Techniken der Oberflchenphysik Techniques of Surface Physics 2

Techniken der Oberflächenphysik (Techniques of Surface Physics) 2. VL im WS 14/15, 28. 11. 2015 Prof. Yong Lei & Stefan Boesemann (& Liying Liang) Fachgebiet 3 D-Nanostrukturierung, Institut für Physik Contact: yong. lei@tu-ilmenau. de stefan. boesemann@tu-ilmenau. de; liying. liang@tu-ilmenau. de Office: Gebäude V 202, Unterpörlitzer Straße 38 (tel: 3748) www. tu-ilmenau. de/nanostruk Vorlesung: Übung: Mittwochs (G), 9 – 10: 30, C 108 Mittwochs (U), 9 – 10: 30, C 108

Outline for today 0. Introduction and motivation 1. Chemical Vapor Deposition 2. Physical Vapor Deposition 3. Atomic Layer Deposition

Well-controlled pore-opening process to the barrier layer of UTAMs realizing pore-opening and surface nanostructures within the quantumsized range An alumina barrier layer between the pore bottom and the aluminum foil of asprepared PAMs. It has a hemispherical and scalloped geometry. Using acidic etching solutions, the barrier layer can be thinned and finally removed.

Nanodots (top view, Pd) Nanoholes (top view, Si)

Tuning of the shapes and sizes of UTAM-prepared nanostructures To control the structural parameters (shape, size and spacing) is very important Controllable sizes and shapes: The pore diameters of the UTAMs can be adjusted from about 10 to 400 nm to yield nanoparticles of corresponding size. Nanometer-sized discs, hemispheres, hemi-ellipsoids, and conics (by changing the aspect ratio of the pores of the UTAMs, and the amount of material deposited through the UTAMs).

(c) (d) (e) After 18 min etching in 5 wt% H 3 PO 4 solution (30 o. C) The pore diameter is about 10 nm (f) After 24 min etching in 5 wt% H 3 PO 4 solution (30 o. C) After 30 min etching in 5 wt% H 3 PO 4 solution (30 o. C) After 15 min etching in 5 wt% H 3 PO 4 solution (30 o. C) The pore diameter is about 5 nm

Highly ordered nano-hemisphere arrays. Pore diameter, cell size and thickness of the UTAM are about 80, 105, and 240 nm, respectively. The aspect ratio of the apertures of the UTAM is about 1: 3. The average height and base diameter of the nano-hemispheres are approximately 35 -40 and 75 nm, respectively.

Metallic nanotube arrays (by ALD) Cover almost all inner surface of AAO

Positive electrode Sn. O 2/Mn. O 2 NT array o-Sn. O 2/Mn. O 2 etching ALD Sn. O 2 Au evaporation Mn. O 2 a) b) etching Mn. O 2 c-Sn. O 2/Mn. O 2 Grote, Lei, et al. , Journal of Power Sources, 2014, 256, 37 -42. Grote, Lei, et al. , Applied Physics Letters, 2014, 104.

The core material: Nanotube opening Partial etching and mechanical removal

Binary nanowire arrays realized by electrodeposition via template Ti. O 2/Ag Ti. O 2/Au Ti. O 2/Ni

Surface patterning using polystyrene (PS) sphere template The diameter of PS spheres can be controlled within 200 nm - 4. 5 μm Fabrication of Ag Nanoshell Arrays S. Yang, Y. Lei, et al. , Adv. Funct. Mater. , 2010, 2527

3 D Ordered Macro-mesoporous Mo: Bi. VO 4 Synthesised by Polystyrene Spheres Adjustable template with interconnected area Suitable infiltration with high infiltration fraction Controllable dual pore diameter in resulting architectures Applicable to various attractive materials PS template Bi. VO 4 Mo: Bi. VO 4

Methoden zur Herstellung von Oberflächen Strukturen • • • CVD Chemical Vapor Depsosition PVD Physical Vapor Deposition, Sputter coating ALD Atmoic Layer deposition Electrochemical deposition Spin coating Template assisted Lithography EB-Lithography, Photolithography Reactive-ion etching Printing Technology Molecular Beam Epitaxy …

I. Chemical Vapor Deposition • CVD

Types of CVD • CVD: Chemical Vapor Deposition • PE-CVD: Plasma Enhanced CVD • MP-CVD: Microwave plasma-assisted CVD • RPE-CVD: Remote plasma-enhanced CVD • • • MO-CVD: Metal Organic CVD AA-CVD: Aerosol assisted CVD DL-ICVD: Direct liquid injection CVD AP-CVD: Atmospheric pressure CVD LP-CVD: Low-pressure CVD UHV-CVD: Ultrahigh vacuum CVD à Different types of CVDs for different materials, precursors, growthrates, substrates…

Thermal - CVD SOURCE: http: //www. azonano. com/images/Article_Images/Image. For. Article_3423(1). jpg When a conventional heat source (e. g. , a furnace) is used, the technique is called thermal CVD. It consists of a quartz tube inserted into a tube furnace and has a gas inlet on one side and a gas outlet on the other side. The sample is placed onto a quartz boat inside the tube. Example Carbon Nanotubes: Hydrocarbons or CO are used as precursor. A typical growth process involves: 1 st: purge reactor with inert gas; 2 nd: gas flow is switched for specified growth period; 3 rd: gas flow is switched back to inert gas while the reactor cools down. For growth on substrates, catalysts need to be applied on substrate before loading it inside reactor. Typical temperatures for catalytic CVD in CNT growth are in the range of 800– 1500 K.

Reaction Process in CVD Mass transport of the reactant Gas-phase reactions Mass transport to the surface Adsorption on the surface Surface reactions Surface migration Incorporation of film constituents, island formation • Desorption of by-products • Mass transport of by-products • •

Reaction Process in CVD

a) Epitaxial Growth The term epitaxy describes an ordered crystalline growth on a monocrystalline substrate. Because the substrate acts as a seed crystal, the deposited film takes on a lattice structure and orientation identical to those of the substrate Homoepitaxy: a crystalline film is grown on a substrate or film of the same material. This technique can grow more purified films than the substrate, can fabricate layers with different doping levels and layers of different isotopes. Heteroepitaxy: a crystalline film is grown on a substrate or film, but the materials are different from each other. This technique is used to grow e. g. Ga. N on Sapphire or Al. Ga. In. P on Ga. As

Epitaxial Growth Homoepitaxy of Si on a Si substrate Si. Cl 4(g)+2 H 2(g = Si(s)+4 HCl(g) at approx. 1000 -1200 °C

b) Vapor-Liquid-Solid (VLS) growth • Catalytic nanodots on substrate (e. g. UTAM technique) • Equilibrium vapor pressure of the catalyst must be small so that the droplet does not vaporize • Catalyst must be inert

Nanostructures by CVD 1 D Zinc oxide (Zn. O) nanowires and nanorods fabricated by CVD. • diameters from 20 to 300 nm • Length 20 µm Chang et al. Chem. Mater. , Vol. 16, No. 24, 2004

Further Examples of CVD • • Dielectrics: silicon dioxide, silicon nitride… Metal: tungsten, copper, titanium, aluminium … Semiconductors: epitaxial silicon, germanium … Nitrides: Ti. N, Ta. N • Many other nanostructures , such as nanobelts, nanotube, Sn. O 2 nanoboxes…. Sn. O 2 nanoboxe Carbon Nanotube (SEM) Carbon Nanotube (TEM)

CVD Advantages: • high growth rates possible • can deposit materials which are hard to evaporate • good reproducibility • can grow epitaxial films Disadvantages • high temperatures • complex processes • toxic and corrosive gasses

II. Physical Vapor Deposition • Thermal evaporation • Electron beam evaporation • Sputtering

Physical Vapot Deposition - PVD Gas Phase transport evaporation Condensed Phase (mostly solid e. g. Au) condensation Condensed Phase (usually solid)

Thermal evaporation holder Resistance heated evaporation sources Alumina crucible with wired basekt used in Ilmenau

Thermal evaporation • Simple and in widespread use • Common evaporation materials: - Au, Ag, Al, Sn, Cr, Sb, Ge, In, Mg, Ga … - Cd. S, Pb. S, Cdse … • Use W, Ta or Mo filaments to heat evaporation source • Typical filament currents are 200 -300 Amperes • Typical deposition rates are 1 -20 Angstrom/sec. • Can only achieve temperatures of about 1800°C

Electron beam evaporation electron beam heated evaporation source a) thermal evaporation b) mass transport c) condensation and layer growth If particles collide with each other or with other gas particles during the transportation they can lose a part of their energy which is required for the later layer growth. To reduce these energy losses the process pressure has an importan influence because it limits the mean free path (λ) essentially. λ can vary from 68 nm at atmospheric pressure to 105 km in ultra-high vacuum

• • • Electron beam evaporation More complex, but extremely versatile Achieves temperatures up to 3000 °C Typical emission voltage is 8 – 10 k. V Evaporation crucibles in a copper hearth Typical deposition rates 0. 2 -100 Angstrom/second Common evaporation sources - all materials accommodated by thermal evaporation - Ni, Pt, Ir, Rh, Ti, V, Zr, W, Ta, Mo Al 2 O 3, Si. O 2, Sn. O 2, Ti. O 2, Zr. O 2 E-beam evaporation in Ilmenau

Sputtering The substrate is placed in a vacuum chamber with the source material, named a target, and an inert gas (such as argon) is introduced at low pressure. A gas plasma is struck using an RF power source, causing the gas to become ionized. The ions are accelerated towards the surface of the target, causing atoms of the source material to break off from the target in vapor form and condense on all surfaces including the substrate. SOURCE: http: //www. tcbonding. com/images/sput_diagram. gif

PVD advantages disadvantages • Low substrate temperature • Conformal film • Relatively fast process • Comparatively low cost • Excellent thickness control • • • No stoichiometric films By-products incorporated Cracking Peeling No high aspect ratio materials

Evaluation of layer thickness – oscillating crystal The thickness of a layer fabricated by thermal or electron beam evaporation can be measured continuously during the experiment by an oscillating crystal. The measuring method is based on the frequency shift of the oscillating crystal, which is caused by the material being evaporated onto the crystal. Thereby the resonance frequency is decreased with increasing material being deposited. used crystals

• Evaluation of layer thickness – oscillating crystal

Evaluation of layer thickness – oscillating crystal •

Layer thickness Frequency shift for different materials Frequency shift

III. Atmoic Layer Deposition Introduced with a name of Atomic Layer Epitaxy in 1974 by Dr. T. Suntola (Picosun Board Member) Mr. Sven Lindfors (Picosun CTO) and the early ALD reactor in 1978 Picosun ALD in Ilmenau

Principles of ALD is a chemical gas phase thin film deposition method based on alternate, saturative, surface reaction

The ALD process „window“

Factors affecting ALD surface reactions Growth rate in ALD is typically 1Å/cycle or less. • ◦ Cycle time varies ◦ Higher growth rates indicate in most cases the CVD growth • ALD surface reactions can be affected by ◦ Reactivity of the precursor Reaction mode (ligand exchange, dissociation, agglomeration) ◦ Reactivity of the ligand removal agent at the selected temperature ◦ Number of the reactive sites Reaction mode (monofunctional, bifunctional) ◦ Size of the precursor, i. e. steric hindrance

Reviews about ALD mechanisms ‘Atomic layer deposition: an overview’, Chemical Reviews 110, 111 (2010) ‘Surface chemistry of atomic layer deposition: a case study for the TMA/water process’, Journal of Applied Physics 97, 121301 (2005) ‘Atomic layer deposition chemistry: recent developments and futrure challenges’, Angewandte Chemie, international edition 42, 5548 (2003) ‘Atomic layer deposition: from precursors to thin film structures’, Thin Solid Films 409, 138 (2002)

Key advantages of ALD Surface controlled (self-limiting) thin film Ø~100% conformal ØPrecise thickness control ØExcellent uniformity ØPinhole-free films ØRepeatable process ØLow process temperature ØGraded or mixed layers/nanolaminates ØHigh aspect ratio materials

Multiple Materials ‘Atomic layer deposition of transition metals’, Nature Materials 2, 749 (2003)

Ultrathin layer for high k gate As the size of electrical devices is scaled down continuously, it is said that the gate thickness need to be down to 1. 0 nm in the near future. At this point, ALD is the only promising technique. (Zr. O 2, Hf. O 2) ‘Self-aligned ballistic molecular transistors and electrically parrallel nanotube arrays’, Nano Letters 4, 1319 (2004) ‘Parralel core-shell metal-dielectricsemiconductor germanium nanowires for high-current surround-gate FETs’, Nano Letters 6, 2785 (2006)

Thanks for listening Any questions? Das Übungsblatt wird heute Abend online gestellt http: //www. tu-ilmenau. de/nanostruk/teaching/