Wafer In Wire Bond WB Solder Plating SP

Wafer In Wire Bond (WB 銲線) Solder Plating (SP 錫鉛電鍍) Wafer Grinding (WG研磨) Die Coating (DC 晶粒封膠) Top Mark (TM 正面印碼) Wafer Saw (WS 切割) Molding (MD 封膠) Forming/Singular (FS 去框/成型) Die Attach (DA 黏晶) Post Mold Cure (PMC 封膠後烘烤) Lead Scan (LS 檢測) Epoxy Curing (EC 銀膠烘烤) Dejunk/Trim (DT 去膠去緯) Packing (PK 包裝)

傳統 IC 封裝流程 Production Technology Center

傳統IC 成型 Forming punch Forming anvil

BGA 封裝流程 Production Technology Center

TE-BGA Process Flow(Thermal Enhanced- BGA) Die Bond Epoxy Dispensing Ball Placement Plasma Wire Bond Heat Slug Attach Molding

MD(封膠) (Molding) BM(背印) (Back Mark) D/T(去膠/去緯) (Dejunk/Trim) PMC(烘烤) (Post Mold Cure) F/S(成型/去框) (Form/Singulation) TM(正印) (Top Mark) SP(電鍍) (Solder Panting) MC(烘烤) (Mark Cure) LS(檢測) (lead Scan) F/T(功能測試) (Function/Test) PK(包裝) (Packing)

WIRE BOND (WB) PREMOLD-BAKE (PB) MOLDING (MD) POST-MOLD-CURE (PMC) DEJUNK/TRIM (DT)