Sensor PCB info Dean Forshaw Hamamatsu PCB GND

Sensor PCB info Dean Forshaw

Hamamatsu PCB GND 2 GND 1 Each sensor can be connected/disconnected via 2 pin jumper GND for each sensor is bonded to large pad behind sensor labeled GND 1 or GND 2 GND 1 &/or GND 2 are connected to Common GND via jumpers (labeled P 1, P 2) Many HV/common GND pads for wire bonding to hybrid – USE ANY Com GND HV Com GND HV Com GND Sensors sit on HV pad – not extra backside connection needed, if topside bias is used wire bond to any HV pad, there should be lots of redundant HV metal surrounding the sensors

Hamamatsu PCB + mech Glue sensors over cutout area Align with PA’s on hybrid plate *sensor positions are centered on beetle chip locations (hybrid) Wire bond all channels (or as many as possible) Use any Common GND or HV connection between hybrid and PCB (jumpers still need to be added before shipping)

Hybrid Assembly In all cases wire bond all beetle chips (back and front end) Use same glass PA’s for all 4 hybrids (95 um pitch), populate 4 PA’s per hybrid, one for each beetle chip

Hamamatsu PCB + mech Type-D sensor can beglued and wire bonded either way around. Type-A mini’s should be mounted so that the fanup PA will be wire bonded to the beetle + glass PA (see below for GDS) In both cases the hybrid will use the same pitch glass PA’s between sensor and beetle chips

Sensor contacts Topside contact (HV) Bias Ring (GND)

What gets Assembled – B 1 Board 1: (highest priority) • 2 x type-D mini @5 e 14 glued to PCB • 1 type-d will have backside passivation and one sensor will not • Position 1: sensor with passivation (connect topside contact to HV), connect bias ring to GND 1 • Non-conducting glue OK for attachment of sensor • Position 2: sensor without passivation (do not connect topside contact to HV), connect bias ring to GND 2 • Conducting glue along back edge opposite to Beetle. Non-conducting elsewhere. • Wire bond every strip (~95 um pitch) to Glass PA on hybrid plate. 1 2

What gets Assembled – B 2 LE M B Board 2: A EA L I A TB V A TES T • 2 x type-D mini @10 e 14 glued to PCB O OV N • 1 type-d will have backside passivation and 1 sensor will not N R • GLUE SENSORS DOWN WITH SILVER EPOXY O F • Position 1: sensor with passivation (connect topside contact to HV), connect bias ring to GND 1 • Non-conducting glue OK for attachment of sensor • Position 2: sensor without passivation (do not connect topside contact to HV), connect bias ring to GND 2 • Conducting glue along back edge opposite to Beetle. Non-conducting elsewhere. • Wire bond every strip (~95 um pitch) to Glass PA on hybrid plate. 1 2

What gets Assembled – B 3 Board 3: 2 x type-A mini @1 e 14 glued to PCB 1 type-A will have backside passivation and 1 sensor will not GLUE SENSORS DOWN WITH SILVER EPOXY Position sensors so that Fanup PA will be wire bonded to hybrid Position 1: sensor with passivation (connect topside contact to HV), connect bias ring to GND 1 • Non-conducting glue OK for attachment of sensor • Position 2: sensor without passivation (do not connect topside contact to HV), connect bias ring to GND 2 • Conducting glue along back edge opposite to Beetle. Non-conducting elsewhere. • Wire bond every sensor PA pad (~75 um pitch) to Glass PA on hybrid plate. Or as many channels as possible • • • 1 2

What gets Assembled – B 4 Board 4: 2 x type-A mini @5 e 14 glued to PCB 1 type-A will have backside passivation and 1 sensor will not GLUE SENSORS DOWN WITH SILVER EPOXY Position sensors so that Fanup PA will be wire bonded to hybrid Position 1: sensor with passivation (connect topside contact to HV), connect bias ring to GND 1 • Non-conducting glue OK for attachment of sensor • Position 2: sensor without passivation (do not connect topside contact to HV), connect bias ring to GND 2 • Conducting glue along back edge opposite to Beetle. Non-conducting elsewhere. • Wire bond every sensor PA pad (~75 um pitch) to Glass PA on hybrid plate. Or as many channels as possible • • • 1 2

Bonding Diagrams + Details 11

HV bias & return from hybrid to PCB Bias Return Bias HV Jumper (glue down) Bias return Bias HV Hybrid 12

Type D mini (Board 1) Bias return (GND) [ Inner of the two pads] 3 wirebonds to GND pad Bias return 1 Passivated back side 2 Unpassivated back side Blowup of edge Sensor: 95 um pitch 128 ch. Glass PA: 40 um 95 um pitch GND Wirebond all 128 channels ** For sensor 2 DO NOT MAKE the HV wirebonds only the bias return wirebonds Hybrid Topside HV contact 3 wirebonds 13

Type A mini (Board 3, 4) Bias return (GND) [ Inner of the two pads] 3 wirebonds to GND pad 1 Blowup of edge Passivated back side 2 Unpassivated back side GND Sensor: 75 um pitch pads (64 channels) Glass PA: 40 um 95 um pitch Angled wirebonds: 75 um 95 um. Hybrid ** For sensor 2 DO NOT MAKE the HV wirebonds only the bias return wirebonds Topside HV contact 3 wirebonds Wirebond as many consecutive Si sensor channels as possible (preferable to do it same for sensor 1 and 2) 14

Details • Beetle & Glass PA: • Beetle: Quick-cure, non-conducting epoxy OK, but also put a dab of Silver epoxy for electrical contact. • Glass PA: quick cure, non-conducting epoxy fine. • Wirebond (frontend + backend) all 4 Beetles + glass PAs (40 um 95 um) • Sensor gluing (2 sensors/module for all 3 modules) • Sensor 1: Glue down sensors with non-conducting epoxy, fast cure epoxy is fine. • Sensor 2: Fast cure epoxy along wirebond edge is OK. Use CONDUCTING EPOXY along back edge to make electrical contact. Bias connection being made via this epoxy connection. • Bias connection: • Sensor 1: 3 wirebonds for HV bias and 3 for return. You may use any of the corners of the sensor that is convenient. • Sensor 2: Do not make bias wirebond connection on sensor 2. It’s bias comes in through contact with the gold ring on the PCB (through the conducting epoxy). • Signal connections (Si sensor to Glass PA): • Board 1 (D Type): all channels connected. • Boards 2, 3: As many consecutive channels as possible. Max angle ~10 o for 4 mm bond length. Try to make sensor 1 & 2 the same bonding configuration. 15