UCSB Testing Status Anthony Affolder for the UCSB
UCSB Testing Status Anthony Affolder (for the UCSB module testing group) • Current testing infrastructure • Test results • Module test equipment needs Module Testing Meeting March 7, 2003 UCSB Testing Status-Anthony Affolder Slide 1
Current UCSB Testing Setup • 3 ARC Controller + 5 new ARC FE Hybrid Clamshell à ARC crate à 1 Hybrid testing (2 Hybrid clamshells) 2 Module testing (Module clamshell) – LED system – DEPP HV supply • 1 DAQ system à DEPP Module Clamshell Module Testing Meeting March 7, 2003 à ARC Controller • LED Controller Module Burn-in (Vienna Box) See P. Gartung’s talk Status of testing equipment kept up to date at hep. ucsb. edu/cms. UCSB. html UCSB Testing Status-Anthony Affolder Slide 2
UCSB Recent Infrastructure Projects • Hybrid holding plates à à Matches hybrid thermal cycling test stand Can bond and test with low noise in same holder • Burn-in low voltage distribution crate à LED indicators and fuse protection • Crowbar à à HV protection circuit 12 each for FNAL/UCSB • Module cold plate à Attaches to current module holder • Hybrid Clamshell • Module Clamshell Module Testing Meeting March 7, 2003 UCSB Testing Status-Anthony Affolder Slide 3
Testing Facilities • Clean room adjacent to production area Room layout finished à Currently in high bay with intentionally same layout à Clean room will be finished in April à • High Bay (Ground floor) Rod assembly/burn-in à Convenient access to loading dock à Module Testing Meeting March 7, 2003 UCSB Testing Status-Anthony Affolder Slide 4
Test Results (1) • 5 hybrids tested on arrival à à All good, but fail current requirement given in the Procedures for Module Testing Digitization effects cause variations larger than ± 20% • Hybrid noise requirements should be changed à à Ni within 50% of average 0. 3 < Ni < 1. 5 – Removes chance of chips with uniformly low/high noise from passing requirements • See hep. ucsb. edu/cms. UCSB. html for more complete description Module Testing Meeting March 7, 2003 UCSB Testing Status-Anthony Affolder Slide 5
Test Results (2) • 4 hybrids have had APV bonded to pitch adapters à All channels are good • Hybrid clamshells enable testing without large pickup effects at chip edges à à Hybrid isolated with plate and lid grounded Same requirements can be made for hybrids with or w/o PA bonded Module Testing Meeting March 7, 2003 UCSB Testing Status-Anthony Affolder Slide 6
Gain Measurements (1) • Multi-point gain added to ARCS 6. 0 beta software à Thanks to the Aachen group • Tests are very quick and have advantages over pulse shape measurements à à More uniform More stable Gain linearities Gain variations • Strongly suggest that test be all to all M 800 production. Will be included TOB testing à Make requirements on gain slope, offset and fit c 2 Module Testing Meeting March 7, 2003 UCSB Testing Status-Anthony Affolder Slide 7
Gain Measurements (2) • 2 of 24 chips so far have no response with low injection values à Only occurs in peak mode inverter on • Caused by initialization defaults in ARCS tests à VPSP set too low – Thanks to T. Franke and M. Raymond for help • VPSP setting will be modified in new release à Removes all seen irregularities Module Testing Meeting March 7, 2003 UCSB Testing Status-Anthony Affolder Slide 8
Current Estimated Testing Through-put • Hybrid Arrival Testing à à à • Module Burn-in (Vienna Box) 24 Hybrids per day Matches peak production (+ contingency) Requires dedicated tech à à – While burn-in test underway, no module testing possible • Module Basic Test à à à 2 ARC LED stands but only 1 hybrid-to-utri version D XX Modules per day Requires dedicated tech Time estimates do not include database entry. After finishing test equipment acquisition/integration, database will be first priority. Module Testing Meeting March 7, 2003 See P. Gartung’s talk for details Lack of hybrid-to-utri adapters limits testing through-put to 1 à Module Characterization test will be done at beginning/end of test cycles • ARC After Burn-in Test à Not clear how much ARC testing necessary after burn-in – Depends on grounding/pickup issues – LED is minimal test UCSB Testing Status-Anthony Affolder Slide 9
Current Testing Needs • Module Burn-in à à • Hybrid Characterization Will not begin large scale production without module burn-in capability Recent shipment to US meets most hardware needs – Thanks to all involved à à Second Vienna cold box scheduled to arrive in early April hybrid-to-utri adapters and the Torino interlock box biggest needs – See P. Gartung’s talk • Module Testing à à Database input • Hybrid thermal cycling box à à à Lack hardware/software Tests will be performed by A. Honma’s group for M 800 Will aid in manufacturing of test stand • Rods à à Begin to assemble necessary infrastructure for rod assembly/ burn-in Xrod software package already compiled and running IV scan, database input Module Testing Meeting March 7, 2003 UCSB Testing Status-Anthony Affolder Slide 10
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