Suggestions for a MPGD Workshop in Frascati Rui

Suggestions for a MPGD Workshop in Frascati Rui de Oliveira 1

outline • 1 - Rapid presentation of typical manufacturing processes for MPGDs (GEM , Micromegas , R-WELL. . . as examples) • 2 - machines needed • 3 - know-how and manpower needed • 4 - space needed • 5 - cost • 6 - possible synergy with CERN • 7 - time estimate to set-up the workshop and go in “production” • 8 -Futures detectors processes 2

Detector = structures with high local field Electrons liberated by ionization drift towards the anode wire. Electrical field close to the wire (typical wire Ø ~few tens of mm) is sufficiently high for electrons (above 10 k. V/cm) to gain enough energy to ionize further → avalanche – exponential increase of number of electron ion pairs. Cylindrical geometry is not the only one able to generate strong electric field: wire mwpc parallel plate strip hole groove/well 3

By reducing structure sizes MPGDs have improved a lot the detector capabilities in many domains • Micromegas • GEM • Thick-GEM, Hole-Type Detectors and RETGEM • MSHP • MPGD on ASICs : Ingrid • Higher rate • higher granularity • friendly gases • less aging • better energy resolution Ions 40 % 60 % Electrons Micromegas GEM THGEM MHSP Ingrid 4

Process description for a few of them 5

Micromegas Bulk Micro. Megas Process PCB Lamination Standard Bulk Micro. Megas suffers from limited efficiency at high rates due to discharges induced dead time Mesh deposit Lamination Development ATLAS small wheels upgrade project resistive Micro. Megas prototype 6 6

GEM I+ Ions e 40 % 60 % Induction gap Electrons Fabio Sauli 5 µm e- 50 µm 55 µm 70 µm Thin, metal coated polyimide foil perforated with high density holes. 7

GEM process • Double mask • Single mask • Same base material • Hole patterning in Cu • Polyimide etch • Bottom electro etch • Second Polyimide Etch • Limited to 40 cm x 40 cm due to • Mask precision, alignment and cost • Limited to 2 m x 60 cm due to • Base material • Equipment 8

R-Well description (preliminary) Goal: -1 Mhz/cm 2 rate -<100 um spacial resolution -single foil detector -spark protected Micro via + new resistive coating Base material Bottom patterning Diel coating + Microvia + Metalic layer Resistive coating Microwell pattern Dielectric coating Processes needed: -Photolithography -screen printing -Copper plating -Polyimide etching 9

In the 3 examples we can see that chemistry is the main technique to build MPGD. It allows: • • 3 D structure with a size around 100 um Possibility of large sizes Edges defined with a few um accuracy Uses equipment existing in industry 10

outline • 1 - Rapid presentation of typical manufacturing processes for MPGDs (GEM , Micromega , R-WELL. . . as examples) • 2 - machines needed • 3 - know-how and manpower needed • 4 - space needed • 5 - cost • 6 - possible synergy with CERN • 7 - time estimate to set-up the workshop and go in “production” • 8 -Futures detectors processes 11

Machine needed • All kind of machines are interresting • The idea for a good workshop is to group in the same place under the same supervision all kind of technologies. – – – – Photolithography Mechanics Chemistry Screen printing Plasma Laser Ink jet printing • If you can’t put them all, the 4 first are crutial to start something , and Chemistry is probably the first 12

Let’s take the GEM process to see what are the machines behind 13

Image transfert/ Photolithography GEM Base material 5/50/5 Apical NP Laminator Solid resist deposition New: 35 000 CHF Second hand: 10 000 CHF UV lamp Resist exposure New: 18 000 CHF Development machine Solid resist development New: 60 000 CHF 14

Etching/ stripping Etching Copper etching New: 60 000 CHF Stripping Alcaline Resist stripping New: 60 000 CHF Stripping Solvent resist stripping New: 15 000 CHF 15

Chemical polyimide etch Kapton etching Bath + Hood: 15 000 CHF Machine 80 000 CHF 16

Other important equipments 17

Milling -Drilling Milling machine For PCB production New: 70 000 CHF Second hand: 30 000 CHF Drilling machine For PCB production New: 70 000 CHF Second hand: 30 000 CHF 18

Screen printing Screen printer Resist, conductor, dielectric deposit Second hand: 30 000 CHF 19

Press Isostatic press Vacuum gluing under pressure at high temp Honey combs panels, thin flexes , multilayer boards New: 250 000 CHF Second hand : 50 000 CHF 20

Control Binocular with camera X 100 New: 15 000 CHF Microscope with camera X 1000 New: 20 000 CHF 21

ovens Ovens 2 to 3 are needed Up to 300 deg at least for 1 Size depending on application New: 7 000 CHF/ piece 22

Plating holes • Deasmering (or plasma) line – Clean the holes after drilling • Brown oxyde line – Prepare the copper for gluing • Palladium or Carbon pre-coating line • Total investment – 500 000 CHF – Plate dielectrics • Electrolytic copper line – Create thicker copper layers Subcontracting this part is probably a better idea 23

outline • 1 - Rapid presentation of typical manufacturing processes for MPGDs (GEM , Micromega , R-WELL. . . as examples) • 2 - machines needed • 3 - know-how and manpower needed • 4 - space needed • 5 - cost • 6 - possible synergy with CERN • 7 - time estimate to set-up the workshop and go in “production” • 8 -Futures detectors processes 24

Know-how and man power • Two persons is the minimum to start R&D activities • Bachelor or Master in Electronics, Mecatronics • Good Knowledge in chemistry – A connection with an academic institute on chemistry will be a real + • Experience in PCB production • CAD experience on UCAM or GENESIS software • Good knowledge in physics 25

Space needed • Clean room for final cleaning and test 40 m 2 min • Main room around 200 m 2 should be ok – Needs a detailled study to be sure – We have presently 1000 m 2 at CERN • Wet area – DI water production – Water treatment equipment – Fume cupboards for trials – Storage for chemistry 26

Cost • Already given in the talk • Pay attention to hidden costs – Software maintenance – Machine maintenance – Efluents treatments – Chemistry analysis • Fume cupboards and large sinks for chemistry 27

Possible synergy with CERN • What will be your working model? : – R&D or Service workshop • R&D model hidding a bit the activity – – Select the projects Financed by budgets • Service open all your possibilities to any request at any time – – Accept any project Self financed • Hot subjects that could be shared in the future – Resistors production survey – Converter survey – Review all the single board detector , and find a way to protect them – High rate single board protected detectors – Embedded electronics for ultra-thin detectors – Embedded cooling • We should set up regular meetings • We should also exchange personnel 28

To be re-studied 200 mm MSGC Micro dot structures FGLD Dot structures Micro-slit Micro well and groove 29

Time estimate for a working workshop • 1 year to buy all the machines – Market surveys – Buying procedures • ½ Year to connect machines • ½ Year to fill and start machines 30

Futur detector processes • DRIE Plasma – 10 um scale 3 D structures Microbulks Micromegas • Laser ? – 10 um scale patterns are difficult – Carbonization is a really big problem – Large sizes is still a big chalange • Resistive material – DLC : Diamon like carbon – ALD : Atomic layer deposition • Ink jet printing – Open 3 D micron level patterns in large size – Probably cheaper – A new world to discover 31

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Conclusion • • • 500 000 CHF 2 years 220 m 2 2 engineers Good ideas 39

Thank you 40