STMicroelectronics LPS 22 HB Nano pressure sensor Absolute

STMicroelectronics LPS 22 HB Nano pressure sensor – Absolute barometer MEMS report by Sylvain Hallereau November 2016 21 rue la Noue Bras de Fer 44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus. fr www. systemplus. fr © 2016 System Plus Consulting | STMicroelectronics LPS 22 HB Pressure Sensor 1

Table of Contents Overview / Introduction o o 4 Executive Summary Reverse Costing Methodology Company Profile o STMicroelectronics o LPS 22 HB Characteristics 8 Physical Analysis 14 o Synthesis of the Physical Analysis o Physical Analysis Methodology o Package Views & Dimensions ü Package Pin Out ü Package Opening & Wire Bonding Process ü Package Cross-Section ASIC Die ü ü ü o o o o o 96 o o Synthesis of the cost analysis Yields Explanation & Hypotheses o ASIC Die ü ü ü 27 o o MEMS Die ü View, Dimensions & Marking ü Cap Removed & Cap Details ü Cap Holes – Cross-Section ü Sensing Areas Details ü Cross-Section (Sensor, Caps & Sealing) ü Bottom Cap Removed & Details ü Process Characteristics 39 Comparison 67 101 ASIC Front-End Cost ASIC Back-End 0 : Probe Test & Dicing ASIC Wafer & Die Cost MEMS Die ü ü View, Dimensions & Marking Delayering Main Blocks Identification Cross-Section Process Characteristics 73 Global Overview ASIC Front-End Process ASIC Wafer Fabrication Unit MEMS Process Flow MEMS Wafer Fabrication Unit Packaging Process Flow Package Assembly Unit Cost Analysis 17 ü Manufacturing Process Flow 104 MEMS Front-End Cost MEMS Back-End 0 : Probe Test & Dicing MEMS Front-End Cost per process steps MEMS Wafer & Die Cost Component ü Back-End : Packaging Cost per Process Steps ü Back-End : Final Test Cost ü LPS 22 HB Component Cost 110 Estimated Price Analysis 117 Company services 121 © 2016 System Plus Consulting | STMicroelectronics LPS 22 HB Pressure Sensor

Executive Summary Overview / Introduction o Executive Summary o Reverse Costing Methodology o Glossary Company Profile & Supply Chain Physical Analysis This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the STMicroelectronics LPS 22 HB pressure sensor. The LPS 22 HB is an absolute pressure sensor optimized for altimeter and barometer, GPS application and weather station. Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus With dimensions of 2 x 0. 76 mm, it can be integrated in smartphone and wearable electronic. It offers a 60% smaller footprint compared to the previous generation and a 66% smaller volume. Key technical features of the new device include 260 to 1260 h. Pa absolute pressure range, SPI and I²C digital interface and a low current consumption down to 3µA. The LPS 22 HB operates with a supply voltage range of 1. 7 V to 3. 6 V. © 2016 System Plus Consulting | STMicroelectronics LPS 22 HB Pressure Sensor 3

Package View & Dimensions Overview / Introduction • Package: HLGA 10 -pin Company Profile & Supply Chain • Dimensions: 2 x 0. 76 mm • Pin Pitch: 0. 4 mm Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die o Comparison • Marking: C 618 2 mm Manufacturing Process Flow Selling Price Analysis 2 mm Cost Analysis About System Plus Package Bottom View 0. 76 mm Package Top View Package Side View © 2016 System Plus Consulting | STMicroelectronics LPS 22 HB Pressure Sensor 4

ASIC View & Dimensions XXmm Overview / Introduction Company Profile & Supply Chain Die Area: Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die o Comparison XXmm² (XXXXmm) Nb of PGDW per XX-inch wafer: XXX Pad number: Manufacturing Process Flow o Connected: 20 18 Selling Price Analysis About System Plus XXmm Cost Analysis ASIC Die Overview © 2016 System Plus Consulting | STMicroelectronics LPS 22 HB Pressure Sensor 5

MEMS View & Dimensions XXmm Overview / Introduction Company Profile & Supply Chain Die Area: Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die o Comparison XXmm² (XXx. XXmm) Nb of PGDW per XX-inch wafer: XXX Pad number: Manufacturing Process Flow o Connected: 9 9 Selling Price Analysis About System Plus XXmm Cost Analysis MEMS Die Overview © 2016 System Plus Consulting | STMicroelectronics LPS 22 HB Pressure Sensor 6

MEMS Sensor Dimensions Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Package o ASIC Die o MEMS Die o Comparison Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus © 2016 System Plus Consulting | STMicroelectronics LPS 22 HB Pressure Sensor 7

MEMS Front-End Cost Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis o Synthesis o Supply Chain o Yields o ASIC Wafer & Die Cost o MEMS Wafer & Die Cost o Back-End Cost o Component Cost Selling Price Analysis About System Plus © 2016 System Plus Consulting | STMicroelectronics LPS 22 HB Pressure Sensor 8

MEMS Front-End Cost Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis o Synthesis o Supply Chain o Yields o ASIC Wafer & Die Cost o MEMS Wafer & Die Cost o Back-End Cost o Component Cost Selling Price Analysis About System Plus © 2016 System Plus Consulting | STMicroelectronics LPS 22 HB Pressure Sensor 9

Component Cost Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis o Synthesis o Supply Chain o Yields o ASIC Wafer & Die Cost o MEMS Wafer & Die Cost o Back-End Cost o Component Cost Selling Price Analysis About System Plus © 2016 System Plus Consulting | STMicroelectronics LPS 22 HB Pressure Sensor 10

Contact Overview / Introduction Company Profile & Supply Chain Physical Analysis FRANKFURT/MAIN Europa Sales Office Manufacturing Process Flow NANTES Headquarter Cost Analysis Selling Price Analysis LYON YOLE HQ TOKYO YOLE KK PHOENIX YOLE Inc. GREATER CHINA YOLE About System Plus o Company services o Feedbacks o Contact o Legal Headquarters 21 rue La Noue Bras de Fer 44200 Nantes FRANCE +33 2 40 18 09 16 sales@systemplus. fr www. systemplus. fr Europe Sales Office Lizzie LEVENEZ Frankfurt am Main GERMANY +49 151 23 54 41 82 llevenez@systemplus. fr America Sales Office Steve LAFERRIERE Phoenix USA laferriere@yole. fr Asia Sales Office Takashi ONOZAWA Tokyo JAPAN onozawa@yole. fr Mavis WANG GREATER CHINA wang@yole. fr © 2016 System Plus Consulting | STMicroelectronics LPS 22 HB Pressure Sensor 11