To a Lep Col module for Time Pix

To a Lep. Col module for Time. Pix 3 Very first stage of development Ideas of Harry and Fred NIKHEF Lep. Col meeting Nikhef May 23, 2016

In. Grid on Time. Pix 3 chip Fred Hartjes Lep. Col meeting. May 23, 2016, Nikhef 2

Concept of Lepcol TPC module § Based on Time. Pix 3 Fred Hartjes Lep. Col meeting. May 23, 2016, Nikhef 3

Lep. Col module top view q How many chips per module? q Minimum two q Not practical q Four may be optimal at the present stage of development q Six? q Eight? q q q Fred Hartjes Lep. Col meeting. May 23, 2016, Nikhef 4

A few words on In. Grid on TPX 3 developent q Recently a production of In. Grid on a TPX 1 wafer in Bonn has been very successful q IZM-7 q Chips can have very high gas gain q Sustain sparking without any problems q Are defect free excellent uniformity q Yevgen now preparing a production on a TPX 3 wafer q Plan B: mounting a dedicated Micromegas foil on a protected TPX 3 chip q Practical identical to In. Grid q Foils due to arrive q Spark tests at Nikhef going on q Silicon substrates q Broken TPX 3 chips Lep. Col meeting. May 23, 2016, Nikhef Fred Hartjes 5

Summary q It is too early to define a project for assembling a Lep. Col TPC q Start with a small building block first q A more or less square module block of 4 may be most practical to use as a building block for a Lep. Col TPC q RO scheme of TPX 3 completely different from that of TPX 1 q Complete redesign of the module needed q Design almost completely driven by RO electronics q Hydrid PCB, flex etc q How to make connections to outer world? q Cooling is not really an issue q Water cooling (vacuum driven) most practical in this stage of development q Field shaping at chip edges crucial q Several options q Field shaping planes q Vertical strips with different potentials Fred Hartjes Lep. Col meeting. May 23, 2016, Nikhef 6