Powering for Future Detectors DCDC Conversion for the

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Powering for Future Detectors: DC-DC Conversion for the CMS Tracker Upgrade Katja Klein with

Powering for Future Detectors: DC-DC Conversion for the CMS Tracker Upgrade Katja Klein with L. Feld, W. Karpinski, J. Merz, O. Scheibling, J. Sammet, M. Wlochal 1. Physik. Institut B, RWTH Aachen University Vertex 2011, Rust, Austria June 23 rd, 2011

Tracker Power Distribution CMS strip tracker end cap CMS strip tracker ready for installation

Tracker Power Distribution CMS strip tracker end cap CMS strip tracker ready for installation • Trackers need kilowatts of power: e. g. CMS strips ~ 33 k. W power consumption will increase for SLHC: higher granularity, more functionality • Due to long (50 m) cables, power losses are (already today) similar to detector power • Routing of services complex and nested, cable channels full and total current limited • Cabling inside tracker volume adds to material budget Novel powering schemes need to be exploited Katja Klein Powering for Future Detectors 2

Powering Schemes Serial Powering and s l e x i p ATLAS grades? up

Powering Schemes Serial Powering and s l e x i p ATLAS grades? up strips DC-DC conversion nd ixels a p S A - ATL ades? r g p u strips AL upgrade HC - CMS xel & strips pi - CMS de upgra Vdrop = R I 0 Pdrop = R I 02 P = U I = (r U) (I/r) r = conversion ratio • Powered from constant current source • Shunt regulator and transistor to take excess current and stabilize voltage + Number of modules in chain can be large + Adds very little extra material - No solid system ground biasing, AC-coupled communication etc. - Inefficient if different current consumptions (e. g. end caps) Katja Klein Pdrop = R (I/r)2 • Need radiation-hard magnetic field tolerant DC-DC converter + Standard grounding, biasing, control & communication scheme + Fine for very different current consumption - Conversion ratio limited by technology and efficiency - Switching devices switching noise - Output current per converter limited Powering for Future Detectors 3

The CMS Tracker Upgrade As a result of a review process, the CMS tracker

The CMS Tracker Upgrade As a result of a review process, the CMS tracker has chosen DC-DC conversion as baseline solution, and maintains Serial Powering as back-up (January 2009). Around 2016: Exchange of the CMS pixel detector • Similar to todays detector, but less material, reduced data losses, CO 2 cooling • 3 Barrel layers 4 barrel layers; 2 disks 3 disks Number of readout chips (ROCs) increases by factor 1. 9 Unacceptable power losses in cable trays DC-DC buck converters with conversion ratio of 3 -4 (Semi-conductor technology limits input voltage to < 12 V, and Vout = 2. 5 and 3. 3 V) Around 2022: Exchange of the whole CMS tracker • Higher granularity more readout channels • Tracker is supposed to contribute to Level 1 trigger higher power consumption DC-DC converters with conversion ratio of 8 -10 Katja Klein Powering for Future Detectors 4

DC-DC Buck Converters DC-DC converters can be based on many different principles and layouts

DC-DC Buck Converters DC-DC converters can be based on many different principles and layouts concentrate here on so-called buck converters T 1 open T 1 closed, open, T 2 T 2 closed Duty cycle D = t 1, on/T; 1/D = Iout/Iin = Vin/Vout = r Why buck converters? • High currents with high efficiency • Comparably simple & compact • Output voltage regulation by Pulse Width Modulation (not shown) Challenges • Radiation tolerance of high voltage (15 V) power transistors • Switching with MHz frequencies “switching noise“ through cables (conductive) • Saturation of inductor ferrite cores in magnetic field air-core inductor radiated noise emissions • Maximization of efficiency & minimization of material and size Katja Klein Powering for Future Detectors 5

Buck Converter ASICs • ASIC includes transistors and voltage regulation circuit • ASIC is

Buck Converter ASICs • ASIC includes transistors and voltage regulation circuit • ASIC is being developed within CERN electronics group (F. Faccio et al. ) • Radiation tolerance of many semi-conductor technologies evaluated AMIS I 3 T 80 0. 35µm (ON Semiconductor, US) - functional up to dose of 300 Mrad & fluence of 5 1015 p/cm 2 - no Single Event Burnout effect • AMIS prototypes: AMIS 1 (2008) AMIS 2 (2009) AMIS 3 (problems) AMIS 4 with full functionality (submitted in January 11) • Work with second supplier (IHP, Germany) to improve radiation tolerance - two prototypes in 2010, but ASIC development on-hold due to issues SEB = Single Event Burnout = ionizing particle in source turns parasitic npn transistor on destructive current Katja Klein Powering for Future Detectors 6

Aachen DC-DC Converter Development “PIX_V 7“: ASIC: AMIS 2 by CERN Iout < 3

Aachen DC-DC Converter Development “PIX_V 7“: ASIC: AMIS 2 by CERN Iout < 3 A Vin < 12 V fs configurable, e. g. 1. 3 MHz PCB: 2 copper layers a 35µm 0. 3 mm thick Large ground area on bottom for cooling Toroidal inductor: L = 450 n. H RDC = 40 m Plastic core Pi-filters at in- and output A = 28 x 16 mm 2 M 2. 5 g 3. 8% of a radiation length Katja Klein Shield Design guidelines from CERN group have been implemented. Powering for Future Detectors 7

The Shield The shield has three functions: 1) to shield radiated emissions from inductor

The Shield The shield has three functions: 1) to shield radiated emissions from inductor 2) to reduce conducted noise by means of segregation between noisy and quiet parts of board (less coupling) 3) to provide cooling contact for coil through its solder connection to PCB, since cooling through contact wires not sufficient Several technologies are under evaluation: • Aluminium shields of 90µm thickness (milled in our Workshop) • Plastic shields (PEEK) coated with a metall layer e. g. galvanic deposition of copper (30µm – 60µm) Shape driven by geometrical constraints Katja Klein Powering for Future Detectors 8

Efficiency (R 4) vs. inductor DC resistance Vin = 10 V Vout = 3.

Efficiency (R 4) vs. inductor DC resistance Vin = 10 V Vout = 3. 3 V 79 77 75 Iout = 3 A 73 Iout = 1 A 71 69 67 0 20 40 60 80 Efficiency [%] • Efficiency = Pout / Pin • Resistive losses from - chip (Ron of transistors) - wire bonds - inductor • Resistive losses ~ 1/fs; switching & driving losses ~ fs • Need to balance efficiency vs. mass, volume & EMC 0. 0 100 0. 5 1. 0 1. 5 2. 0 2. 5 3. 0 Frequency [MHz] RDC [m. Ohm] Katja Klein AMIS 2_V 2 Vin=10 V, Vout=1. 2 V, Iout=1 A 70 68 66 64 62 60 58 56 54 52 50 Powering for Future Detectors 9

Efficiency PIX_V 7, Vout = 3. 3 V Efficiency [%] PIX_V 4_R 3, Vout

Efficiency PIX_V 7, Vout = 3. 3 V Efficiency [%] PIX_V 4_R 3, Vout = 1. 25 V Efficiency [%] [White regions: regulation not working properly, Vout too low] • Phase 1 conditions: Vout = 3. 3 V or 2. 5 V, Iout < 2. 8 A, conversion ratio of 3 -4 75% - 80% efficiency: ok • Phase 2 conditions: Vout = 1. 25 V, Iout = 3 A, conversion ratio of 8 -10 about 55% efficiency: too low Possible solution: combine with a on-chip “switched capacitor“ converter with r = 2 Katja Klein Powering for Future Detectors 10

Conductive Noise through cables (conductive noise) was studied with EMC set-up EMC = electromagnetic

Conductive Noise through cables (conductive noise) was studied with EMC set-up EMC = electromagnetic compatibility Load GND LISN = Line Impedance Stabilization Network Spectrum Analyzer Differential Mode (DM), “ripple“ Katja Klein Common Mode (CM) Powering for Future Detectors 11

Conductive Noise Differential Mode, no shield Common Mode, no shield PIX_V 7 output noise

Conductive Noise Differential Mode, no shield Common Mode, no shield PIX_V 7 output noise Vout = 3. 3 V Vin = 10 V fs = 1. 3 MHz L = 450 n. H Differential Mode, with shield Common Mode, with shield Large reduction of CM above 2 MHz due to shield Katja Klein Powering for Future Detectors 12

Radiated Noise Emissions • Large fast changing currents through inductor magn. near field can

Radiated Noise Emissions • Large fast changing currents through inductor magn. near field can induce noise • Field of air-core toroid has been measured and inductor shape optimized z y x Emitted field is measured with a pick-up probe and spectrum analyzer [height of 1. peak] Scanning table Bz measured in x-y-plane, 1. 5 mm above coil: Bx. Solenoid 538 n. H, 90 m , 500 mg Katja Klein Bz. Optimized By Large toroid 618 n. H, 104 m , 783 mg Powering for Future Detectors 450 n. H, 40 m , 650 mg 13

Shielding from Radiated Noise Shielding of magnetic field: Eddy currents in metallic shield •

Shielding from Radiated Noise Shielding of magnetic field: Eddy currents in metallic shield • 90µm milled Aluminium shield works fine • Plastic shield coated with 30µm Cu worse and adds ~ 40% more material (but probably cheaper) No shield Katja Klein 90µm Alu Powering for Future Detectors 30µm Cu 14

Integration into Phase-1 Pixel Detector Integration for pixel barrel onto supply tube ü Pseudorapidity

Integration into Phase-1 Pixel Detector Integration for pixel barrel onto supply tube ü Pseudorapidity ~ 4 ü Large distance of converters to pixel modules (note: goal is to be able to power detector, NOT to reduce material) ü Sufficient space available ü CO 2 cooling available d 2 000 DC-DC converters required in 2014 DC-DC converters m 2. 2 Katja Klein Powering for Future Detectors 15

Integration into Phase-1 Pixel Detector CAEN A 4603 Vana PSU Vin 12 V DC-DC

Integration into Phase-1 Pixel Detector CAEN A 4603 Vana PSU Vin 12 V DC-DC ana Vout = 2. 5 V 1 - 4 pixel modules per converter 50 m 6 - 7 converters Vdig PSU Vout = 3. 3 V DC-DC dig 1 - 4 pixel modules per converter 6 - 7 converters • I < 2. 8 A per converter (for L = 2 x 1034 cm-2 s-1) • Power supplies need modification • No remote sensing Katja Klein Novel Powering Schemes for the CMS Tracker Upgrade 16

Integration into Phase-1 Pixel Detector • 26 DC-DC converters per channel • Power dissipation

Integration into Phase-1 Pixel Detector • 26 DC-DC converters per channel • Power dissipation ~ 50 W per channel • Cooling bridges clamp around CO 2 pipes • Chip cooled through PCB backside • Shield (soldered to PCB) acts as cooling contact for inductor Katja Klein Powering for Future Detectors 17

Temperature [°C] Thermal Measurements PIX_V 7, 450 n. H, 1. 3 MHz Vin =

Temperature [°C] Thermal Measurements PIX_V 7, 450 n. H, 1. 3 MHz Vin = 10 V, Vout = 3. 3 V Coil without cooling Chip without cooling Coil with cooling, no shield Chips with cooling, no shield ■ Shield temperature Output current [A] • Measurements with Flir infrared camera • Peltier element set to +20°C Iout = 2. 5 A Cooling of chips via backside of PCB is very effective Coil needs to be connected to cooling contact (shield) Good agreement with Finite Element simulations Katja Klein Powering for Future Detectors 18

System Tests with Pixel Modules The effect of buck converters on the noise of

System Tests with Pixel Modules The effect of buck converters on the noise of todays pixel modules has been studied: Module adapter Connector board DAQ PC PC interface „Advanced Test Board“ Load-Box HV Pixel PS (CAEN) VA VD DC-DC converters multi-service cables (40 m) DC-DC converter on bus board Katja Klein I(t) Pixel module Powering for Future Detectors 19

System Tests with Pixel Modules Noise of all pixels of one module Mean noise

System Tests with Pixel Modules Noise of all pixels of one module Mean noise [e] • Threshold scan: efficiency for internal calibration pulse vs its amplitude • Fit “s-curve“ with error function width corresponds to noise 130 128 126 124 122 120 0. 0 1. 0 2. 0 3. 0 4. 0 Switching frequency Change in noise due to DC-DC converter is below 1% Noise is flat over considered switching frequency range (1 -3 MHz) Katja Klein Powering for Future Detectors 20

Orbit Gaps • Sparsified readout digital power consumption depends on particle fluence • LHC

Orbit Gaps • Sparsified readout digital power consumption depends on particle fluence • LHC bunches are not equally distributed: 3µs “abort gap“every 89µs is not filled • Digital current per converter drops within ~ 50 ns from 2. 7 A to 1. 0 A (2 1034 cm-2 s-1) stability of power supply chain for large load variations to be checked Result: Sensitivity to load changes with DC-DC converters much reduced No DC-DC Katja Klein With DC-DC Powering for Future Detectors 21

Summary • Novel powering schemes have to be exploited for the LHC upgrades •

Summary • Novel powering schemes have to be exploited for the LHC upgrades • CMS tracker has opted for a DC-DC conversion powering scheme • Prototypes with sufficient efficiency and low noise in hands • Next big step: AMIS 4 ASIC (expected in summer) • Many more things to be done: - More realistic system tests - Controls - Mass reduction for phase-2 (e. g. aluminium coil) - Establish efficient scheme for larger conversion ratios (e. g. 2 stages) Katja Klein Powering for Future Detectors 22