Amped RF Technology Inc August 6 2016 Company

Amp'ed RF Technology, Inc. August 6, 2016

Company Overview Highlights l Founded in 2003 in Silicon Valley San Jose CA San Jose, CA l Wireless connectivity provider: Wi. Fi and Bluetooth R&D and sales support l Office opening in Tianjin, China 2009 l Audio/Video Bluetooth SIG Working Group Member Tianjin, China R&D, sales support and manufacturing

Wi. Fi Connectivity ACC 1340 Amp’ed RF Connectivity Controller Benefits · · · Single chip radio solution Dual Band 2. 4 GHz and 5 GHz support Best in class RF performance Features • • • Dual Band 2. 4/5 GHz 802. 11 a/b/g/n 802. 11 d Regulatory Domain 802. 11 h 5 GHz TPC/DFS 802. 11 r 21 d. Bm 2. 4 GHz PA integrated -97 d. B Rx sensitivity Wi-Fi Direct Soft Access Point Wi-Fi and Soft AP Concurrent operation Hotspot 2. 0 73 -pin WLCSP package Low external component count Now Available

Audio Host MCU ACH 1180 Benefits • So. C Host solution: MCU+DSP+CODEC • Supporting CD quality stereo CODEC • Integrated clock management • Cortex M 4 F, 200 MHz • Low power consumption Audio Connectivity Host • • Analog and I 2 S audio output Differential mic input Floating point processing Integrated AES encryption engine ACH 1180 RF RF Radio ACC 1340 I 2 S/SPI Serial 832 K RAM Clock UART GPIO Audio In/Out Sampling – Q 1 2017

Embedded Software Wi. Fi Protocol Stack • • • Upper layer stack Embedded RTOS (non-Linux) Small memory footprint Optimized for audio applications OTA – over-the-air software updates Audio Processing Software • • • Echo and noise cancellation Voice filtering and detection Audio compression Adaptive playback Secure audio data AES encryption

Bluetooth Module Host Controller Interface ARM Cortex MCU Including Amp’ed. UP Stack BT Radio Chipset • TI CC 2564 RF Filter UART CC 2564 Flash 64 K/128 K/256 K SPI I 2 C RAM 8 K/16 K/48 K Clock GPIO I 2 S Host μController • ARM Cortex M 4 Bluetooth Protocol Stack • Amp’ed. UP Bluetooth Stack

Bluetooth Modules Bluetooth Dual-mode BT 53 Bluetooth SIG Declaration ID: D 025845 Bluetooth SIG Qualified Design ID: 65782 Features 13. 5 mm Specification RF chip 11. 6 mm Power class Range Dimension BT 53 Bluetooth v 4. 1 TI CC 2564 Class 1 60 m LOS 11. 6 x 13. 5 x 2. 2 mm Data rate 500 K bps over IAP 1. 2 M bps over SPP Interfaces UART, SPI, I 2 C, I 2 S

Wi. Fi Modules Wi. Fi Dual-band WF 43/WF 52/WF 60 WF 43 Features Specification RF chip WF 52 Frequency Range Dimension WF 60 802. 11 a/b/g/n ACC 1340 2. 4 GHz/5 GHz 100 m LOS 14. 6 x 13. 5 x 2. 2 mm Data rate >2 Mbps TCP/UDP Interfaces UART, SPI

Product – Development Tools Data EVB: BT 253 Audio EVB SW: Amp’ed. UP SDK Classic Bluetooth Stack Data Features Audio Features Amp’ed. UP Software Developing Tool Supported Bluetooth v 4. 1 with SPP, Supported Bluetooth v 4. 1 with A 2 DP, Supported end-user customization of our i. AP 1/2 and other optional profiles. AVRCP, HFP and other optional profiles modules through the use of Amp’ed. UP SDK

Bluetooth Stack Amp’ed. UP Bluetooth Stack Both Classic and Low Energy Options Combined Support l Apple MFI l Amp’ed UP SDK l High Quality Audio l End-User Customization Features Amp’ed. UP 4. 0 Combo l Classic Profile：SPP, IAP, A 2 DP, HFP, AVRCP, HID l BLE：ATT, GATT，Prox，Findme，HID，OBEX， Indoor Positioning

Sonic. ART Codec I 2 S BT Module Analog Spkr/ Headset Sonic ART is our proprietary Analog Mic Bluetooth audio enhancement software suite. Features l A 2 DP/HFP profiles supported l FLECS, Frequency Lock and Error Concealment Sampling l Sampling rates up to 48 KHz, Data rates up to 512 K bps l Acoustic Echo Cancellation and Noise Reduction l Low Latency Options, <25 ms l Wide Band Speech

Blue. Guard is an embedded firmware application layer which runs on top of our exiting Bluetooth Stack & profiles. Features l Strong Data Security for Payment Card Industries Systems l MIPS FIPs 140 -2, Level 3 Data Security Standards l Eliminates Standard Bluetooth Security gaps l Triple DES Data Encryption l Protect Data over public networks!

Business Model Technical Support Stage Support Available Wireless system design Customized support from Amp’ed RF’s engineers. Hardware design Reference designs, schematics and layouts, for proven Wi. Fi and Bluetooth modules currently in production. Firmware integration Available technical guides: API interface, Generic Kernel/OS interface, Target abstraction layer interface. Working example code is provided. Regulatory certification Leverage our partnership with TUV labs for low cost and quick certifications. Mobile device app development Example source code available for Android and i. OS. Production High speed production test software available.