Status of ASD Production and Packaging Vidyo meeting

Status of ASD Production and Packaging Vidyo meeting on MDT elx Upgrade, may, 28 h, 2019 R. Richter, S. Abovyan, O. Biebel, V. Danielyan, M. Fras, S. Kortner, O. Kortner, H. Kroha, M. Valderanis, Y. Zhao May-28 -2019 Status of ASD Production & Packaging - Vidyo meeting 1

ASD Status: Production ASD Production Timeline § § § § FDR engineering run for ASDv 6 ordered via CERN to MOSIS GF layout of 8 -inch-wafer yields ~ 3500 ASD chips 3 wafers from engineering run expect 10 k chips Order full production , 24 wafers = 84 k chips Delivery Testing of 80 k july 2018 dez. 2018 arrived april november febr. 2020 march … aug. 2020 § Good news from TDS run: Yield was 97% of good chips!! May-28 -2019 Status of ASD Production & Packaging - Vidyo meeting 2

ASD Status: Packaging ASD Packaging and Test Status § § § May-28 -2019 Pin-layout of QFN 88 agreed on by potential suppliers We have 4 offers, prefer i. MEC Placement of packaging order Delivery of 100 packaged pre-production samples „Manual“ testing of ASD functions, evaluation Delivery of 10 k packaged ASDs „Automatic“ testing of 10 k ASDs, analysis of yield, optimization of automatic test station PRR Order full production , 24 wafers = 84 k chips Delivery Testing early june early july end of july early sept. end of oct. early november febr. 2020 march … aug. 2020 Status of ASD Production & Packaging - Vidyo meeting 3

Layout of the 8‘‘ Wafer WAFER 200 mm 194 mm RETICLE w. 36 chips Wafer contains 82 fully usable reticles and 36 partly usable reticles ~ 3500 chips Unit Cell exposure E = edge unit exposure Documentation from GF May-28 -2019 Status of ASD Production & Packaging - Vidyo meeting 4

Non funtional Chips at the edge of the Wafer Functional chips Non functional chips May-28 -2019 Status of ASD Production & Packaging - Vidyo meeting 5

Pin Assignment of the ASDv 6 6 32 1 16 16 3 ---74 Photo of ASDv 6 May-28 -2019 Status of ASD Production & Packaging - Vidyo meeting 6

Bond plan for ASDv 6 on QFN 88 May-28 -2019 Status of ASD Production & Packaging - Vidyo meeting 7

Status of Mezzanine Card & ON-chamber elx Issues: - Prototype PCBs to test ASD-TDC interface (developed by V. Danielyan) - Certification of radiation tolerance of commercial COTs - Tests from 2003/4 may no more be valid - Design refinement: voltage reg. for analog really needed? - Common test with (proto-) CSM to study power issues - Test of final mezzanine prototype with ASD and TDC - Final design of 4 mezzanine versions: - MDT 3 x 8, 2 x MDT 4 x 6, s. MDT stacked mezz. Mezzanine specif. Design Rev. , yesterday: Qs about power consumption, interface to CSM, use of LDO vs. FEAST No show-stoppers encountered General discussion about MDT Barrel heat management May-28 -2019 Status of ASD Production & Packaging - Vidyo meeting 8

Summary ASD production on schedule ASD packaging: supplier selected, ready to order Mezzanine design • In preparation to study the ASD–TDC interface • Studies about powering • COTS to be tested for TID Need benchmark test of fully equipped MDT to study noise, EMI and digital interference as soon as New Mezzanines and Proto-CSMs are available (2021? ? ). May-28 -2019 Status of ASD Production & Packaging - Vidyo meeting 9

Spares May-28 -2019 Status of ASD Production & Packaging - Vidyo meeting 10

Time line for Upgrade of MDT R/O electronics - In-depth review of the time schedule in the TDR - WBS defines work steps, reviews and milestones 2016 2018 2017 2019 Samples available Gantt chart for ASD production Quantities available Submission of: PDR May-28 -2019 Engineering run, 3 k ASDv 6 ASDv 7 FDR 2020 Full production available Production run, 80 k PRR Status of ASD Production & Packaging - Vidyo meeting 11

Rad. tol. Tests of the Legacy Frontend No problem due to 130 nm technology COTs still exist, but technology ? ? From Y. Arai et al. , ATLAS Muon Drift Tube Electronics, 2008 JINST 3 P 09001 May-28 -2019 Status of ASD Production & Packaging - Vidyo meeting 12

Mezzanine card types currently used in ATLAS 3 types of mezzanine cards used in ATLAS Planar mezzanine cards 8 x 3 and 6 x 4 for 8 and 6 layer MDTs Stacked mezzanine cards for BMG and BIS-78 s. MDT chambers Mezzanine card for 6 -layer MDT chambers May-28 -2019 Mezzanine card for BMG and BIS-78 Status of ASD Production & Packaging - Vidyo meeting 13

Design of new mezzanine cards MPI Munich will design the new mezzanine cards of each type, based on the design of the existing cards. Next steps (February and March 2019): Design and production of the TDC board of the stacked s. MDT mezzanine cards for the ASD-TDC interface. Design of the final mezzanine cards starts in April. Specifications document prepared at the same time scale. Mezzanine cards testers for the three mezz-types : design finished (V. Danielyan). Production this year. 3 new ASD on adapter PCB soldered onto an MDT 3 x 8 mezzanine card May-28 -2019 New ASD on adapter PCB soldered onto the ASD board of the stacked s. MDT mezzanine cards Status of ASD Production & Packaging - Vidyo meeting 14