Transistor Counts 1 Billion Transistors K 1 000

Transistor Counts 1 Billion Transistors K 1, 000 100, 000 1, 000 i 386 80286 100 10 i 486 Pentium® III Pentium® Pro Pentium® 8086 Source: Intel 1 1975 1980 1985 1990 1995 2000 2005 2010 Projected Courtesy, Intel

Design Abstraction Levels SYSTEM MODULE + GATE CIRCUIT DEVICE G S n+ D n+

Not Only Microprocessors Cell Phone Small Signal RF Digital Cellular Market (Phones Shipped) Power RF Power Management 1996 1997 1998 1999 2000 Units 48 M 86 M 162 M 260 M 435 M Analog Baseband Digital Baseband (DSP + MCU) (data from Texas Instruments)

Frequency (Mhz) 10000 Doubles every 2 years 1000 10 8085 1 0. 1 1970 8086 286 386 486 P 6 Pentium ® proc 8080 8008 4004 1980 1990 Year 2000 2010 Lead Microprocessors frequency doubles every 2 years Courtesy, Intel

Die Size Growth Die size (mm) 100 10 8080 8008 4004 1 1970 8086 8085 1980 286 386 P 6 Pentium ® proc 486 ~7% growth per year ~2 X growth in 10 years 1990 Year 2000 2010 Die size grows by 14% to satisfy Moore’s Law Courtesy, Intel

Power (Watts) 100 Power Dissipation P 6 Pentium ® proc 10 8086 286 1 8008 4004 486 386 8085 8080 0. 1 1974 1978 1985 1992 2000 Year Lead Microprocessors power continues to increase Courtesy, Intel

Power will be a major problem 100000 18 KW 5 KW 1. 5 KW 500 W Power (Watts) 10000 100 Pentium® proc 286 486 8086 10 386 8085 8080 8008 1 4004 0. 1 1974 1978 1985 1992 2000 2004 2008 Year Power delivery and dissipation will be prohibitive Courtesy, Intel

Power Density (W/cm 2) 10000 100 Power density Rocket Nozzle Nuclear Reactor 8086 10 4004 Hot Plate P 6 8008 8085 Pentium® proc 386 286 486 8080 1 1970 1980 1990 2000 2010 Year Power density too high to keep junctions at low temp Courtesy, Intel

Challenges in Digital Design µ DSM µ 1/DSM “Macroscopic Issues” “Microscopic Problems” • Time-to-Market • Millions of Gates • High-Level Abstractions • Reuse & IP: Portability • Predictability • etc. • Ultra-high speed design • Interconnect • Noise, Crosstalk • Reliability, Manufacturability • Power Dissipation • Clock distribution. Everything Looks a Little Different ? …and There’s a Lot of Them! 9

10, 000 100, 000, 000 Logic Tr. /Chip Tr. /Staff Month. 1, 000, 000 10, 000 100, 000 Productivity (K) Trans. /Staff - Mo. Complexity Logic Transistor per Chip (M) Productivity Trends 1, 000, 000 58%/Yr. compounded Complexity growth rate 10 10, 000 100, 000 1, 0001 10 10, 000 x 0. 1 100 xx 0. 01 10 xx x x 1 1, 000 21%/Yr. compound Productivity growth rate x 0. 1 100 0. 01 10 2009 2007 2005 2003 2001 1999 1997 1995 1993 1991 1989 1987 1985 1983 1981 0. 001 1 Source: Sematech Complexity outpaces design productivity Courtesy, ITRS Roadmap

Advanced Metallization

Die Cost Single die Wafer Going up to 12” (30 cm) From http: //www. amd. com

Yield

Defects a is approximately 3

Summary • Digital integrated circuits have come a long way and still have quite some potential left for the coming decades • Some interesting challenges ahead – Getting a clear perspective on the challenges and potential solutions is the purpose of this book • Understanding the design metrics that govern digital design is crucial – Cost, reliability, speed, power and energy dissipation