Surface Mount Technology for Process Analytic Sampling Systems

Surface Mount Technology for Process Analytic Sampling Systems Steve Doe, Parker Hannifin Corporation Instrumentation

Surface Mount Technology for Sample Systems: Update 2002 “Surface Mount” Definition: Component’s control function is detachable from its flowpath function Providing increased servicability and flexibility while reducing overall space requirements

Surface Mount Technology for Sample Systems: Update 2002 Surface Mount System Options S a m p l e C o n d i t i o n i n g 1) Parker Integrated Conditioning System (PICS) w/ SP 76 compliant 1½” and 2¼” elastomeric seal interfaces & instrumentation components 2) 1½” compliant interface w/ metallic seals and semiconductor grade & instrumentation components (“old” ultra-high purity “standard”) 3) 11/8” interface w/ metallic seals and semiconductor grade & instrumentation components (emerging ultrahigh purity “standard”) 4) R-Max™ stream switching interface (proprietary)

Surface Mount Technology for Sample Systems: Update 2002 SP-76 Interface Standard (Elastomeric) n Roots in semiconductor industry n Geometrically defines device features to match substrate 1½” Interface n Everything above the interface is device supplier specific n Everything below the interface is substrate supplier specific 2¼” Interface

Surface Mount Technology for Sample Systems: Update 2002 Keys to SP-76 Interface Standard n Specifies 1/8” ID flow channels n Liquid service? n System commonly uses diaphragm valves in lieu of ball valves n Geometry specifications do not allow for captured o-rings; housed in counterbore only n Ideal world would incorporate centerline spacing to support captured o-ring design

Surface Mount Technology for Sample Systems: Update 2002 PICS System n Designed w/ 5 flow channels specifically for the majority of sample conditioning systems n Utilizes 1½” SP 76 (o-ring) compliant elastomeric interface n Incorporates larger 2¼” footprint to utilize existing instrumentation devices; SP 76 (o -ring) compliant n Substrate heating capability available w/ minimal

Surface Mount Technology for Sample Systems: Update 2002 PICS System n Substrate assembled via bolts with tapped holes in head n Bolt interface incorporates dowel pin feature for alignment and added rigidity n O-ring connections between substrate blocks

Surface Mount Technology for Sample Systems: Update 2002 1½” Interface Std 3 channel access 1½” Interface 5 channel access 2¼” Interface 3 or 5 channel access

Surface Mount Technology for Sample Systems: Update 2002

Surface Mount Technology for Sample Systems: Update 2002 1½” UHP System n Designed for delivery of ultra high purity gasses used in semiconductor applications n Recommended for detection thresholds in the PPB range n Utilizes metallic “C” or “W” seals at interfaces; can be adapted for o-rings n Field connections are normally welded faceseal type fittings; however, compression can be instead

Surface Mount Technology for Sample Systems: Update 2002 11/8” UHP System n Same features as 1½” system, only smaller n Emerging as de-facto standard based on desires of leading semiconductor equipment OEM n Cartridge heaters available n Currently in full production

Surface Mount Technology for Sample Systems: Update 2002 Block Assembly & Manifolding

Surface Mount Technology for Sample Systems: Update 2002 R-Max Stream Select System n SP-76 geometrically non-compliant n SP-76 intent compliant

Surface Mount Technology for Sample Systems: Update 2002 Ne. SSI & R-Max Marriage n SP-76 geometrically compliant 1½” blocks for sample conditioning n R-Max for stream switching n Compression fitting interface n Lower cost than same functionality with all-SP 76 block system

Surface Mount Technology for Sample Systems: Update 2002