Some Approach on CPU Cooling By Yizhong Wang

Outline • Motivation • Microfluidic Heat Sink • Nanofluid • Summary ME 3007 Presentation by Yizhong Wang

Motivation ME 3007 Presentation by Yizhong Wang

Motivation Intel Dual Core Xeon Model Clock Speed Power Speed: Power ratio [MHz/W] 5140 2. 33 GHz 65 W 5150 5160 7120 M 7130 M 2. 66 GHz 3. 00 GHz 3. 20 GHz 65 W 41. 0 80 W 37. 5 95 W 31. 6 150 W 7140 M 3. 40 GHz 150 W 7150 N 3. 50 GHz 150 W 23. 3 ME 3007 Presentation by Yizhong Wang

Motivation Passive Heat Sink Cooler (Fin) + Fan -> Forced Convection ME 3007 Presentation by Yizhong Wang

Motivation Water Cooling in Industry: Water Intake for Nuclear Power Plant Cooling ME 3007 Presentation by Yizhong Wang

Microfluidic Heat Sink Specific Heat Capacity J/(g. K) Density g/L Thermal Conductivity W/(m. K) Air 1. 012 Water 4. 1813 1. 2 1000 0. 025 0. 6 ME 3007 Presentation by Yizhong Wang

Microfluidic Heat Sink ME 3007 Presentation by Yizhong Wang

Microfluidic Heat Sink Channel : L=27 mm, W=100 um, Spacing=40 um H=50 um, 64 Channels ME 3007 Presentation by Yizhong Wang

Microfluidic Heat Sink Average Speed 1. 537 m/s 1. 662 m/s 1. 791 m/s 1. 923 m/s 2. 057 m/s 2. 194 m/s 2. 333 m/s 2. 474 m/s 2. 617 m/s Flow Rate cm 3/s 0. 4917 0. 5319 0. 5732 0. 6153 0. 6588 0. 7021 0. 7466 0. 7918 0. 8374 Pressure Change 100 K Pa 100 K Pa 100 K Pa Re 204 238 277 319 365 416 470 529 591 Heat Transfer Q (W) 61 78 96 116 137 161 187 215 245 Outlet Temperature 55 60 65 70 75 80 85 90 95 ME 3007 Presentation by Yizhong Wang

Microfluidic Heat Sink ME 3007 Presentation by Yizhong Wang

Nanofluid ME 3007 Presentation by Yizhong Wang

Discussion and Summary • Air Cooling reaching it limit • Water (liquid) cooling will be the next generation • Nanofluid have great potential in cooling • Particle Deposition • Evaporation and Refill ME 3007 Presentation by Yizhong Wang