Xray CCD Detectors for Astronomy and Space Science

  • Slides: 34
Download presentation
X-ray CCD Detectors for Astronomy and Space Science Andrew Holland a. d. holland@open. ac.

X-ray CCD Detectors for Astronomy and Space Science Andrew Holland a. d. holland@open. ac. uk

Focussed X-ray Imaging The ESA XMM/Newton Spacecraft 3 co-aligned optics, each comprising 58 nested

Focussed X-ray Imaging The ESA XMM/Newton Spacecraft 3 co-aligned optics, each comprising 58 nested Ni shells Focal plane detector arrays providing imaging and spectroscopy

XMM EPIC MOS Cameras • • • 2 UK MOS cameras, having focal plane

XMM EPIC MOS Cameras • • • 2 UK MOS cameras, having focal plane arrays of 7 CCDs Share their telescopes with the 2 RGS instruments Broad-band from 0. 3 -10 ke. V, ~35 mm depletion Increase in throughput, high energy QE and sub-ke. V resolution possible Redundancy comes from multiple detectors (and cameras) 6 cm

Future X-ray Astronomy Missions • HXMT (China) ~2012 – China’s first X-ray astronomy mission

Future X-ray Astronomy Missions • HXMT (China) ~2012 – China’s first X-ray astronomy mission – Collimated • Ne. XT (Japan) ~2013 – X-ray telescope • IXO (ESA/NASA/Jaxa) ~2018 – Merger of XEUS and Con-X

IXO baseline concept Extendible Bench with light tight curtain (not shown) • “XEUS” becomes

IXO baseline concept Extendible Bench with light tight curtain (not shown) • “XEUS” becomes “IXO” • IXO science goals encompass all of XEUS and Con-X core science. • L 2 halo orbit • Baseline is one spacecraft with an extensible optical bench instead of two spacecraft in formation-flying configuration Focal Plane Spacecraft bus Mirror – requires the provision of a focal plane instrument interchange mechanism • ESA Si-pore optics remain in the baseline for IXO, but US will study slumped-glass alternative in parallel – NB parallel ESA study of slumped glass was already anticipated for XEUS. Silicon Glass

IXO baseline concept • Focal length is now 20 -25 m instead of 35

IXO baseline concept • Focal length is now 20 -25 m instead of 35 m for XEUS – implications for the effective area as a function of energy and the instrument fields of view. • Key requirements: – affective area ~3 m 2 @ 1. 25 ke. V; ~1 m 2 @ 6 ke. V – angular resolution 5 arcsec • Single optic with design optimized to minimize mass and maximize the collecting area ~3. 4 m diameter figure courtesy Günther Hasinger

IXO baseline concept • Baseline instruments are: – an X-ray wide field imaging spectrometer

IXO baseline concept • Baseline instruments are: – an X-ray wide field imaging spectrometer (=XEUS WFI) – a high spectral resolution nondispersive X-ray spectrometer (=XEUS NFI, Con-X XCS) – an X-ray grating spectrometer (=Con-X XGS) – “allocation for further payload elements with modest resource demands” • Potential fields of view: – WFI: 12 arcmin – NFI: 5 arcmin figure courtesy Nick White

Key Reasons to Continue MOS Activity • Complementary technology to DEPFET – Reduces Technical

Key Reasons to Continue MOS Activity • Complementary technology to DEPFET – Reduces Technical Risk – Instrument Background • Instrument background IS lower in the XMM MOS CCDs – Redundancy • Key unknown risk of micrometeorite hit killing FPA • 2 separate WFI sub-systems virtually remove risk of catastrophic failure • Hope to re-introduce increased FOV for WFI

Key Technical MOS Developments Development Item Current Position Goal Funding Source Increased Efficiency Deep

Key Technical MOS Developments Development Item Current Position Goal Funding Source Increased Efficiency Deep depletion for higher >5 ke. V QE 300 mm (achieved) e 2 v PV High speed readout ASIC Charge Transfer Speed RAL design, 4 chan, 7 e- rms. ~10 ms/row <5 e- rms. STFC + e 2 v PV ~100 ns/row Test current examples Radiation Hardness Charge Injection and p-channel ~10 e- rms. injection noise 2 kx 4 k samples 3 e- rms. e 2 v PV + RG case ~3 x improvement over n-channel Low energy resolution 80 e. V at 500 e. V 40 e. V Already have first test devices

Key Developments Beyond XMM/EPIC • Key DEPFET Alternative Technology Required – Charge Transfer Speed

Key Developments Beyond XMM/EPIC • Key DEPFET Alternative Technology Required – Charge Transfer Speed increase • Key E-WFI Developments Required – Baffle and Straylight analysis • Common Development Requirements – – – High throughput using a low noise multi channel ASICs Improved high energy QE High Sensitivity (low background) Improved spectroscopic resolution at low energies Radiation hard

Increased Transfer Speed • A >30 x increase in the throughput for the IXO

Increased Transfer Speed • A >30 x increase in the throughput for the IXO optic can be achieved by Polysilicon electrodes – Fewer pixels (1/3) – An increase in readout speed (3 x) – An increase in number of output nodes (8 x) • For a 2 x 1” format detector, frame time is 30 ms • To retain >100: 1 integration: transfer time – Frame transfer time should be <300 ms • Line transfer time <<0. 5 ms Aluminium tracks • This requires the new technique of metal buttressing over the polysilicon electrodes to reduce resistance • This technique has been developed for the CPCCD for LHC at e 2 v

Low Background Detectors for E-WFI Out of field background (D. Lumb report) • Optimal

Low Background Detectors for E-WFI Out of field background (D. Lumb report) • Optimal sensitivity combines – Expected source spectrum – Mirror efficiency (basically <2 ke. V) – Detector QE – Detector background • XMM detectors sensitive to – Single or double sided detection (+100%) – Thickness of “Entrance window” (+50%) – Pixel size (~10 -20%) • We are performing a study to maximise instrument sensitivity • Warning against using many elements in the baffle/camera

Energy Geant 4 Model and Results

Energy Geant 4 Model and Results

Instrument Background Study • Extensive study performed using Geant-4 comparing to EPIC MOS+pn, Suzaku

Instrument Background Study • Extensive study performed using Geant-4 comparing to EPIC MOS+pn, Suzaku and Swift instruments • For XMM EPIC the dominant background is LE electrons from the camera – EPIC array averaged area to primary protons ~14 cm 2, ~50/s, >99. 9% penetrating particles rejected – Residual background from soft electrons from surroundings plus Compton electrons internal to sensor – With scintillator veto shield, averaged area >300 cm 2, ~ 1200/s, would add to dead time, high-Z would also create more gamma background • FI MOS CCDs inherently lower sensitivity to these than fully depleted BI structures • Need to perform study into reducing the electron component off the shield • Further Geant-4 model development to be undertaken • Concerns over high-Z active shields impacting Si background + coatings – EPIC used Al shielding specifically to minimise background

High Speed Readout • • High throughput required to minimise pile-up System noise specification

High Speed Readout • • High throughput required to minimise pile-up System noise specification of 5 e- rms. XMM/EPIC 1 node at 160 k. Hz XEUS minimum requirement : 8 nodes at 1 MHz – 30 x faster than XMM/EPIC • Initial development with RAL (1 and 4 channel, 6 -10 e- noise) • Aim to develop a full 8 channel design Clock timing diagram 2 -channel CDS ASIC 4 Channel ASIC

Increased Detection Efficiency (see poster by Murray) • Use of high purity bulk (FZ)

Increased Detection Efficiency (see poster by Murray) • Use of high purity bulk (FZ) material can increase depletion depth • De-coupling rear substrate from that local to FET can enable increased bias • 300 mm depletion for -100 V on substrate • 2 nd generation devices tested using 512 x 2048 format – 13. 5 mm pixels • Used on-chip binning to explore FWHM resolution vs. pixel size ~93 µm depletion ~295 µm depletion ~35 µm depletion CCD 247 Quantum Efficiency Measurements CCD 247 Spectral Resolution Measurements (VSS = -100 V)

Increase in Science from the E-WFI • IXO optic has 3. 5 x the

Increase in Science from the E-WFI • IXO optic has 3. 5 x the focal length of XMM • Useable field to 20 arcmin and limited by detector size • Needs a very large focal plane array • Survey & find first black hole requires use of all of field • Proposing the DEPFET for the central field • MOS CCDs to enhance field coverage by 9 x • Gives access to much more data NFI A 2597 E-WFI

The XEUS E-WFI • An X-ray camera for XEUS : dual technology to cover

The XEUS E-WFI • An X-ray camera for XEUS : dual technology to cover the target and serendipetous science • Much larger array than XMM EPIC • High rate DEPFET central array, surrounded by a CCD outer ring • Only one possible CCD construction shown Module 18 cm CCD ASIC Al mount Si substrate TEC Be-plate Al fingers Flex

The Swept Charge Device • Non-imaging CCD-based sensor for XRF • Developed under the

The Swept Charge Device • Non-imaging CCD-based sensor for XRF • Developed under the UK Impact programme ~1998 • New generation of devices designed in 2007

The New Family of SCDs • Non-imaging CCD technology for XRF • New design

The New Family of SCDs • Non-imaging CCD technology for XRF • New design provides improvements to: – Radiation hardness – Readout speed – Operating temperature • 2 phase operation with 100 mm pitch Designatio n “Pixels” Area CCD 235 20 5 mm 2 “L”-shaped electrodes Dummy output node CCD 234 200 100 mm 2 CCD 236 200 420 mm 2

CCD 234 and CCD 235 • CCD 234 – Area = 100 mm 2

CCD 234 and CCD 235 • CCD 234 – Area = 100 mm 2 • CCD 235 – Area = 5 mm 2 CCD 235

Large Pixels (100 mm) • • X-ray optic PSF is ~1 mm in diameter

Large Pixels (100 mm) • • X-ray optic PSF is ~1 mm in diameter Fewer/larger pixels promote an increase in frame rate New CCDs tested with 100 mm pixel pitch for HXMT Large pixels demonstrating high charge collection and good CTE for X-ray spectroscopy • Improved radiation hardness due to charge confinement – needs verification by tests • CCD 236 shown – 2 phase, 100 mm pitch Cu-K in CCD 235

Leakage Current • Devices only designed for small signal handling, <10 k e •

Leakage Current • Devices only designed for small signal handling, <10 k e • CCD 236 leakage saturates device at room temperature • Leakage current measured at 100 k. Hz readout rate

SCD Energy Resolution

SCD Energy Resolution

CCD 235 Resolution at Elevated Temperatures • • Cu-K spectra in the CCD 235

CCD 235 Resolution at Elevated Temperatures • • Cu-K spectra in the CCD 235 operated at 100 k. Hz above room temperature Is this a record for resolution vs. temperature? Note that the leakage contribution can be reduced by running faster Elemental identification at +50 o. C is possible

Zn. O in Air and Vacuum – CCD 235

Zn. O in Air and Vacuum – CCD 235

SXI on HXMT • Working with IHEP in Beijing to use an array of

SXI on HXMT • Working with IHEP in Beijing to use an array of CCD 236 SCDs for to soft X-ray imager on HXMT • Detector area = 320 cm 2 Soft X-ray Detector (SCD, 400 cm 2)

Main Characteristics of HXMT Instruments • Main Detector Na. I(Tl)/Cs. I(Na) Phoswich – –

Main Characteristics of HXMT Instruments • Main Detector Na. I(Tl)/Cs. I(Na) Phoswich – – – Total Detect Area ~5000 cm 2 Energy Range 20~ 250 ke. V Energy Resolution ~19% (@60 ke. V) Field of View 5. 7°x 5. 7°(FWHM) Source Location ≤ 1 arcmin(20 ) Angular Resolution ≤ 5 arcmin(20 ) • Secondary Instruments IEXD (7 -30 ke. V, Si. PIN, 1000 cm 2), SXD ((1 -15 ke. V, SCD, 400 cm 2) • • • Mass Dimension Nominal Mission lifetime Orbit Attitude ~2500 kg (payload ~1100 kg) 2. 0× 2. 8 m 3 (L×W×H) 2-3 years Altitude 550 km,Inclination 43° Three-axis stabilized

HXMT SCD Modules • • Aim to construct a detector array behind an X-ray

HXMT SCD Modules • • Aim to construct a detector array behind an X-ray collimator system Target of 320 cm 2 detection area Design concept includes 4 CCD 236 devices on a ceramic module Collecting area is built up using a mosaic of these modules

SCDs for Lunar Mapping talk by D. Smith • SCDs used in the D-CIXS

SCDs for Lunar Mapping talk by D. Smith • SCDs used in the D-CIXS instrument on ESA’s Smart-1 lunar orbiter – Detectors heavily radiation damaged during the long transit to the moon • Also to be flown on the C 1 XS spectrometer on ISRO’s Chandrayaan-1 lunar orbiter – Improved instrument design to meet science goals over 2 year mission duration • Both instruments use an array of SCDs in a 4 x 1 array package • 6 such packages used per instrument, providing 24 sensors • D-CIXS package shown below with 4 SCDs driven in parallel requiring only 12 connections D-CIXS instrument (RAL)

Elemental Mapping of the Moon • C 1 XS will produce elemental maps like

Elemental Mapping of the Moon • C 1 XS will produce elemental maps like the one shown from the NASA Clementine mission:

Etna Basalt (Polished, 10 minute data collection) Potassium Calcium Ka Aluminium Titanium Vanadium Ka

Etna Basalt (Polished, 10 minute data collection) Potassium Calcium Ka Aluminium Titanium Vanadium Ka Ka Ka Silicon Ka Calcium Magnesiu Ka Kb Manganese m Ka Ka Iron Ka Phosphorou Sodium s Ka Ka Chlorine Iron Kb Ka Oxygen Ka Tail of noise peak, as a result of image processing

Spin-Off into other areas • Utilising the photon-counting mode of CCDs • X-ray Fluorescence

Spin-Off into other areas • Utilising the photon-counting mode of CCDs • X-ray Fluorescence – Analysis of contaminants • X-ray diffraction – Portable in-situ XRF/XRD for geology – www. in. Xitu. com • Beta Autoradiography – Thin tissue imaging using 3 H, 14 C – www. xcam. co. uk

Conclusions • MOS CCDs are being developed for future X-ray instruments in space science

Conclusions • MOS CCDs are being developed for future X-ray instruments in space science • Over the next year the IXO baseline configuration is likely to change (watch this space…) • Development of critical technology components is being addressed – Readout ASICs – Transfer time – Increased QE – Large pixels • Currently no funding for a single demonstrator model incorporating all elements • Modelling of instrument background is identifying the key contributors to aid their reduction in XEUS • SCD technology is being applied to XRF for elemental mapping for Lunar science • Spin-off is occurring into terrestrial XRF, XRD and Beta Autoradiography