SUPERIOR FLUX MFG ELECTRONICS PRODUCTS Superior Flux Mfg

SUPERIOR FLUX & MFG. ELECTRONICS PRODUCTS Ø Superior Flux & Mfg. Co. founded in 1932. Ø 1949 introduced Superior Supersafe® No. 30, first Battelle formula flux. Ø 1995 introduced Syber. Gel and Syber. Liquid for repair/rework and hand-soldering. TM TM

PRODUCT LINE Ø Ø Ø Ø Ø Solder Pastes Tacky Fluxes Wave Solder Fluxes Component Tinning Fluxes Wire Tinning Fluxes Hand Solder Fluxes Copper and Nickel Pre-Cleaners Saponifier Descaler Dross Reduction Powder

SOLDER PASTE Ø Ø Ø 3000 Series Conventional No-Clean 4000 Series Synthetic, Low-Residue No. Clean 8000 Series Water-Soluble 9000 Series Rosin Mildly Activated (RMA) Solders: 63 Sn/37 Pb 62 Sn/36 Pb/2 Ag Lead-Free

3000 SERIES NO-CLEAN SOLDER PASTE Ø Classification: IPC ANSI-J-STD 004, Type ROL 0 Ø Meets and exceeds Bellcore standards. Ø Pin-testable post-solder joints. Ø Translucent residue. Ø Capable of printing 12 mil pitch.

4000 SERIES SYNTHETIC NO-CLEAN SOLDER PASTE Classification: IPC ANSI J-STD-004, Type REL 0. Ø Meets and exceeds Bellcore standards. Ø Translucent, protective post-solder residue. Ø Pin-testable post-solder joints. General residue levels of 2. 5 – 3. 3%. In proper conditions, can be as low as 1. 1%. Ø Capable of printing 12 mil pitch. Ø

8000 SERIES WATERSOLUBLE SOLDER PASTE Ø Ø Ø Passes Bellcore Passes IPC Residues are truly water-soluble. Post-reflow residues can be left on boards for extended time and NOT reduce SIR values. Post-solder residues do not foam in aqueous cleaning systems. Capable of printing 12 mil pitch.

9000 SERIES RMA SOLDER PASTE Ø Exceptional reflow profiling characteristics. Ø Capable of printing 16 mil pitch. Ø Superior wetting characteristics. Ø Residues can be aqueous cleaned using Syber. Kleen 2000 Saponifier.

RECOMMENDED REFLOW PROFILE: 63 Sn/37 Pb and 62 Sn/36 Pb/2 Ag

REFLOW PROFILE FOR LEAD-Free

APPLICATION METHODS Ø Screen printing Ø Cartridge printing Ø Dispensing

WHAT SETS SUPERIOR SOLDER PASTES APART? 1. 2. 3. 4. 5. 6. 7. All are non-halide. All have a minimum 12 hour open-time between printing, placement, and reflow. All are formulated for high-speed dispensing. All No-Clean and RMA pastes can be aqueous cleaned in Superior Syber. Kleen 2000 Saponifier. NO slumping. NO tomb-stoning when stencil and reflow profile are properly set. NO white residues on PCBs.

WHAT SETS SUPERIOR SOLDER PASTES APART? (cont. ) Consistent rheology, thixotropy, and viscosity from lot-to-lot. 9. Consistent, clear, pin-testable residues with all No-Cleans. 10. Consistent metal-load due to no prethinning or post-thinning manufacturing process. 11. 4000 Series Synthetic No-Clean residues act as protective barrier against humidity and outside elements. 12. 8000 Series Water-Soluble residues can be washed any time after reflow. SIR values remain the same when PCBs are cleaned three (3) minutes or three (3) days after reflow. 8.

SOLDER PASTE STORAGE Shelf life for all solder pastes extended with freezer-storage first formulations. Freezer Storage (0ºC and below): 9 -12 months. Refrigerator Storage (1 -12ºC): 3 -9 months. Room temperature storage (18 -23ºC): 3 months.

TACKY FLUXES 4000 Ø 3000 Ø 8000 Ø 9500 Ø Synthetic No-Clean Conventional No-Clean Water-Soluble High Temperature Applications: v BGA Attachment and Repair v Custom manufacturing applications v Dispensable applications v Preform soldering

WAVE SOLDERING FLUXES Flux-types Ø No-Clean Ø Water-Soluble Ø RMA Flux-base Ø VOC-FREE Ø Alcohol-based Applications Ø 63 Sn/37 Pb, LEAD-Free.

WAVE SOLDERING FLUX APPLICATION METHODS Ø Spray Ø Foam Ø Drag Ø Wave

NO-CLEAN WAVE SOLDERING FLUXES VOC-Free: v v No. 420 (Spray or Foam) No. 425 Alcohol-based v v No. 312 No. 315 No. 340 RFE 14 Y 3 N All No-Clean fluxes classified as: IPC ANSI J-STD 004 Type ORL 0

WATER-SOLUBLE WAVE SOLDER FLUXES Ø Alcohol-based v No. 84 v RFE 301 -26 C Ø VOC-Free v No. 32 All Water-Soluble fluxes classified as: IPC ANSI J-STD 004 Type ORM 1

ROSIN FLUXES Type R: No. 97 Ø Type RMA: No. 99 Ø Type RA: No. 100 Ø Hi-Temp RA: No. 100 HT Ø Solids content variations are available for all fluxes.

ADDITIONAL PCB ASSEMBLY PROCESS PRODUCTS Ø Syber. Gel TM and Syber. Liquid TM v Hand solder, repair and rework gel or liquid that act as flux and cleaner. Ø Superior Syber. Kleen 2000 Saponifier v Rosin residue removal in aqueous cleaning systems. Ø Superior Descaler v A descaling solution for removing residual build-up that is standard for in-line and batch aqueous cleaners. Ø Superior Dross Reducer v Powder for dross and oxidation removal from solder bath to extend solder life.

COMPONENT TINNING PRECLEANERS & FLUXES Lead tinning for semiconductor, component, and fuse leads. Ø Fluxes formulated for Tin/Lead, Lead-Free, and fusible alloys. Ø Base Metals: Ø v Copper v Nickel v Alloy 42 v Alloy 51 v Kovar v Other specialty alloys

SEMICONDUCTOR AND COMPONENT LEAD PRE-CLEANERS Ø Copper Pre-Cleaner v. VOC-Free, non-hazardous, OA formulation. v. Light, pink color that changes if p. H exceeds a 3. 5 reading. Ø Nickel Pre-Cleaner v. A high activity nickel cleaner that contains no sulfuric acid.

DIFFERENT FLUXES FOR DIFFERENT APPLICATIONS Ø VOC-FREE, HALIDE v No. 30, No. 30 DS, No. 40 MM 4, No. 43 Ø ALCOHOL-BASED HALIDE v No. 45, No. 48 S Ø VOC-FREE, NON-HALIDE v 430 Series Ø ALCOHOL-BASED, NON-HALIDE v No. 435, No. 435 3: 1, No. 91

WIRE TINNING FLUXES Ø No-Clean: Small gage (14 -22) automatic or manual cut/strip/tin operations. v VOC-Free: No. 425 v Alcohol-based: No. 325, No. 334. Ø Water-soluble: Large gage (2 -12) wires; Copper and brass crimped terminal wires. Ø VOC-Free: No. 30 Ø Alcohol-based: No. 45 Applications: Automotive, Industrial, and Appliances.