Silicon Wafer Japan TC Chapter Liaison Report For

Silicon Wafer Japan TC Chapter Liaison Report For NA Silicon Wafer TC Chapter Meeting In conjunction with NA Spring Standards Meetings

Leadership • Committee Co-chairs – Naoyuki J. Kawai/ Independent – Tetsuya Nakai/ SUMCO • Leadership Changes – None 2

TC Chapter Organization Japan Silicon Wafer Naoyuki Kawai (Independent) Tetsuya Nakai (SUMCO) Int’l Test Method TF Ryuji Takeda (Global. Wafers Japan) Int’l AWG TF Satoshi Akiyama (Raytex Optima) Int’l Polished Wafers TF Yasuhiro Takamori (Global Wafer Japan) Int’l Epitaxial Wafers TF Naohisa Toda (Shinetsu Handotai) JWG TF Satoshi Akiyama (Raytex Optima) Masanori Yoshise (Freelance) Int’l ASI TF Masami Ikota (Hitachi High Technologies) Int’l Annealed Wafers TF Koji Araki (Global Wafers Japan) Int’l SOI Wafers TF Atsushi Ogura (Meiji Univ) Tetsuya Nakai (SUMCO) Fiducial Mark Interoperability TF Int’l 450 mm Shipping Box TF Shoji Komatsu (Acteon NEXT) Japan Test Method TF Ryuji Takeda (Global. Wafers Japan) Tsuyoshi Otsuki (Shin-Etsu Handotai) Mikako Omata (SCAS) Surface Metal Chemical Analysis WG Ryuji Takeda (Global Wafers Japan) Ryo Machida (SCAS) BMD DZ WG Satoshi Akiyama (Raytex Optima) Kazuo Moriya (Raytex Optima) GOI WG Tsuyoshi Otsuki (Sinetsu Handotai) Surface Organic Contaminant Analysis WG Mikako Omata (SCAS) JA Shipping Box TF Shoji Komatsu (Acteon NEXT) Tsuyoshi Nagashima (Miraial) Tetsuya Nakai (SUMCO) Int’l Terminology TF Tetsuya Nakai (SUMCO) Bulk Heavy Metal Analysis By Electrical Measurement WG Masaru Akamatsu (KOBELCO) Shingo Sumie (KOBELCO)

Meeting Information • Past/Last Meeting – December 15, Thursday, 2016 at Conference Tower, Tokyo Big Site, Tokyo, Japan – March 10, Friday, 2017, SEMI Japan Office • Next Meeting – June 16, Friday, 2017, SEMI Japan Office

JSNM • Japan Society of Newer Metals (JSNM) takes over the functionality of the Committee, including management related to JIS standards based on JEITA standards • JSNM Material Standards Study Group for Semiconductor Supply. Chain(M 4 S) is established on April 1, 2016 to take over JETTA Silicon Wafer Technology Committee. – Three standardization activities are on going for 1. Measurement for Low carbon concentricity upto 5 E 14 atoms/cm 3 in silicon mono crystalline by FT-IR. (Starting for RR test) 2. Measurement for Low Carbon concentricity upto 1 E 13 atoms/cm 3 in silicon mono crystalline by Photo Luminescence Technology. (Discussing test procedures) 3. Measurement for resistivity in Epi layer with 1% accuracy. (Not yet started) 5

Ballot Review at the meeting on December 15 • Ballots passed the TC Chapter Review – 6043, Line Item Revision to SEMI MF 28 -0707 (Reapproved 0912) Test Methods for Minority Carrier Lifetime in Bulk Germanium and Silicon by Measurement of Photoconductivity Decay –passed as is – 6044, Line Item Revision to SEMI MF 673 -1014 Test Methods For Measuring Resistivity Of Semiconductor Wafers Or Sheet Resistance Of Semiconductor Films With A Noncontact Eddy-current Gauge –passed as is – 6045, Line Item Revision to SEMI MF 928 -1014 Test Methods For Edge Contour Of Circular –passed as is – 6046, Line Item Revision to SEMI MF 1982 -0714 Test Methods For Analyzing Organic Contaminants On Silicon Wafer Surfaces By Thermal Desorption Gas Chromatography – passed as is – 6047, Reapproval of SEMI MF 728 -1106 (Reapproved 1111) Practice for Preparing an Optical Microscope for Dimensional Measurements –passed as is (super clean) – 6048, Reapproval of SEMI MF 978 -1106 (Reapproved 1111)Test Method for Characterizing Semiconductor Deep Levels by Transient Capacitance Techniques – passed as is (super clean) • Ballot failed the TC Chapter Review – 6042, Line Item Revision to SEMI MF 1763 -0706 (Reapproved 1111)Test Methods for Measuring Contrast of a Linear Polarizer – failed 6

Authorized Activities at the meeting on December 15 • December 15, 2016 – Line Item Revision to SEMI M 1, MF-1390 and M 59, to be consistency among these three document for Bow Metrics and add illustration of Shape Metrics in M 1 (International AWG) • Note that this proposal will be withdrawn and separate proposal for line item revision just for MF 1390 will be introduced at the NA TC Chapter meeting in conjunction with NA Spring Standards Meetings. • March 10, 2017 – Reapproval of M 31 -0708 Mechanical Specification for Front-Opening Shipping Box Used to Transport and Ship 300 mm Wafers • Note: Line-item ballot is appropriate for this document with accordance with Table A 4 -1 -5 in the PM. This will be addressed at the next meeting. 7

Five-year Review • Reapproval of M 31 -0708 Mechanical Specification for Front-Opening Shipping Box Used to Transport and Ship 300 mm Wafers – Note: Line-item ballot is appropriate for this document with accordance with Table A 4 -1 -5 in the PM. This will be addressed at the next meeting. 8

SNARF Project Period Review • Extended a project period – 5737: Revision of SEMI MF 1391 -1107, Test Method for Substitutional Atomic Carbon Content of Silicon by Infrared Absorption • The following documents will be reviewed at the next TC Chapter meeting – 5769: New Standard: Test Method for Nitrogen Content in Silicon by Infrared Absorption – 5770: Test Method for Bulk Micro Defect Density and Denuded Zone Width in Annealed Silicon Wafers – 5772: Revision of MF 391 -0310: Test Methods for Minority Carrier Diffusion Length in Extrinsic Semiconductors by Measurement of Steady -state Surface photovoltage – 5774: Sample Preparation Method for Minority Carrier Diffusion Length Measurement in Silicon Wafers by Surface Photovoltage Method 9

TF/ WG/ SG Reports -1 • International 450 mm Shipping Box Task Force / JA Shipping Box Task Force – The TF decided not to address on standardization for re-use 300 mm shipping. • International Advanced Wafer Geometry Task Force / Japan AWG Task Force – Activity to be consistency of Bow Metrics between M 1 and MF 1390. • International Test Method Task Force / Japan Test Method Task Force – Doc. 5737 B : Revision of SEMI MF 1391 -1107 (Reapproved 0912), Test Method for Substitutional Atomic Carbon Content of Silicon by Infrared Absorption will be submitted to earlier ballot cycle in 2017 • International Advanced Surface Inspection Task Force – Drafting Doc. 6096: Line Item Revision to SEMI M 53 -0216 Practice for Calibrating Scanning Surface Inspection Systems Using Certified Depositions of Monodispere Reference Spheres on Unpatterned Semiconductor Wafer Surfaces (Addition of a related information section to SEMI M 53 regarding the relationship of calibrated sizes assigned to defects by surface inspection systems to their actual physical size )

TF/ WG/ SG Reports -2 • International Terminology Task Force – No special report from the task force but Japan TC Chapter discussed how to maintain terminology in future and candidate options are: • To maintain as Aux document, this idea was withdrawn • To keep M 59 with inactive status and new terminology will be defined in each document • To continue to reapprove and issue the revision ballot when needed – In any cases, there are some issues to be discussed and Silicon Water Global Technical Committee needs to get some consultation from Regulations Subcommittee. – Following the discussion during NA Spring Standards Meetings, the Japan TC Chapter will develop the proposal at the next meeting – Formal discussion will be held at GCS in SEMICON WEST 11

TF/ WG/ SG Reports -2 • International SOI Wafers Task Force – No special report • International Polished Wafers Task Force – No special report • International Epitaxial Wafers Task Force – No special report • International Annealed Wafers Task Force – No special report • Fiducial Mark Interoperability Task Force – This task force is under process of disbandment. – Japan Silicon Wafer TC Chapter agreed to disband this task force with all agreement of other Technical Committees in Japan chapter, PI&C, Packaging and Traceability.

Other topics • Proposal of New Standards, Specification for Lamella Carriers Used in Transmission Electron Microscopes – According to the decision at the EU TC Chapter meeting in October during SEMICON Europa 2016, the meeting to introduce proposal was held on December 13 at SEMI Japan Office in conjunction with SEMICON Japan 2016 • Back ground of this standardization • Presentation on “Enabling HVM TEM metrology support - standards for TEM lamella carriers” • Proposed drafts of SNARF and TFOF – Conducting Survey has been decided at the Japan PI&C TC Chapter Meeting • Currently contents of survey form is under drafting. 13

Thank you! Staff Contact Junko Collins SEMI Japan jcollins@semi. org