Reliability of Low PitchHigh IO Area Array Packages

Reliability of Low Pitch/High I/O Area Array Packages FY 07 - New Description: Develop qualification guideline based on reliability test data and quality assurance indicators for low pitch (1 mm and less) and high I/O area array packages and assemblies most applicable for NASA use. Qualification guideline will cover the following: ü Long-term thermal cycles-to-failure test data performed using baseline thermal profile (-55/100°C) and military cycle (-55/125°C) for more than 1, 000 thermal cycles for about 50 package assemblies using 700 -1200 I/O packages. Update failure/optical/X-section data gathered during FY 07 due to no failures for a number of packages. ü Thermal cycle test data performed using a more severe environment (-65/150°C) and Mars environment (-120/85°C) for a few package assemblies. ü Reliability analyses of these data in conjunction with literature information to enable definition of key quality and reliability indicators for effective design and process controls. ü Body of knowledge and test matrix developed for low pitch/High I/O area array package ü Design of experiment and test matrix for low pitch/High I/Os Schedule/Costs: PCK-1 FY 07 Plans: ü Complete thermal cycle of CCGA 1144 I/Os to failure ü Gather quality/reliability test data ü Review ceramic packages and select one or two that most applicable for use in the next generation of NASA flight projects ü Establish teaming and leveraging as needed ü Design board/acquire parts/stencil ü Establish process and assemble packages on board ü Perform inspection and initiate thermal cycling ü Continue collaboration with RIT on design/build of board with a PBGA 1156 I/O package, 1 mm pitch, and other packages ü Order parts and assemble at RIT/JPL ü Inspection and start thermal cycling Deliverables: ü Guideline document covering an update on literature search and quality indicators and reliability test data, and including recommendations for qualification of low pitch/high I/O area array package for NASA systems ü Support info into NASA Packaging roadmap NASA and Non-NASA Organizations/Procurements: FTE = 0. 45 Lead Center/PI: JPL, Dr. Reza Ghaffarian All package/PWB, and additional equipment needed are included in the overall budget