Activity of highrate detector consortium status of detector

Activity of high-rate detector consortium & status of detector developments Masaki Sasano RNC On behalf of the consortium

What should be discussed… Idea Technology Consortiu m Local RIBF researcher users s at RIBF Detector team Death valley: • Matching needs • Marketing research • Building management (operational) framework …. Big. RIPS team Scientific knowledge Scientific societal benefit Implementation & operation Need to minimize Human resource, budget, time for setup operation maintenance

Goal (Matching needs) To achieve: a total intensity ~ 3 - 5 x 100 k Hz (after F 7) (at present, Big. RIPS can accept 30 – 50 k. Hz, Z>=50) • Clear PID for nuclei for Z=50 or heavier • Standard setup

How to define “high rate”? Rate available for users on reaction target • ~ 3 - 5 x 100 k Hz (after F 7) or higher In the upstream, the beam rate can be higher: • F 3 > F 5 > F 7 (“>” can be a factor of 10— 100 or higher, depending on RI) • In focusing points, F 3 and F 7, the beam spot size is small, so the rate capability must be considered taking into account how the detector is segmented. Undetected light particles also matter: • Tritons (when one studies neutron rich side around or over A/Z=3) • F 3 > F 5 > F 7 How many days can work continuously? “ • For example, in the recently done 132 Sn experiment at ZDS with 4050 kpps in total after F 7; • F 3 PPAC 1 day • F 8/9/11 2 days replacement

Member list (2014/1/19) • Daiki Nishimura, Tokyo University of Science IC • Nigel （LP CAEN） → TDC/QDC (within some limit, dead time free) • Hidetada Baba, RNC, →DAQ, Flash ADC, FPGA • Emmanuel Pollacco • Meiko Kurokawa, RNC →ASIC, Si detectors, … → Detectors, Electronics, ASIC chips, GET… • Toshio Kobayashi, Tohoku Univ. • Alexandre Obertelli, CEA Saclay →MWDC, 1 -mm MWPC, CRDC, • Tuomas Grahn, University of Jyväskylä • Hideaki Otsu, RNC →MWDC, MWPC, IC, • Megumi Niikura, University of Tokyo • Yohei Matsuda, Kohnan Univ. →detectors • Masaki Sasano, RNC chair, IC • Shinsuke Ota, CNS, Univ. of Tokyo MWDCs, … • Yohsuke Kondo, TITECH • Juzo Zenihiro, RNC →indirect method for charge • Nori Aoi, RCNP Osaka University determination • Nobuaki Imai, CNS, Univ. of Tokyo • Kimiko Sekiguchi, Tohoku Univ. • Naoki Fukuda, RNC • P. Rykaczewski (ORNL) →Flash ADC based DAQ • Kwongbok Lee, Kwon Young Kwan, Moon • Stephanos Paschalis (Darmstadt) Jun. Young, Institute for Basic Science, Korea • Zoltan Elekes (ATOMKI)

Materials to be developed Detectors TOF: Plastic scintillator Diamond detector Charge (Z): Position: Plastic scintillator MWDC Ion chamber MWPC Silicon detector CRDC Indirect method… PPAC Fiber scinti. Si strips Auxiliary systems Micro Pattern Electronics: Vacuum: DAQ: ASIC chips Feedthrough Trigger rate Cooling of ASIC chips Time stamping Cabling Light tightness Flash ADC

Other important things to be discussed Manpower: Development Maintenance Operation Taking over skills… Radiation: Safety STQ heat load Hang up of control systems Initial investment: Running cost: Cost for development Detector material replacement Standardization • Plastic, gas, … Test beam time…

Status of detector development by the consortium members

TOF detectors Advantage Plastic scintillator Diamond detector Cheap, Easy setup Uniformity? ? ? Can be thin Radiation hardicity Disadvantage Deterioration (especially for higher Z) PMT read out (instability) Expensive, Fabrication (plating, bonding…) Small size (at present, 30 x 30 mm) Non-uniformity? ? ? Too thick for high Z?

TOF detectors Advantage Plastic scintillator Diamond detector Cheap, Easy setup Uniformity? ? ? Can be thin Radiation hardicity Disadvantage Deterioration (especially for higher Z) PMT read out (instability) Expensive, Fabrication (plating, bonding…) Small size (at present, 30 x 30 mm) Non-uniformity? ? ? Too thick for high Z? Yuki Sato-san, Michimasa-san

Michimasa-san’s work

Position detectors 1 -mm pitch MWDC MWPC Advant > 105 Hz age per wire Easy data handling Disadv antage (or issues) 105 Hz per wire achievable position resolution Can be large size CRDC PPAC Low-z Easy cabling detection Easy data Easy cabling handling Strong for rad. damage TPC Only gas material in beam line Small size Skill, man Charge Inefficiency for Long drift (32 x 32 mm 2 power readout low-z detection time (needs ) Complicated (weak for Rad. damage to cover a Skill, cabling … noises) long range manpower of TDC) Complicate d cabling … 1 -mm pitch MWPC@F 3 & CRDC @ other focal planes w/ electronics in vacuum (lower power ASD + FPGA), water cooling?

Position detectors 1 -mm pitch MWDC MWPC Advant > 105 Hz age per wire Easy data handling Disadv antage (or issues) 105 Hz per wire achievable position resolution Can be large size CRDC PPAC Low-z Easy cabling detection Easy data Easy cabling handling Strong for rad. damage TPC Only gas material in beam line Small size Skill, man Charge Inefficiency for Long drift (32 x 32 mm 2 power readout low-z detection time (needs ) Complicated (weak for Rad. damage to cover a Skill, cabling … noises) long range manpower of TDC) Complicate d cabling … 1 -mm pitch MWPC@F 3 & CRDC @ other focal planes w/ electronics in vacuum (lower power ASD + FPGA), water cooling?

Kobayashi-san’s work

Position detectors 1 -mm pitch MWDC MWPC CRDC PPAC TPC Advant > 105 Hz age per wire Easy data handling 105 Hz per wire achievable position resolution Can be large size Low-z Easy cabling detection Easy data Easy cabling handling Strong for rad. damage Only gas material in beam line Disadv antage (or issues) Skill, man power Complicated cabling … Charge readout (weak for noises) Long drift time (needs to cover a long range of TDC) Small size (32 x 32 mm 2 ) Skill, manpower Complicate d cabling … Inefficiency for low-z detection Rad. damage

Tuomas-san work

Pollacco-san and Sako-san work

Z detectors Plastic scintillator Ion chamber Silicon strip detectors Indirect method Advant Relatively easy Radiation age setup hardicity Uniformity Relatively easy operation Good Z resolution No radiation and high rate if damage highly segmented No limitation? ? ? Disadv antage (or issues) Expensive Proof of Fabrication principle… Radiation damage Combining several detectors Low resolution with small energy loss Radiation damage Some noise comes from the upstream of F 7? ? ? Pileup

Daiki Nishimura-san’s work

Materials to be developed Auxiliary systems DAQ: Electronics: Trigger rate ASIC chips Time stamping Cabling Flash ADC Vacuum: Feedthrough Cooling of ASIC chips Light tightness

Kurokawa-san and Ota-san’s work on feedthrough

Summary • In near future, a “high intensity” (total intensity of ~ 3 - 5 x 100 k Hz after F 7) must be achieved. • Developments are ongoing among the consortium and they can be merged into a standard setup at RIBF. • Need to minimize human resource, budget, time need for setup, operation, and time must be considered. • Some people are already working on very “high intensity” (~> MHz). • Auxiliary system is very important. Feedthrough is a good example.