Visible MSL HistoryFacilities MSL class 10 cleanroom completed

Visible

MSL History/Facilities • • MSL class 10 cleanroom completed in 1989 with LBNL LDRD funds CMOS processing equipment donated or purchased w/ GPE: furnace, lithography, etching, sputtering equipment, wet stations etc. Originally intended to produce rad-hard silicon strip detectors for SSC First CCD fabricated in 1996 MSL Entry in Bldg 70 A

MSL Test Facilities • MSL also includes CCD Testing Laboratory in building 50 — CCD testing lab with 4 test dewars & associated electronics, light projection etc — Monochrometer for quantum efficiency measurements — Pinhole projector for charge diffusion measurement — Class 1000 cleanroom with wirebonder and ESD-safe bench for packaging — Cold probe station for wafer level testing prior to dicing and packaging • LBNL continues to invest GPE in MSL to maintain it as a unique core competency: — — — 2001 2005 2008 Monochromater & pinhole projector for QE & charge diffusion measurements $62 k Particle monitor system $40 k Photoresist developer system $575 k Furnace conversion to 6" wafers $226 k PECVD system for passivation $150 k Photoresist coat/bake system Cold probe station to determine preliminary wafer yield

Fully Depleted CCDs • • “Standard” CCDs used in astronomy are thinned, back-illuminated n-channel devices with ~10 -20 um epitaxial depletion region LBNL CCDs are thick, back-illuminated fullydepleted p-channel devices — higher QE over broader wavelength range than previous astronomical grade CCD’s — no fringing at long wavelengths — small, controllable point spread function (PSF) — p-channel has improved radiation tolerance (important for space applications) • Patents Issued — U. S. Patent 6, 259, 085 “Fully Depleted Back Illuminated CCD”, Jul. 10, 2001. — U. S. Patent 6, 025, 585 “Low-resistivity photon-transparent window attached to photosensitive silicon detector”, Feb. 15, 2000. – U. S. Patent 7, 271, 468 “High-voltage compatible, fully-depleted CCD”, Sept 28, 2007 4

Current Deployment of LBNL CCDs Kitt Peak/Mayall 4 m MARS and RC spectrographs Keck 10 m LRIS spectrograph Lick Observatory/Mt Hamilton Echelle spectrograph MMT 6. 5 m/Mt. Hopkins Red Channel spectrograph Palomar Hale 200”/SWIFT spectrograph

Future Deployment of LBNL CCDs SDSS-III/BOSS 2009 Apache Pt Observatory 2. 5 m SDSS Telescope Dark Energy Survey 2011 CTIO Blanco 4 m Telescope Big. BOSS 2015 KPNO Mayall 4 m Telescope SNAP/JDEM 201? LSST has baselined fully depleted CCDs

Radiation tolerance of LBNL CCDs • P-channel CCDs are intrinsically more radiation tolerant — conventional n-channel CCDs form phosphorous vacancy (P-V) defect that reduces charge transfer efficiency — Boron-doped p channel forms a divacancy defect (V-V) that is a second order process — Result is x 10 reduction improvement in CTE vs proton dose • Detailed irradiation studies at the LBNL 88” cyclotron agree with independent testing (Marshall et al) — Incidence of hot pixels also reduced — Dark current is not a problem K. Dawson et al, IEEE Trans. Nucl. Sci. , 55, 1725, 2008 7

MSL R&D Directions • We are pursuing several avenues for improved CCDs — Thinner CCDs using Ti. N metal for reduced diffusion, improved yields (200 um -> 100 um) — Charge multiplying p-channel CCD for single photon sensitivity (funding from NASA and NNSA) — Fast CCD with multiple outputs for x-ray detection at light sources (LBNL LDRD funding) — Lower noise output transistors (LDRD) — Higher speed output transistors (LDRD) — Combinations of the above in a single device — Thinner backside contact using molecular beam epitaxy (MBE) to improve UV response (in collaboration with JPL)

Visible Detectors • • • Full-depletion technology Excellent far-red response Si. C package DOE providing 62 detectors in DES Technology selected for LSST DOE has spent ~$13 M developing these formats and electronics for dark energy experiments. 3510 x 3510, 10. 5 μm CCD in shipping container and case 10 CCD Cryogenic Readout

CCD Silicon Carbide Mount • • • Motivation and features similar to the NIR. In fact, detector height and mounting footprint are identical for intermixing on focal plane. Assembly evolved over 10 prototypes. CCD on Si. C mount CCD in shipping container and case Flex and Connector Si. C Pedestal Al. N PCB 11

Si. C Mount Flatness • • One of the drivers for engineering the mounts was to meet stringent focal plane flatness tolerances – 10 m (p-p) was. Total achieved flatness at the detector material is shown for three parts each. CCD PP 1 3 m PP 2 6 m PP 3 7 m 12

CCD Frontend Electronics • • Programmable biasing of CCD – -25 V source follower biasing to +100 V substrate bias Programmable clock levels Programmable clock pattern – special modes to support radiation damage monitoring Dual slope correlated double sampler and digitization of 4 CCD outputs Temperature monitoring – locally and at the CCD Same LVDS interface and protocol as SIDECAR ASIC (NIR) Designed for operation down to 120 K – verified Radiation tolerance design methodology – heavy ions testing at LBNL 88” Cyclotron CRIC CLIC Vog Generators Parallel Clock Drivers Voltage Reference SW RG Clock Drivers Digital Logic Serial Clock Drivers SW RG Serial Clock Drivers Vog Generators 6 bit DACs CRIC 3. 3 V Generators Vr Generator VDD Generator Temperatur e Monitor 14 Bit ADC Pre-Amp & CDS Multi-slope Digital Logic VSub Parallel Clock Drivers 13

CCD Frontend Electronics SNAP CCD and electronics at 140 K Flat field CLIC CRIC Tree image Bad CCD corner 14

NIR

WFC 3: Hawaii-1 R 1 k x 1 k NIRSpec: Two Hawaii-2 RG 2 k x 2 k NIRCam: partial set of Hawaii-2 RG 2 k x 2 k Can’t build large column/row count mosaics. 16

SCA build up • Historical – philosophy to strain silicon to match MCT CTE — ~10 um Hg. Cd. Te on 800 um Cd. Zn. Te (removed for space missions). — Indium bumps — 700 um silicon ROIC — BCS interposer — Moly base with 4 -point mount • SNAP development — Always remove Cd. Zn. Te — Mechanical match Si ROIC properties — Direct attach to Si. C (no BCS) base with 3 -point mount 17

SNAP development • Started with WFC 3 1. 7 um MCT • Extended to 2 k x 2 k formal, a la JWST • Attach to Si. C with 3 -point mount • Mount designed for near 4 -side abuttability • Mount has space-rugged connector • Excellent flatness of optical surface relative to mounting plane. 1. 2. 3. 4. 5. Active detector area spacing can be as low as 2. 9 mm in one direction and 5. 9 mm in the other (mechanical clearance gap must be added). No differences or artifacts observed between moly and Si. C mounts Mounts and attachments survived NASA-spec vibe tests (GEVS) Thermal vacuum tests showed excellent thermal conductivity Connector supports 32 output channels, reference pixel output, guide window output, and access to temperature monitor resistors). 18

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SCA Comment 102 Good - ground based mount 103 Good - ground based mount 142 Good – Si. C 236 Good – Si. C 238 Good - Si. C 141 Si. C - open corner – test vehicle 144 Si. C - ½ works – test vehicle 234 Si. C - partially works – test vehicle Latter 6 yielded form 8 starts 20

Hg. Cd. Te Detectors • • • Short-wave cut-off (1. 7 micron) Si. C package High-speed 32 -channel readout H 2 RG mux. Excellent visible response DOE has spent ~$11 M developing these formats, packaging, & electronics for dark energy experiments. 21

NIR Si. C Mount Flatness • • One of the drivers for engineering the mounts was to meet stringent focal plane flatness tolerances – 20 m (p-p) was allocated. Total achieved flatness at the detector material is shown for three parts each. NIR SCA 236 3. 7 m SCA 236 4. 1 m SCA 234 5. 7 m Mount can remove plane tilt 22

NIR Silicon Carbide Mount • • Flatness and height tolerance are built in – plug and play. Si. C is good match to detector Si ROIC (readout IC). Robust connector and mounting for blind mating of electronics box. Near four-side abuttable. We provide mount and assembled flex circuit; Teledyne attaches detectors and tests. ROIC with attached detector material is directly glued to the Si. C – no BCS (bonded composite structure). Eight detectors have been mounted on SNAP Si. C mount Vibration of mounts done; live detector in the next few weeks. Silicon Carbide Connector, flex and discretes Fully assembly detector Flex wirebond ledge 23

NIR Frontend Electronics Teledyne SIDECAR ASIC • Readout controller on a chip • Developing our own programming and operational experience Used on JWST in 4 -channel mode 24

NIR Frontend Electronics SNAP packaging • Supports direct connect to detector • Supports 36 -channel mode — 32 array outputs —Ref pixel output —Window output —ROIC and board temp monitor • LVDS digital interface • Four science data links 25

Data Systems

• GLAST 27

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GLAST-based Data System 29

Focal planes

Silicon Carbide Focal Plane Demonstrator focal plane has shown: • Precision Si. C components are achievable - flatness to 2 m. • Metrology of focal plane, detectors, and assemblies meet flatness spec achievable without shimming. • Position stability after vibration test of focal plane, mounts, and electronic module simulators. • Thermal performance with simulated heat loads matches models. • Position stability after thermal cycle test of focal plane, detectors, and electronic module simulators. 3 x 3 Si. C demonstrator Instrumented for vibration test Mounted on vibration table 31

Vibration of detector/electronics assembly

Thermal Performance Test Thermal balance testing verified thermal design, including heat load from detectors and focal plane electronics BACK SIDE OF DEMONSTRATOR FACES UPWARDS DEMONSTRATOR AND COLD FINGER ARE SEPARATELY WRAPPED AND TENTED IN MLI THERMAL STRAPS TO COPPER SHIELD BOX THERMAL STRAPS TO DEMONSTRATOR Electronics side of focal plane shown in previous slide. COLD FINGER Thermal-vacuum chamber 33

Thermal measurements Result of starting with electronics off in steady state and powering on the electronics to "high power" and measuring the time to steady state again The entire test run for the electronic in their high power mode

Demonstrator System • • Now that we have developed the parts, effort is shifting to system testing. Demonstrate interoperability of multiple NIR and CCDs, mixed or monotype. Look for crosstalk – understand grounding and cabling Targeting mid-July for cryogenic operation • Illustrated — Silicon carbide focal plane — Two CCDs and two NIR on Si. C mounts. — Electronics modules directly attached. 35

LBNL detectors support for NASA programs

• • THEMIS: the Solid State Telescopes used a total of 80 large area, thin window, in situ doped polysilicon, high resistivity silicon detectors. STEREO: the Suprathermal Electron Instrument utilizes high resistivity, thin window in situ doped polysilicon detectors. RHESSI: uses internally segmented Ge detectors. Mars 2001 Odyssey spacecraft: Used four Si(Li) detectors (http: //mars. jpl. nasa. gov/odyssey/mission/images/orbiter-marie. jpg). ACE: the Cosmic Ray Isotope Spectrometer instrument utilized 60 Si(Li) detectors (http: //www. srl. caltech. edu/ACE). ISS: there are two instruments with Si(Li) – the Intra-Vehicular Charged Particle Directional Spectrometer and the Extra-Vehicular Charged Particle Directional Spectrometer. COBE: differential microwave radiometers in DMR and microwave interferometer in FIRAS. Voyager: Si(Li) detectors, still operating. 37

MSL detectors on NASA space missions • Charged particle detectors fabricated in the MSL by Craig Tindall and Nick Palaio in collaboration with the UC-Berkeley Space Sciences Laboratory — STEREO – Studying the Sun in 3 D — Supra-Thermal Electron Instrument (STE) on STEREO uses MSL charged particle detectors with improved low-energy detection • • ~ 10 x improvement over previous MCP-based detectors 14 detectors delivered for flight and spares http: //www. nasa. gov/mission_pages/stereo/main/index. html 38 38

MSL detectors on NASA space missions • Charged particle detectors fabricated in the MSL by Craig Tindall — THEMIS – Understanding space weather — Solid State Telescopes (two for ions, two for electrons per spacecraft) — 104 detectors delivered, 80 used in flight THEMIS PIN Diode Fabricated in the MSL http: //www. nasa. gov/mission_pages/themis/spacecraft/SST. html 39 39

Spitzer The unstressed gallium-doped germanium detectors deployed in a 32 by 32 configuration that can image photons at wavelengths of 70 microns, or collect spectra from 50 to 100 micron photons. The mechanically stressed crystals are deployed in 40 detectors, arranged in a 2 by 20 configuration that can image 160 -micron photons. Each of these new detectors is also ten times more sensitive than their ISO counterparts. The gallium-doped germanium detectors, in combination with an array of 16, 384 detectors (128 by 128) made from arsenic-doped silicon, enable MIPS to "see" heat sources radiating at around 20 Kelvin (-253 degrees Celsius), which is a glow 100 times more faint than any previous infrared telescope could see. 40

South Pole Telescope w/ JPL 41

We do ASICs and incorporate into Systems

Monolithic Pixel Work for Last 3 Years Thin CMOS SOI OKI 0. 15 m FD-SOI AMS 0. 35 m-OPTO • LDRD-1 (2005) 10, 20, 40 m 3 T pixels • LDRD-2 (2006) (+ LDRD-2 RH(2007)) 20 m pixels, in-pixel CDS (+ Rad. Hard pixels) • LDRD-3 (2007) 20 m pixels, in-pixel CDS on-chip 5 -bit ADCs • LDRD-SOI-1 (2007) 10 m pixels, analog & binary pixels OKI 0. 20 m FD-SOI • LDRD-SOI-2 (2008) 20 m pixels, in pixel CDS fast binary pixels • SOImager (2009) ~13 m pixels, 4 x 4 mm 2 imager w/ fast readout 43

Current HEP IC Activities ICs for CCDs ICs for Next Generation Hadron Collider Pixels ICs for Next Generation Lepton Collider Pixels 44

Build whole optical/x-ray systems • LBNL: CCD, f. CRIC, “substrate” • ANL: DAQ, software • Systems for LCLS at SLAC • BES ARRA funds for producing systems for ALS 45

We build large systems

Big systems Atlas SCT modules on a support cylinder Atlas pixel modules on a disk support 47

ATLAS • ATLAS silicon strip — 6, 200, 000 - strips — 50, 000 ASICs — 4800 modules — 61 m 2 • ATLAS pixels — 80, 000 pixels — 1744 modules — 1. 7 m 2 48

Create factories to build them 49