STAR Vertex6 based PXL RDO board Design concept

STAR Vertex-6 based PXL RDO board Design concept and items for discussion L. Greiner HFT Hardware 09/23/2010

STAR Outline • Current Xilinx Virtex-5 Design • Proposed new Virtex-6 based design concept • Outstanding questions and areas where clarification is needed. L. Greiner HFT Hardware 09/23/2010 2

Current V-5 Design STAR TCD USB SIU V-5 Dev board Ladder 1 Ladder 3 Ladder 2 SRAM Ladder 4 Misc i/o ADC • Monolithic MB design. • All components are designed onto MB. • Design concept – do not load all functions onto production MBs. L. Greiner HFT Hardware 09/23/2010 3

Proposed V-6 based Design STAR V-6 MB TCD Expansion card Ladder 1 USB 240 T V-6 Advanced Header Interface SRAM ADC Ladder 2 Misc i/o Ladder 3 Advanced Header Interface SIU Ladder 4 SIU USB (shown with possible functionality) • Basic PXL RDO functionality with add-on cards for testing and i/o. • The V-6 MB contains all functionality for production PXL RDO. • Expansion card contains all other needed testing and non-baseline RDO functionality. L. Greiner HFT Hardware 09/23/2010 4

STAR • • • L. Greiner Comments and questions The current data-rate bottleneck in the RDO system is the SIU. (we currently do meet the STAR requirements by a factor of >2 at 1 k. Hz data rate) This gives us an option to add another SIU if needed. This allows us to make the production RDO board as simple as possible but to preserve the needed functionality for testing. There will be only minimal firmware modification needed (pin assignments which are needed for V-6 anyway. Can we run the ADC (320 MHz interface) on a daughter-card? - yes Do we want/need remote configuration? – yes via JTAG We can use a linux friendly USB interface on the expansion card. HFT Hardware 09/23/2010 5

STAR Proposal for the Physical Layout of PXL RDO motherboard L. Greiner 04/10/2011 L. Greiner HFT Hardware 09/23/2010

STAR Total panel IO connector space for production board • 4 x VHDCI 2 layer to maintain possible use with Phase-1, (http: //www. molex. com/pdm_docs/sd/743370011_sd. pdf) We use 100 of the 136 pins arranged so that Ultimate sensor fits on a single cable. – 42. 7 mm x 12. 77 mm • 1 x SIU ~38 mm • 1 x JTAG (daisy chain) ~22 mm • 1 x TCD input (multi-drop) ~50 mm • 1 x USB ~45 mm • 1 x expansion card (room for USB + SIU + ADC inputs + misc i/o outputs on 3 x RJ-45) ~158 mm Total panel space needed (can be front and back of boards) ~326 mm + expansion board space L. Greiner HFT Hardware 09/23/2010 7

STAR VHDCI connector (SCSI-5) 80 MHz DDR (160 MHz effective data rate) Very robust connector and cable mating system L. Greiner HFT Hardware 09/23/2010 8

STAR Proposal to use VME mechanical standard • VME crates exist and are a STAR standard. The components that we need can fit into a 9 U VME form factor board (h)366. 7 mm x (d)340 mm. • Our system consists of 10 RDO boards. Using double wide boards, this fits nicely into a 21 slot VME crate. • A P 1 or P 2 backplane can be used to distribute power and ground (our system uses +5 V only). Which backplane we use depends on other factors such as if we wish to use any of the bussed signals on P 1 (backplane specs here http: //www. elma. com/Admin/Production. Files 1//Product. T ype. File/24/English/VME_Reference_Sheet. pdf) L. Greiner HFT Hardware 09/23/2010 9

STAR Some mechanical design adaptations • Our RDO PCBs are likely to be ~0. 100” thick since they will be ~20 layer. The VME crate has card slots for standard 0. 062” PCBs. • We can make a smaller PCB with mounting holes to allow the top and bottom of the PCB to be 0. 062” and fit into the card slots (h)366. 7 mm x (d)340 mm. VME card guide L. Greiner HFT Hardware 09/23/2010 10

STAR Proposed RDO Board layout SIU VME P 1 Expansion board TCD VHDCI JTAG USB L. Greiner HFT Hardware 09/23/2010 11

STAR Can we use the P 1 for TCD distribution? • We have a bussed backplane, why not use it for TCD distribution? • We can make a 6 U card and do PECL to TTL conversion as well as the BUSY “OR” and install it in the 21 st slot. VME Slot 1 VME backplane CLK, TRG word, etc. BUSY RDO Boards Disadvantages – somewhat harder to test and troubleshoot. Advantage – less connectors on front panel, true bus distribution. L. Greiner HFT Hardware 09/23/2010 12

Proposed 6 U + 10 x 9 U board RDO layout STAR VME P 1 TCD SIU Expansion board TCD 6 U VME Board JTAG USB L. Greiner HFT Hardware 09/23/2010 x 10 13

STAR Testing and conclusions • We will do BER testing for VHDCI + commercial VHDCI cables as a function of length and frequency. A test plan can be found at http: //rnc. lbl. gov/hft/hardware/docs/LVDS/VHDCI _and_cable_testing. docx • We will test the TCD signal transmission over VME P 1 backplane (this is already working for the existing STAR TCD system) • This is the current PXL RDO motherboard design implementation of choice. L. Greiner HFT Hardware 09/23/2010 14