate supports 4 -second resolution in ionosphere mode. PF 70: SWEA shall have angular resolution of at least 45 degrees Compliance. SWEA design provides 22. 5 -degree resolution in azimuth, and better than 14 degree resolution in elevation. PF 71: SWEA shall have a FOV which covers at least 50% of the sky Compliance. SWEA FOV (360 o x 130 o) covers 90% of the sky, minus spacecraft blockage, for energies up to 1. 6 ke. V. PFP IPDR 2010/6/14 - 16 12

SWEA Data Products • FPGA provides a single science data product to the PFDPU – Counts per accumulation interval for each of the 16 anodes (as a function of analyzer and deflector sweeps) – Complete measurement sequence takes 2 seconds. • PFDPU computes three data products, with cadence depending on altitude Solar Wind Mode altitude > 500 km 544 bps • Energy spectra every 16 sec • Pitch angle distr. every 16 -32 sec • 3 D distributions every 64 sec Ionosphere Mode • Energy spectra every 4 sec altitude < 500 km • Pitch angle distr. every 4 -8 sec 1216 bps • 3 D distributions every 64 sec PFP IPDR 2010/6/14 - 16 13

SWEA Resources SWEA Mass Component SWEA Power CBE (kg) Peak (m. W) Average (m. W) Front-end electronics 776 565 Digital electronics 211 160 0. 200 Total Secondary 987 725 Digital board 0. 200 SWEA LVPS Eff. (75%) 329 242 Electronics housing 0. 150 PFDPU LVPS Eff. (90%) 146 107 Connector, Cabling 0. 045 Total 1462 1074 Total 1. 598 Allocation 1. 94 Contingency 21% Electrostatic analyzer 0. 703 MCP+Anode board 0. 070 Preamp board 0. 080 HV power converter 0. 150 LV power converter PFP IPDR 2010/6/14 - 16 Component Allocation 1240 Contingency 15% 14

Spacecraft Accomodation Boom location: • Separation from s/c potentials FOV: 360 o x ± 65 o • Large, clear field of view • Sensor head in shadow • Electronics box in sunlight SWEA axis parallel to SC Z when deployed PFP IPDR 2010/6/14 - 16 15

Hardware Implementation: Baseline STEREO SWEA Design PFP IPDR 2010/6/14 - 16 16

SWEA Heritage • CESR and SSL have a long history of successful hardware collaboration: ISEE, GIOTTO, WIND 3 D-P, MGS, CLUSTER-CIS, STEREO • Instrument lifetimes greatly exceed requirements: WIND, MGS (9 years instead of 2), CLUSTER-CIS (10 years of operation soon) • SWEA design already flying on STEREO • Engineering model available at CESR for tests • Calibration facility available at CESR • Most of STEREO technical team expertise available • STEREO SWEA data analysis team feedback • All tools available for MAVEN SWEA instrument fabrication • Same companies will be in charge of MAVEN instrument fabrication (electronics, mechanics, environmental tests) • AIT compatibility with Planetary Protection under evaluation. Staff has followed Exo. Mars PP course (class 4 PP project) • MAVEN SWEA fully funded by CNES until 2016 PFP IPDR 2010/6/14 - 16 17

Instrument Geometry PFP IPDR 2010/6/14 - 16 18

Geometric Factor ~4 less Real less than ideal because of actual grid transparencies (interference between two entrance grids), MCP efficiencies, and grid support shadow. SWEA sensitivity appropriate for Mars environment. PFP IPDR 2010/6/14 - 16 19

Dynamic Range (RFA-08) • 10 years of MGS electron data (including solar max and several extreme events) provides basis for needed dynamic range. • Expected count rates of STEREO SWEA at Mars approach saturation only during the most extreme events observed by MGS. • Resolution: Utilize SWEA’s V 0 capability to reduce geometric factor by ~50% for energies below 50 e. V. Provides additional head room for extreme events. PFP IPDR 2010/6/14 - 16 20

Variation of Energy Resolution of the sensor at low energy can be controlled by varying the voltage bias U 0 between the internal and external grids: where and is the energy resolution for zero bias (0. 175) is the incident energy of the electron Thus to increase the energy resolution about 2 times, we apply PFP IPDR 2010/6/14 - 16 21

Validation using MEX Measurements (1) PFP IPDR 2010/6/14 - 16 22

Simulated Count Rate Validation using MEX Measurements (2) Reduction of count rates with increase of energy resolution PFP IPDR 2010/6/14 - 16 23

Deflector Positions (RFA-05) • STEREO SWEA response function not sufficiently flat as a function of deflection potential • Simulations performed to optimize the deflector positions Upper Deflector (UD) Lower Deflector (LD) PFP IPDR 2010/6/14 - 16 24

Deflector Positions (RFA-05) • Simulations performed to optimize the deflector positions Key ● STEREO SWEA ● UD + 1 mm, LD - 0. 3 mm ● UD + 1 mm, LD - 0. 6 mm • Collimation by deflectors eliminated • Max energy for full deflection reduced from 2. 4 ke. V to 1. 6 ke. V PFP IPDR 2010/6/14 - 16 25

Inner Hemisphere Scalloping (RFA-07) • RFA-07: Determine optimal scalloping for analyzer inner hemisphere to minimize electron forward scattering which results in a low energy tail to the instrument response function • Simulations performed to evaluate different scalloping options None Round Tooth • Round scalloping on both hemispheres gives the best response, improving secondary electron suppression by a factor of 3. PFP IPDR 2010/6/14 - 16 26

SWEA Electrical Ellen Taylor June 15, 2010 PFP IPDR 2010/6/14 - 16 27

SWEA Electrical Block Diagram PFP IPDR 2010/6/14 - 16 CESR UCB 28

SWEA Electrical Requirements – MAVEN-PF-SWEA-002 SWEA Instrument Specification • Functional and Performance Requirements • Resource Allocations (board size, power budget) • Environmental Requirements (thermal, vibration, radiation) – MAVEN-PF-QA-002 C UCB Mission Assurance Implementation Plan • Parts Level • Burn-In • Derating – MAVEN-PF-SYS-003 C Power Converter Requirements • Power voltages, current, ripple, transients – MAVEN-SWEA-012 A FPGA Specification • • • PFDPU CLK/TLM/CMD Interface HV Enable (RAW and MCP) and DAC Control (Sweep and Fixed) Operational Heater Control Pre-amp Input, Test Pulser Output Housekeeping and Memory (external SRAM) I/F PFP IPDR 2010/6/14 - 16 29

SWEA Digital Board Interfaces • MAVEN-PF-SWEA-001 I CESR to SSL ICD – – – – • Preamp Pulse Characteristics Test Pulser Frequencies HV Enable and Converter Synch DAC Control Voltages Sweep Waveforms Analog Housekeeping Connector Pin-out MAVEN-PF-SYS-004 B PFDPU ICD – PFDPU Serial I/F description (CMD/CLK/DATA) – Power Interface (28 V/RTN) • MAVEN-PF-SYS-013 E Harness – Connector Pin-outs • MAVEN-PF-SYS-003 C Power Req. – Power I/F (voltages, current, characteristics) • MAV-RQ-09 -0015 Particle and Fields to Spacecraft ICD – Heater, Thermister and Cover Actuator Interface PFP IPDR 2010/6/14 - 16 30

Heritage and Design Similarities • MAVEN SWEA digital board has direct heritage from STEREO SWEA: – Minor interface changes (separate connector to SC for temp sensor, heater and actuator, external PFDPU connector) – Changed interface logic to 3. 3 V from 5 V (added translators 54 ACT 244 on FPGA outputs, UT 54 ACS 164245 SEI on pre-amp inputs to FPGA) – Minor FPGA part change (RT 54 SX 72 S from RT 54 SX 32 S) – Removed STE digital circuitry and interface – Removed latch-up circuitry – Minor part changes due to obsolescence, desire to have common parts buy and circuitry • MAVEN SWEA digital board is very similar to MAVEN SWIA and STATIC: – FPGA and SRAM same as SWIA, different than STATIC – Housekeeping (HK MUX and ADC parts) same – Fixed and Sweep DACs same minus offset DACs need for STATIC PFP IPDR 2010/6/14 - 16 31

Digital Board Design • • • Command/Data Interface to PFDPU Accumulate counts from each of the 16 anodes Bin data for transfer to PFDPU Enable HVPS and MCP high voltage Control voltage sweeps for analyzer inner hemisphere and deflectors Provide programmable threshold for anode pulse amplifiers SRAM for storing lookup tables and accumulators Generate test pulses Control ADC and MUX to read instrument housekeeping monitors Note: Digital board does not control heaters (S/C) or cover actuators (S/C) PFP IPDR 2010/6/14 - 16 32

FPGA Block Diagram PFP IPDR 2010/6/14 - 16 33

SWEA and SWIA FPGA Similarities • Commonalities – Both require anode counting frontends – Both implement Command & Telemetry Interfaces (CDI functionality for receiving commands and sending messages) – Housekeeping Control and Message Format – Memory Control – Fixed and Sweep DAC Control – Timing Backbone (reconfigured to accommodate the different accumulation intervals) – Lookup table memory and control (Loader and Checksummer) – High Voltage turn-on is a protected command – Overcurrent Protection (shown in SWEA block diagram) to be implemented identically in both FPGAs • Differences – – – SWIA: 24 Anodes (14 WFOV and 10 NFOV) SWEA: 16 Anodes SWIA: 4 second cycle with 2304 Accumulation Intervals SWEA: 2 second cycle with 488 Accumulation Intervals SWIA Implements Products SWEA Includes Operational Heater Control PFP IPDR 2010/6/14 - 16 34

Electronic Parts • SWEA Active Parts List from MAVEN-PF-QA-003 K Common Buy Parts • STATUS: – – In process of working parts list with GSFC Blue highlighted parts are commercial, no direct knowledge of heritage Replacement parts identified Space study complete, layouts started PFP IPDR 2010/6/14 - 16 35

SWEA Mechanical Paul Turin June 15, 2010 PFP IPDR 2010/6/14 - 16 36

SWEA Assembly CESR supplied detector and MCP assembly UCB supplied electronics and mounting interface PFP IPDR 2010/6/14 - 16 37

Stowed on S/C Caged to forward deck up to 20 kg balance mass PFP IPDR 2010/6/14 - 16 38

Deployed on S/C SWEA axis parallel to SC Z when deployed (balance mass not shown) FOV PFP IPDR 2010/6/14 - 16 39

SWEA Analyzer • Analyzer section very similar to STATIC and SWIA: • Concentric Hemispheres, Deflectors, one-shot Aperture Cover • Uses Ti. Ni Aerospace P 5403 SMA actuator for Cover release • Inner and outer grids covering aperture • T 0 purge • No attenuator PFP IPDR 2010/6/14 - 16 40

Pedestal Exploded View SWEA analyzer Purge port (fitting TBD) LVPS Pedestal housing Digital board Board mounted SC harness and enable connectors Cover HV enable plug PFP IPDR 2010/6/14 - 16 41

Baseplate Area possibly needed for solar absorber Mounting holes (4) Vent port (screened for EMC) HV Enable plug (green tag item) SC harness connector PFP IPDR 2010/6/14 - 16 42

Differences from STEREO SWEA • Modifications to STEREO SWEA analyzer – Deflectors moved slightly to improve response – 1 mm up, . 3 mm down. Resulting FOV blockage fix in process (trim a housing corner). – Exposed surface finishes will be changed to deal with thruster and deep-dip heating (more in thermal section). • Modification of STEREO SWEA pedestal design – STE instrument and supporting electronics removed -- only LVPS and digital board – ½ height, simpler mounting to boom at pedestal periphery – Simpler electrical and mechanical interfaces PFP IPDR 2010/6/14 - 16 43

Structural Analysis - Analyzer As discussed in the Systems presentation, the SWEA analyzer was designed for 30 g limit load and 14. 7 grms random qual level (MAVEN: 66 g and 23. 1 grms). Suitability of the design will be determined after the 1 st CLA results are in. Analysis results from STEREO: PFP IPDR 2010/6/14 - 16 44

Structural Analysis - Pedestal • Pedestal: • Worst-case margins for MAVEN MAC and Random loads: Lowest 1 st mode frequency = 198 Hz PFP IPDR 2010/6/14 - 16 45

SWEA to S/C MICD PFP IPDR 2010/6/14 - 16 46

SWEA to Pedestal MICD PFP IPDR 2010/6/14 - 16 47

SWEA Peer Review Actions A separate peer review was held Feb 3, 4 2010 in Toulouse, France. All actions are closed. PFP IPDR 2010/6/14 - 16 48

CESR Assembly, Integration, and Test Contents • AIT: CESR Team • Facilities • Main subcontractors • Documentation • Cleanliness & contamination issues • AIT flow chart PFP IPDR 2010/6/14 - 16 49

AIT Staff § Mechanics: J Rouzaud (G Peyre – Comat) § Integration, coatings, gluing, HV optocouplers : E Lecomte § Electronics, boards integration & tests: JJ Thocaven, P Rouger § Calibrations: A Fedorov, P Rouger, C Mazelle § Procedures, anomalies, QA: D Moirin (BTS) § Harnesses, boards assembling: Microtec § Environmental tests : P Rouger + Microtec PFP IPDR 2010/6/14 - 16 50

AIT Facilities § Class 1000 clean room for MCPs and detector assembly (CESR) § Class 10 000 clean room for electronics and mechanics assemblies (available early may 2010) (CESR) § Small clean room for electronics gluing and coating (CESR) § Vacuum chamber and particles beam in class 10 000 clean room (see A. Fedorov presentation) § Thermal chambers (-60°C to +120°C) – CESR § Class 10 000 clean rooms available in sub contractors premices (Comat, Microtec) § EMC test facility: in Microtec (sub contractor) PFP IPDR 2010/6/14 - 16 51

AIT Main Sub-Contractors § COMAT Aerospace Mech. Fabrication & integration Tools for assembly Assembly docs (procedures, as_built , control reports, QA, …) same as for STEREO same staff as for STEREO § CORIMA (Loriol-FR) Entrance grids fab & gold treatment same as for STEREO § Collini & Fluhmann(Swi) Black copper same as for STEREO § SWIPELEC (Bordeaux-FR) MCP grids same as for STEREO § HIREX (Toulouse) EEE parts screening EEE parts procurement same as for STEREO (Tecnologica group) § CIRETEC (Toulouse) PCB fabrication CNES/ ESA qualified § MICROTEC (Toulouse) Parts & PCB welding, Harnesses same as for STEREO § Mecano-ID (Toulouse) Environmental tests (Toulouse) PFP IPDR 2010/6/14 - 16 52

AIT Documentation § As built lists (materials, EEE parts, processes) § As built assembling procedures § Environmental testing reports (if any) § Log book § Non conformity reports with appropriates corrective actions § Photographic documentation of FM hardware § Analysis reports (mechanical, electrical, …) § Tests reports PFP IPDR 2010/6/14 - 16 53

Cleanliness and Contamination Issues (1) § Microchannel plate cleanliness requirements (same as for STEREO) • Sensitivity to humidity, dust & hydrocarbons • Discharge created by 100 microns particles can damage MCPs • Outgassing near MCP to be avoided • Special procedure to clean MCPs and restore properties § Permanent purging system installed on SWEA with dry nitrogen at 5 liters/ hour • Plastic hermetic container filled with dry nitrogen acceptable for transportation (couple of hours) • few hours without purge flow is possble in clean room environment • MCPs or sensor equiped with MCPs is stored in vacuum at CESR § Hermetic red tag cover on SWEA analyser can be removed only in a class 1000 clean room and has to be kept on SWEA analyser during I&T PFP IPDR 2010/6/14 - 16 54

Cleanliness and Contamination Issues (2) § All mechanical parts are cleaned with alcohol § All assembled parts are stored in vacuum chamber in CESR clean room § Integration in clean rooms • Class 1000 CESR clean room for MCPs and analyser • Class 10000 CESR clean room for electronic boards • In subcontractors clean rooms (Comat or Microtec) § Unit bakeout for outgassing before first calibration tests § SWEA analyser stored in vacuum before calibration or before delivery to UCB § Bakeout of full SWEA instrument at UCB PFP IPDR 2010/6/14 - 16 55

SWEA – MAVEN Prototype AIT Note: STEREO-SWEA Engineering model analyser will be re-furbished according to STEREO to MAVEN changes and modifications indications will be given to SSL (date TBD) in parallel with AIT activities PFP IPDR 2010/6/14 - 16 56

SWEA Calibration Plan Andrei Federov June 15, 2010 PFP IPDR 2010/6/14 - 16 57

New CESR Electron Gun: Schematic The goal: To create a wide uniform e- beam as close to the sensor as possible. The total current of the beam and its cross-section distribution should be measured. PFP IPDR 2010/6/14 - 16 58

New CESR Electron Gun: External Hamamatsu Xenon lamp on the movable support Fused silica window PFP IPDR 2010/6/14 - 16 59

New CESR Electron Gun: Internal Palladium photocathode and an acceleration system: 1. Energy up to 10 ke. V 2. Strictly parallel e- beam 3. No disturbed e- trajectories at the beam perifery PFP IPDR 2010/6/14 - 16 60

New CESR Electron Gun: Internal The photocathode at the end of the light tube. The beam current monitor. The beam monitor on the YZ axis stage. 1. Beam cross-section 2. Beam parallelism 3. Beam energy distribution PFP IPDR 2010/6/14 - 16 61

Beam Cross Section Flux distribution for close lamp position. 20% of variation within 40 mm circle. We know the absolute beam for each sensor position PFP IPDR 2010/6/14 - 16 62

Sensor Positioning Y: 0. 1 mm Elevation (Thet) : +/- 90 deg, 0. 1 deg Azimuth (Phi) : +/- 170 deg, 0. 1 deg PFP IPDR 2010/6/14 - 16 63

Calibration Control PFP IPDR 2010/6/14 - 16 64

Calibration Plan Simulated (left) and measured (right) Elevation-K response For D = 0 Simulated (left) and measured (right) Elevation-K response For D = -0. 59 K = E/Uan D = Udef/E Elevation, deg (mechanical) Virtual Elevation Azimuth, deg PFP IPDR 2010/6/14 - 16 65

Elevation-D profile 1. Define D – Elevation profile 2. For Az = const, for Elevations (step = 3 deg) : K-D response 3. Calculate d. GF/d. Az for this point (each anode) PFP IPDR 2010/6/14 - 16 66

GF Azimuth Profile Repeat the same for all Az (step = 2 deg) and all anodes PFP IPDR 2010/6/14 - 16 67

RFA Summary RFA # Title Assigned To Originated Closed SWEA-01 Deflector Surface Treatment Turin 2/4/2010 3/22/2010 SWEA-01 a Deflector Surface Treatment Jedrich 2/4/2010 5/22/2010 SWEA-02 Grid Heating Turin 2/4/2010 3/15/2010 SWEA-03 Exposed Surface Heating Turin 2/4/2010 3/22/2010 SWEA-04 Aluminum Deflectors Rouzaud 2/4/2010 5/25/2010 SWEA-05 Deflector Shape Federov 2/4/2010 5/25/2010 SWEA-06 Actuator Connector Pins Curtis 2/4/2010 2/8/2010 SWEA-07 Inner Hemisphere Scalloping Federov 2/4//2010 3/9/2010 SWEA-08 Reduce Geometric Factor Mitchell 2/4/2010 SWEA-09 SWEA MICD Turin 2/4/2010 4/21/2010 SWEA-10 Planetary Protection Jedrich 2/4/2010 5/20/2010 SWEA-11 CESR Documents Thocaven 2/4/2010 3/3/2010 SWEA-12 Purge Gas Quality Thocaven 2/4/2010 2/12/2010 SWEA-13 Thruster Heating Habenicht 2/4/2010 2/23/2010 SWEA-14 QA Thocaven 2/4/2010 3/5/2010 SWEA-15 Thermal Engineer Jedrich 2/4/2010 3/17/2010 SWEA-16 Cover Design Rouzaud 2/4/2010 5/25/2010 SWEA-17 Schedule Meilhan 2/4/2010 4/28/2010 SWEA-18 EEE Parts List Thocaven 2/4/2010 4/14/2010 SWEA-19 CESR MAIP Thocaven 2/4/2010 3/3/2010 SWEA-20 Energy Sweep Mitchell 2/4/2010 3/8/2010 PFP IPDR 2010/6/14 - 16 MAVEN_PF_MGT_004 E_SWEAPeer. Review. Actions 68

SWEA Status • CNES contract: to deliver same instrument as for STEREO (limited funding and manpower). • Heritage from STEREO in-flight data. Better understanding of the instrument. Minor h/w modifications implemented on MAVEN SWEA. • Minor changes only deal with: - deflector positions to flatten response vs. deflection potential - improved scalloping on detector spheres - different surface coatings to improve low energy response - interfaces discussed with SSL at Instrument Peer Review (Feb. 3, CESR). - improve reliability (higher screening than for STEREO for key electronic parts). PFP IPDR 2010/6/14 - 16 69

CESR Work Progress and Schedule • Activities implying long time deliveries have been initiated. • Mechanical parts are being fabricated by same contractor as for STEREO/SWEA. Still some missing parts due to modifications (deflectors, spheres, grids). • PCBs have been delivered by ESA-qualified manufacturer. • Most of electronic parts have already been delivered. • Detectors (MCPs) delivered April 2010. Stored in vacuum chamber after inspection. • FM Mechanical Integration during Fall 2010 • FM Test and Calibration during Spring 2011 • FM Delivery to UCB mid-2011 (due at SSL by 12/8/2011) PFP IPDR 2010/6/14 - 16 70

Testing & Calibration at UCB-SSL • Same calibration facilities as for SWIA and STATIC • Verify instrument performance based on CESR testing and calibration • End-to-End Testing: analyzer, front-end and digital electronics, data products • Environmental Testing: EMC, Magnetics, Vibration, TVac PFP IPDR 2010/6/14 - 16 71

SWEA Schedule • Digital EM Layout/Fab/Testing Complete 9/28 • LVPC EM Layout/Fab/Testing Complete 9/28 • EM Electronics Housing Fab/Assemble 7/19 -9/20 • EM Analyzer Refurbish/Test 6/14 -8/27 • EM Harness Fab 7/19 • EM I&T 9/29 -12/2 • EM Delivery to PFDPU I&T 12/2/10 • FM 6/15/11 -7/19/12 PFP IPDR 2010/6/14 - 16 72