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Ne. SSI Generation II Systems Sensor Bus Hunting Rick Ales, Bill Menz and Dave Simko Swagelok Company IFPACSM 2004 Arlington, Virginia January 12 -15, 2003
New Sampling/Sensor Initiative What is Ne. SSI Generation II? - A logical expansion of miniature modular technology - Adds intelligent devices to the system - Defines the need for an open architecture protocol that will allow the smart devices to communicate with each other - Intrinsic safety is an important issue - “Generation” is a misnomer, implying that it replaces what was before
Discussion Points 1. Update on the Device. Net/ODVA effort 2. Stakeholders meeting with ODVA 3. Workshop at NIST headquarters - Sensor bus issues - Microanalytical devices 4. IEEE 1451. 6 Study Group 5. A Profibus/Fieldbus/HART option 6. Device. Net revisited
The Device. Net/ODVA Effort • Develop an intrinsically safe version of Device. Net • Defined a suitable approach with ODVA - Establish an SIG made up of vendors - Possibly add an advisory group made up of end users • Established a rough cost estimate • Execute stakeholders meetings - July 29 at Rockwell in Cleveland - July 30 at NIST headquarters in Gaithersburg
Stakeholders Meeting with ODVA Summary - 19 attendees, all day meeting - Briefed on Ne. SSI, I, II, ODVA, and basics of Device. Net - Open discussion of intrinsic safety - Technical panel discussion, followed by Q&A on IS and Device. Net - Prepared a “go forward” plan with ODVA - Complete minutes on CPAC web, Ne. SSI
Workshop at NIST Summary - 21 attendees, all day meeting - Briefed on Ne. SSI, I, II, and the need for an IS sensor bus - IEEE 1451 presented – Kang Lee, NIST, MEL - CAN Open and CAN in Automation (Ci. A) presented - Microanaytics Workshop – microreactors, microsensors, microfluidics - Complete minutes on CPAC web, Ne. SSI
A Fieldbus/Profibus/HART Option Head-mounted Temperature Transmitters Profibus PA Foundation Fieldbus HART courtesy ABB • Small Diameter, typically 1 -3/4” – 2 -1/4”, close to the 1 -1/2” ANSI/ISA 76. 00. 02 requirement • Intrinsically safe • Softing AG supplies the chipsets for many manufacturers of these devices • Softing feels they can miniaturize the electronics for smart Ne. SSI components
Open, multi-vendor infrastructure. Multivariable, configurable, self diagnostics, plug-n-play Temperature Range 125℃ Miniature 5” x 1⅟₂” diameter Intrinsically Safe Class 1 Div 1 Protocol Simplicity Process Industry acceptance Cost Fo Fie unda ldb tion us Pr ofi bu s n pe NO CA De vic e. N e t 1 14 5 E IEE -4 85 RS Digital Network
Show Stoppers RS-485 • No standard multi-vendor device definition or profiles. • Requires device specific programming. Profibus & Foundation Fieldbus • Controller chips do not meet temperature requirement. • Multi-chip solution, not likely to meet size constraints. • Cost per node is 3 x to 5 x as high as a CAN based device.
Challenges Device. Net & CAN Open • Develop IS specification and products by either: ü Convince vendors there is sufficient market opportunity for them to commit resources, or… ü Provide funding to finance IS project. • Promote industry acceptance of “yet another bus. ” IEEE-1451 • Nomimal vendor base. • Promote acceptance of “yet another bus. ”
Status of the Hunt Device. Net & ODVA • ODVA has proposed an intrinsically safe Device. Net initiative “Go Forward Plan. ” CAN Open, Ci. A and IEEE • An industry study group will propose a CAN Open and IEEE 1451 device profile harmonization standard that includes an intrinsically safe CAN option. All we need are the project resources!
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