Metal Nanoparticle Hydrogen Sensor Igor Pavlovsky Applied Nanotech

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Metal Nanoparticle Hydrogen Sensor Igor Pavlovsky, Applied Nanotech, Inc.

Metal Nanoparticle Hydrogen Sensor Igor Pavlovsky, Applied Nanotech, Inc.

Outline § Review of Pd-based sensor technologies § ANI approach: Pd nanoparticles § Why

Outline § Review of Pd-based sensor technologies § ANI approach: Pd nanoparticles § Why NANO? § Performance of ANI sensors § Applications and prospects

Proposed Technologies • • Pd thin film resistor FET with Pd gate Pd-coated quartz

Proposed Technologies • • Pd thin film resistor FET with Pd gate Pd-coated quartz microbalance Pd mesowires Optical methods Catalytic combustion Pd nanoparticle network

Problems with Pd-based approach • • • Pd delamination at high H 2 concentration

Problems with Pd-based approach • • • Pd delamination at high H 2 concentration due to phase transition in Pd Limited temperature range (-30 to 50 o. C) Low sensitivity in the ppm range Poisoning (esp. catalytic sensors) Repeatability and consistency Cost (manufacturing + testing + QC)

Other technologies • “Physical” sensors (thermal conductivity etc) – Poor sensitivity at low H

Other technologies • “Physical” sensors (thermal conductivity etc) – Poor sensitivity at low H 2 concentrations – Non-selective to hydrogen • Metal oxide sensors – Require heating, cross-sensitive to reducing gases (e. g. hydrocarbons, CO) • Gas chromatography – Expensive, high power consumption, large size • Electrochemical – Limited temperature range, lower sensitivity to H 2 and higher cross-sensitivity to H 2 O

ANI approach: Pd nanoparticles H 2 Pressure Smaller Pd nanoparticles make a difference: Subsurface

ANI approach: Pd nanoparticles H 2 Pressure Smaller Pd nanoparticles make a difference: Subsurface Pd-H sites form prior to bulk phase change - Lower detection limit - Smooth phase transition - Wide dynamic range bulk nano H/Pd ratio Principle of sensor operation: decrease in resistance as Pd nanoparticles change phase (Pd + H 2 → Pd + 2 H → Pd. Hx)

Sensor Processing Diagram Glass substrate cleaning Metal film deposition Contact pads deposition Wafer dicing

Sensor Processing Diagram Glass substrate cleaning Metal film deposition Contact pads deposition Wafer dicing Testing Conditioning Electroplating Quality Control Packaging Chip dicing Sensor Patterning Photograph of a 100 -sensor pattern on a glass wafer

Pd alloy sensor design Working Reference SEM Sensor outline

Pd alloy sensor design Working Reference SEM Sensor outline

Response of sensor to hydrogen

Response of sensor to hydrogen

Response of sensor to hydrogen

Response of sensor to hydrogen

Specifications • • • Operating temperature: Storage temperature: Typical resistance: Sensor Power: System Power

Specifications • • • Operating temperature: Storage temperature: Typical resistance: Sensor Power: System Power (w/TEC): Operation Range: Lowest detection limit: Response Time (t 90): Accuracy: Repeatability: -30°C to 120°C -60°C to 80°C 1. 5 kΩ 2 m. W ~1 W 10 ppm – 10, 000 ppm 10 ppm 4 sec at 1% H 2 ± 20% of H 2 reading

Range of applications Flammability and explosive levels for mixtures of H 2 with air

Range of applications Flammability and explosive levels for mixtures of H 2 with air 4% 17% ▲LFL 0 1 56% ▲LEL 75% ▲UEL 10 100 ppm ▲UFL 1000 1% 4% Sensitivity range for H 2 ANI sensor • Fuel cells • H 2 production facilities • H 2 storage tanks • Reformers • H 2 leak detectors • Power transformers

H 2 Monitoring in Transformer Oil Oleophobic membrane Sensor response to different H 2

H 2 Monitoring in Transformer Oil Oleophobic membrane Sensor response to different H 2 concentrations in transformer oil (top left) Sensor package for use in liquids (top right)

Features of ANI H 2 sensor – Easy to manufacture – Wide range of

Features of ANI H 2 sensor – Easy to manufacture – Wide range of sensitivity – Good repeatability – Low cost in volume – Membrane/mesh – TO 8/TO 5 header – Hermetic package – Easy integration

Future development • • • Miniaturization Built-in temperature sensor Built-in calibration chip Application-specific design

Future development • • • Miniaturization Built-in temperature sensor Built-in calibration chip Application-specific design Functional membranes