Wafer Input TESTIN G Die Saw Sealing Process

基本封裝流程 Wafer Input TESTIN G Die Saw Sealing Process Wafer Clean Wire Bond Die Bond Curing

CMOS Image Sensor 封裝型態 • • • CLCC PLCC Wafer Level Package Solid Molding Others

什麼是LCC Type? Leadless Chip Carrier

LCC Substrate 的尺寸標示

LCC Substrate 的尺寸標示 . Borosilicate glass is any silicate glass having at least 5% of boric oxide in its composition. It has high resistance to temperature change and chemical corrosion. Not quite as convenient to fabricate as either lime or lead glass, and not as low in cost as lime, borosilicate's cost is moderate when measured against its usefulness. Pipelines, light bulbs, photochromic glasses, sealed-beam headlights, laboratory ware, and bake ware examples of borosilicate products.

封合的品質 1. Glass vs Substrate (偏位) 2. TILT of Glass (平整) 3. Thickness of Glue (膠厚) 4. Defects (缺陷)

Glass vs Substrate 偏位 Δ < 0. 1 mm (4 mil) Glass Substrate Θ < 3°

TILT of Glass 平整度 Glass Glue Substrate Δ < 0. 05 mm(2 mil)

Thickness of Glue 膠膜厚度 Glass Glue Substrate Δ < 0. 025 mm(1 mil)

理想的膠合 小於 1/3 Substrate height 略小於邊界 Glass 小於 ½ Substrate height 無氣泡 Substrate

Firstly, Let’s Check the Process Flow! IQC 2 VI Wafer Input Wafer Clean Die Saw Die Bond Water Mark、Die Crack、Scratch、 Color Filter Missing…. . . More Where Should be Inspected? Curing Die Position、Rotation、Tilt、 Epoxy……More FVI TESTING Inspection By Operator or AOI Sealing Process 3 VI Particles Wire Bond

Inspection Item I Water Marks Die Crack Die Scratch Die Chip Out Color Filter Missing

Inspection Item II Die Position Insufficient Epoxy Die Rotation Epoxy On Die Tilt Epoxy Void Die Orientation Epoxy Curing Warpage Double Mount

Inspection Item III Open-Sort Test Particle On Sensor Array Area Scratch On Sensor Array Area Color Filter Missing Video Output Pre-Test

參考資料 Lens Module LCC types Micro lenses CSP-CMOS 可靠度測試

可靠度測試 依據： IPC/JEDEC J-STD-020 A (From JEDEC Board Ballot JCB-98 -104) JESD 22 -A 113 B (From JEDEC Board Ballot JCB-98 -101)