System Configuration 1 System Maker Applied Materials Inc

System Configuration • 1. System Maker : Applied Materials. Inc • 2. System Model : Centura 5200 • 3. Serial Number : 35605 -03 • 4. Mainframe : Ultima HDP MF w/Multi-Slot • 5. Load Lock : Nerrow Body • 6. Wafer Size : 200 mm SNNF • 7. Chamber Type & Quantity : Chamber : A =Ultima Plus • Chamber : D = Dx. Z • 8. Other Chambers : Ch#E (MSCD) Ch#F Orienter • 9. RF Generator : ETO Generator, RFG-2000 -2 V • 10. RPC : MKS - AX 7670 • 11. Robot Type : HP Robot • 12. Turbo Pump : EBARA – ET 1600 W

PROCESS DATA Chamber “A” HDP (HDP 1. 0 K), Temperature < 400 ℃ Depo Rate Recipe D/T T/V step RF (TOP) RF (SIDE) RF (BIAS) Temp AR AR-T O 2 SIH 4 -T HDP-1. 0 K-R 9. 5” 1100 1000 w 3400 w 2900 w 400℃ 120 16 133 62 10. 6 Item 1 2 3 4 5 6 7 8 9 Thickness 1114 1025 1043 1025 1010 1033 1094 1007 1060 AVG Range Unif. % Depo rate. N GOF 1046Å 107 Å 3. 533 6600Å/min 1. 452 98. 86%

PROCESS DATA Chamber “D” Dx. Z (PE-Si. O 2 1. 0 K) Depo Rate Chamber “D” DXZ ( PE-OX-1. 0 K ) Recipe D/T Servo HFRF Temp Spacing SIH 4 N 2 O PE-OX-1. 0 K-R 8. 7” 2. 7 Torr 270 w 400℃ 550 mils 68 2000 Item 1 2 3 4 5 6 7 8 9 Thickness 1011 1016 1024 1012 1031 1011 1022 1012 1065 AVG Range Unif. % Depo rate N GOF 1023 Å 54 Å 1. 689 7055Å/min 1. 461 99. 33 % Results Chamber D 高沈積率 製程腔體 Real required 7055Å/min >2000Å/min

PROCESS DATA Chamber “D” Dx. Z (PE-Si. N 1. 0 K) Depo Rate Chamber “D” DXZ ( PE-NIT-1. 0 K-R ) Recipe D/T Servo HFRF Temp Spacing SIH 4 N 2 NH 3 PE-NIT-1. 0 K-R 7. 1” 4. 9 Torr 620 w 400℃ 700 mils 220 4000 120 Item Thickness 1 2 3 4 5 6 7 8 9 1012 999 1004 1020 1027 1006 1018 990 1010 AVG Range Unif. % Depo rate N GOF 1010 37 1. 13 8552Å/min 2. 02 99. 8 Results Chamber D 高沈積率 製程腔體 Real required 8552Å/min >2000Å/min