Total Cross Section Elastic Scattering and Diffraction Dissociation

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Total Cross Section, Elastic Scattering and Diffraction Dissociation at the LHC Electronics for Gas

Total Cross Section, Elastic Scattering and Diffraction Dissociation at the LHC Electronics for Gas detectors in TOTEM Walter Snoeys December 8 th, 2006 more documentation: http: //totem. web. cern. ch/Totem/work_dir/electronics Walter Snoeys – CERN – PH – MIC group – TOTEM electronics

Total Cross Section, Elastic Scattering and Diffraction Dissociation at the LHC TOTEM electronics system

Total Cross Section, Elastic Scattering and Diffraction Dissociation at the LHC TOTEM electronics system § Same readout components (including front end chip) for different detectors § For TOTEM gas detectors: compact (integrated) protection Prototype chip + results § New Readout Circuit VFAT: first results Walter Snoeys – CERN – PH – MIC group – TOTEM electronics

Total Cross Section, Elastic Scattering and Diffraction Dissociation at the LHC Roman Pots 3

Total Cross Section, Elastic Scattering and Diffraction Dissociation at the LHC Roman Pots 3 TOTEM Subdetectors T 2 GEM T 1 CSC SPS test y Detector divided in 16 sectors of 32 Si strips 24 pots of 10 planes u v 5 detector planes up to ~10 m away from IP Walter Snoeys – CERN – PH – MIC group – TOTEM electronics 10 detector planes ~15 m away from IP

Total Cross Section, Elastic Scattering and Diffraction Dissociation at the LHC Discharge protection 20

Total Cross Section, Elastic Scattering and Diffraction Dissociation at the LHC Discharge protection 20 cm 2 vs ~14 x 3 mm 2 § Discrete protection structure has been integrated in pitch adapter for APV (design by G. Cervelli and G. Anelli) § For VFAT diodes integrated, no AC coupling Walter Snoeys – CERN – PH – MIC group – TOTEM electronics

Total Cross Section, Elastic Scattering and Diffraction Dissociation at the LHC Integrated protection test

Total Cross Section, Elastic Scattering and Diffraction Dissociation at the LHC Integrated protection test M. Eraluoto, K. Kurvinen, R. Lauhakangas, L. Ropelewski and E. Noschis Walter Snoeys – CERN – PH – MIC group – TOTEM electronics

Total Cross Section, Elastic Scattering and Diffraction Dissociation at the LHC Integrated protection test

Total Cross Section, Elastic Scattering and Diffraction Dissociation at the LHC Integrated protection test Before discharges After discharges Conclusion: discharge protection circuit works correctly Will incorporate it into VFAT (without AC coupling) for gas detector but not into VFAT for silicon Walter Snoeys – CERN – PH – MIC group – TOTEM electronics

Total Cross Section, Elastic Scattering and Diffraction Dissociation at the LHC § LVDS §

Total Cross Section, Elastic Scattering and Diffraction Dissociation at the LHC § LVDS § § CC CC § § VFAT_GEM § § VFAT Walter Snoeys – CERN – PH – MIC group – TOTEM electronics VFAT_GEM Full run with all TOTEM circuits Back from foundry Three circuits submitted: § VFAT in two versions § Coincidence Chip CC § Repeater Chip LVDS Standardization : all TOTEM detectors use the same integrated circuits All features tested in the VFAT so far functional Designers (CERN): P. Aspell, G. Anelli, K. Kloukinas, J. Kaplon, W. Snoeys Designers (C 4 i): H. Mugnier, P. Chalmet

Total Cross Section, Elastic Scattering and Diffraction Dissociation at the LHC Slow Control Data

Total Cross Section, Elastic Scattering and Diffraction Dissociation at the LHC Slow Control Data Treatment Front end VFAT Walter Snoeys – CERN – PH – MIC group – TOTEM electronics § The VFAT came back from the foundry and is on the test bench at the moment. § We are able to pulse each individual channel, obtain trigger and data signals from the chip, program the slow control registers. The noise is sufficiently low even with digital activity. No fault has been detected so far and the results obtained are extremely positive. § This is a very significant success and an important milestone for TOTEM.

Total Cross Section, Elastic Scattering and Diffraction Dissociation at the LHC Walter Snoeys –

Total Cross Section, Elastic Scattering and Diffraction Dissociation at the LHC Walter Snoeys – CERN – PH – MIC group – TOTEM electronics

Total Cross Section, Elastic Scattering and Diffraction Dissociation at the LHC Some VFAT features

Total Cross Section, Elastic Scattering and Diffraction Dissociation at the LHC Some VFAT features § Designed to be clocked at 40 MHz. Maximum clock frequency not yet measured. Clock period determines time resolution. § Every clock cycle data is stored in memory. If a trigger received, full event transferred to readout buffer, from which it will be sent to readout (serial) § Generates a number of trigger bits, immediately upon detecting hit on one of its channels. The chip is divided into a set of configurable sectors. § Designed to accommodate up to 100 k. Hz (at 40 MHz clock) average trigger rate. § Designed for radiation tolerance, both total dose and single event effects § Can test each channel individually § More documentation: see Paul Aspell’s presentation at TWEPP 2007 More details in (http: //totem. web. cern. ch/Totem/work_dir/electronics) Walter Snoeys – CERN – PH – MIC group – TOTEM electronics

Total Cross Section, Elastic Scattering and Diffraction Dissociation at the LHC VFAT tests Walter

Total Cross Section, Elastic Scattering and Diffraction Dissociation at the LHC VFAT tests Walter Snoeys – CERN – PH – MIC group – TOTEM electronics

Total Cross Section, Elastic Scattering and Diffraction Dissociation at the LHC 2006 TOTEM beam

Total Cross Section, Elastic Scattering and Diffraction Dissociation at the LHC 2006 TOTEM beam test Walter Snoeys – CERN – PH – MIC group – TOTEM electronics

Total Cross Section, Elastic Scattering and Diffraction Dissociation at the LHC Conclusions § Standardization

Total Cross Section, Elastic Scattering and Diffraction Dissociation at the LHC Conclusions § Standardization of electronics across detectors § Prototype protection circuit works effectively § Integrated protection on final readout chip (VFAT 2) § Operated Chip with detector in beam test § More documentation TWEPP 2007 § P. Aspell et al. : VFAT § G. Antchev et al. Counting room electronics § Totem collaboration : The TOTEM Electronics system More details in (http: //totem. web. cern. ch/Totem/work_dir/electronics) Walter Snoeys – CERN – PH – MIC group – TOTEM electronics