WP 2 Virtual Metrology Contact niall macgearailtintel com

WP 2: Virtual Metrology (Contact: niall. macgearailt@intel. com) Objectives The Objective of WP 2 is to develop sensors, models and analytical tools to predict the physical and electrical characteristics of the wafers from the process tools parameters and advanced sensor data. Process characteristics will be predicted with models which can replace and/or complement classical metrology and will improve R 2 R control and process diagnostics. Early Results Etch rate estimation from Optical Spectra using statistical approach. Novel Approach using combination of technologies to estimate wafer’s physical dimensions and electrical performance WP 3: Predictive Maintenance (Contact: bernd. barak@infineon. com) Objectives WP 2 and WP 3 The prediction of equipment behaviour will allow to anticipate failures and to launch ad-hoc preventive maintenance actions. It is the basis to set up a Predictive Maintenance strategy and defines the main objectives of WP 3: • Improvement of effectiveness by describing the deviation of the actual equipment behaviour from the status of normal productive operation based on the relevant key parameters of the equipment (“health monitoring”) • Decrease of equipment failure rate (unscheduled down time) by detecting out of control deviations before the equipment is going unscheduled down enabling appropriate containment actions to avoid this final status • Speedup of equipment recovery by classifying out of control deviations and identifying its root cause enabling fast determination of the corrective actions required to bring the equipment back to the status of normal productive operation Early Results • Data acquisition and modelling • User-Specification • Architectural data flow requirements Change of beam line graphite Example from Ion Implantation European Nanoelectronics Forum, November 17, 18 2009 Noordwijk, The Nederlands