UCSB Testing Status Anthony Affolder for the UCSB
UCSB Testing Status Anthony Affolder (for the UCSB module testing group) • Current testing infrastructure • Test results • Module test equipment needs • Software Needs • Current testing through-put L 3 Testing Meeting March 7, 2003 UCSB Status-Anthony Affolder Slide 1
Testing Facilities Readiness • Clean room adjacent to production area à à Room layout finished Currently in high bay with intentionally same layout – Missing only hybrid thermal cycling test à Clean room will be finished in April • Storage cabinet with dry air flow in place for testing phase • Long term module storage cabinets under construction at KSU L 3 Testing Meeting March 7, 2003 UCSB Status-Anthony Affolder Slide 2
UCSB Recent Infrastructure Projects • Hybrid holding plates à à Matches hybrid thermal cycling test stand Can bond and test with low noise in same holder • Burn-in low voltage distribution crate à LED indicators and fuse protection • Crowbar à à HV protection circuit 12 each for FNAL/UCSB • Module cold plate à Attaches to current module holder • Hybrid clamshell • Module clamshell L 3 Testing Meeting March 7, 2003 UCSB Status-Anthony Affolder Slide 3
Hybrid Visual Inspection • Once FNAL indicated lift off problem, closely visually inspected our 5 hybrids à à Found 1 wire bond lift off Bonds have redundancy so no failure seen – Removed broken bond to eliminate chance of short à Will closely monitor for lift off/ wire breaks throughout production process L 3 Testing Meeting March 7, 2003 UCSB Status-Anthony Affolder Slide 4
Current UCSB ARC Setup • 3 ARC Controller + 5 new ARC FE + 1 old ARC FE Hybrid Clamshell ARC crate • 1 Hybrid testing (2 Hybrid clamshells) • 2 Module testing (Module clamshell) à DEPP Module Clamshell L 3 Testing Meeting March 7, 2003 à 2 LED systems DEPP HV supply ARC Controller LED Controller UCSB Status-Anthony Affolder – Missing hybrid-to-utri adapters to fully use capacity Slide 5
ARC Hybrid Test Results (1) • 5 hybrids tested on arrival à à All good, but fail current requirement given in the Procedures for Module Testing Pedestal test reproducible, but noise measured very sensitive to digitization effects – Measured noise varying the pedestal by changing VPSP value – Digitization effects cause variations larger than ± 20% • Hybrid noise requirements should be changed à à Ni within 50% of average 0. 3 < Ni < 1. 5 – Removes chance of chips with uniformly low/high noise from passing requirements • See hep. ucsb. edu/cms. UCSB. html for more complete description L 3 Testing Meeting March 7, 2003 UCSB Status-Anthony Affolder Slide 6
ARC Hybrid Test Results (2) • 4 hybrids have had APV bonded to pitch adapters à All channels are good • Hybrid clamshells enable testing without large pickup effects at chip edges à à Hybrid isolated with base plate and lid grounded Same requirements can be made for hybrids with or w/o PA bonded L 3 Testing Meeting March 7, 2003 UCSB Status-Anthony Affolder Slide 7
ARC Gain Measurements (1) • Multi-point gain added to ARCS 6. 0 beta software à Thanks to the Aachen group • Tests are very quick and have advantages over pulse shape measurements à à More uniform More stable Gain linearities Gain variations • Strongly suggest that test be added to all M 800 production. Will be included TOB testing à Make requirements on gain slope, offset and fit c 2 L 3 Testing Meeting March 7, 2003 UCSB Status-Anthony Affolder Slide 8
ARC Gain Measurements (2) • 2 of 24 chips so far have no response with low injection values à Only occurs in peak mode inverter on • Caused by initialization defaults in ARCS tests à VPSP set too low – Thanks to T. Franke and M. Raymond for help • VPSP setting will be modified in new release à Removes all seen irregularities L 3 Testing Meeting March 7, 2003 UCSB Status-Anthony Affolder Slide 9
ARC Module Test Results (1) • 1 Prototype Module Tested • 1 Production Module Tested à Module testing in UCSB clamshell decreases common-mode noise to the point where location of opens become detectable by their noise levels – PA-sensor – Sensor-sensor à à PEAK ON Pinholes act as if saturated High current channels can have higher noise (Bad IStrip Slight noise increase on chip edges Two neighboring channels have high noise only in peak inverter on L 3 Testing Meeting March 7, 2003 Unknown Problem Bad CAC Bad Istrip Sensor-sensor open PA-sensor open UCSB Status-Anthony Affolder Pinhole Slide 10
ARC Module Test Results (2) PEAK ON • LED pinhole test à à Bonded one inherent pinhole on purpose Test acted as expected Unknown Problem Pinhole – 120 m. A needed to unsaturate pre-amp à Not clear if maximum current (400 m. A) supplied sufficient to find “high current” pinholes PA-sensor open Sensor-sensor open L 3 Testing Meeting March 7, 2003 UCSB Status-Anthony Affolder Slide 11
ARC Module Test Results (3) PEAK ON Pinhole PA-sensor open Unknown Problem Bad CAC Bad Istrip Sensor-sensor open • Gain test à à L 3 Testing Meeting March 7, 2003 Pinhole clear by lack of gain Opens clear by higher gain UCSB Status-Anthony Affolder Slide 12
ARC Test X-calibrations • Minimal X-calibration has been performed Same faulty channels found at FNAL/UCSB on prototype model à CERN FHIT/UCSB ARC test compared à – Pedestals very similar – Noise is slightly higher than CERN FHIT measurement Not understood if it is FHIT/ARC difference, a software difference, an environmental difference, or a digitization effect • Once model production begins, plan to exchange modules with FNAL for X-calibration L 3 Testing Meeting March 7, 2003 UCSB Status-Anthony Affolder Slide 13
ARCS Database • No entries yet put into official database à Waiting for ARCS interface for database upload and database definition to stablize • All testing results have been made available to silicon community on local website à hep. ucsb. edu/people/affolder/module_test_UCSB. html L 3 Testing Meeting March 7, 2003 UCSB Status-Anthony Affolder Slide 14
DAQ status • 1 full DAQ stand available at UCSB à Planned only for Vienna box tests with modules • Limited number of tests performed See P. Gartung’s talk à Focus on bringing up hardware/software for Vienna box à Xdaq, LT, and Xrod software all compiled and run à – Still working to understand controls/output • No LED stand planned for DAQ • No database work done as of yet L 3 Testing Meeting March 7, 2003 UCSB Status-Anthony Affolder Slide 15
Vienna Box Status • Vienna Box recently arrived at UCSB No modification necessary to use with TOB module carrier plates à Full compliment of plates currently in machine shop à LV distribution ready à Just received HV controllers (both the A 128 HS and A 1303) à – Integrating as fast as possible Demonstrated each slot works with hybrids à Thermal cycled box between – 25 to 30° C with chiller à Need hardware to test more than one channel at a time à – See P. Gartung’s talk for more details L 3 Testing Meeting March 7, 2003 UCSB Status-Anthony Affolder Slide 16
Current Hardware Needs • Hybrid thermal cycling box • ARC Needs à à 1 DEPP 1 LED system à à – Will be picked up this week • Torino Interlock Box à In-route • 3 Electrometers à Under construction at UCSB • 13 hybrid-to-utri ver. D à • DAQ components à 1 in-route – Used for both ARC module and burn-in test – Limiting factor in testing through-put L 3 Testing Meeting March 7, 2003 8 VUTRI – 10 in-route 2 in-route • Flat cable-Lemo adapter à à Lack hardware/software Tests will be performed by A. Honma’s group for M 800 We are aiding in the manufacturing of test stand à 9 PAACB – 6 in-route à 1 TPO – 1 in-route à 1 CCU – 1 in-route à 2 PAACB to TPO interface – Needed for backplane pulsing UCSB Status-Anthony Affolder Slide 17
Current Testing Software Needs • Hybrid Characterization à Database input • Module Testing à IV scan, backplane pulsing test, database input • Module Burn-in • Rods Beginning to assemble necessary infrastructure for rod assembly/ burn-in à Xrod and LT software package already compiled and running à L 3 Testing Meeting March 7, 2003 UCSB Status-Anthony Affolder Slide 18
Current Estimated Testing Through-put • Hybrid Arrival Testing à à à • Module Burn-in (Vienna Box) 24 hybrids per day Matches peak production (+ contingency) Requires dedicated tech à à – While burn-in test underway, no module testing possible • Module Basic Test à à 2 ARC LED stands but only 1 hybrid-to-utri version D 12 modules per day Requires dedicated tech Module characterization test will be done at beginning/end of test cycles • ARC After Burn-in Test à Time estimates do not include database entry. After finishing test equipment acquisition/integration, database will be first priority. L 3 Testing Meeting March 7, 2003 See P. Gartung’s talk for details Lack of hybrid-to-utri adapters limits testing through-put to 1 Not clear how much ARC testing necessary after burn-in – Depends on grounding/pickup issues – LED is minimal test UCSB Status-Anthony Affolder Slide 19
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