Provisional draft NCPs Meeting Brussels 19 October 2006

Provisional draft NCPs Meeting Brussels, 19 October 2006 ICT Work Programme 2007‐ 08: Activities under Challenge 3 Erastos Filos Directorate “Components & Systems” European Commission, Brussels EF_to_NCPs. Mtg_Challenge 3 ‐ 1

Provisional draft Presentation outline • R&D in electronics & its key role for Europe’s competitiveness • Challenge 3 rationale • Foreseen activities under Call 1 • Foreseen activities under Call 2 • Joint Technology Initiatives – a way to implement ETP Strategic Research Agendas EF_to_NCPs. Mtg_Challenge 3 ‐ 2

Provisional draft The pervasiveness of electronics … Source: Future Horizons, IFS 2005, Jan 2005 € 30, 050 bn Electronics underpins every business sector € 1, 050 bn € 210 bn € 38 bn EF_to_NCPs. Mtg_Challenge 3 ‐ 3 World GDP Electronic Equipment Semiconductors Investment: Materials & Equipment

Electronics: Key to intelligent products Provisional draft • Smarter products: • Electronic safety • Driver customisation • Resource‐efficient products: • Fuel efficiency • Info‐mobility & traffic management • ICT‐enabled disposal • Value‐adding services: • Active safety features • Remote diagnostics & assistance • Infotainment & travel guidance EF_to_NCPs. Mtg_Challenge 3 ‐ 4 By 2010, electronics & software in cars will account for up to 40% of their value

Provisional draft Europe ‐ losing the game ? • Europe – a net importer of electronics • Aggressive global competition: Asia 2/3 of world semiconductor market & 3/4 share in investment • A typical semiconductor fabrication facility costs € 2. 5 billion Source: European Semiconductor Industry Association, 2005 EF_to_NCPs. Mtg_Challenge 3 ‐ 5

Provisional draft • European microelectronics achievements World top‐ 10 list of semiconductor companies: – – – • 1990: 1 European company 2004: 3 European companies 2006: ? Equipment: – Wafer processing: • • – 2 European companies on top 10 list Consensus building in nanoelectronics – VLSI Research 2003 Assembly equipment: • • 5 European SMEs on top 10 list Europe’s big 2 (ASML and ASM Int’l) on top 10 Strategic public‐private partnership EF_to_NCPs. Mtg_Challenge 3 ‐ 6 www. eniac. eu

Challenge 3: Components, Systems, Engineering Provisional draft To enable Europe’s industry to stay at the forefront of electronics developments & applications through chip making, integration & embedded systems capabilities www. eniac. eu www. artemis-office. org www. photonics 21. de www. smart-systems-integration. org R&D objectives are in line with Strategic Research Agendas of European Technology Platforms & support international co‐operation under the Intelligent Manufacturing Systems initiative cordis. europa. eu/ims EF_to_NCPs. Mtg_Challenge 3 ‐ 7

Provisional draft Foreseen activities under Call 1: 3. 3. 1. 1: Next‐Generation Nanoelectronics Components & Electronics Integration 3. 3. 1. 2: Organic & Large‐Area Electronics & Display Systems 3. 3. 1. 3: Embedded Systems Design 3. 3. 1. 4: Computing Systems

Next‐Generation Nanoelectronics Components & Electronics Integration Provisional draft • Smaller, higher performance, lower cost: − “More Moore” − Beyond CMOS • Integration & diversification: − So. C: Systems‐on‐Chip − Si. P: Systems‐in‐Package Technology materials, processes, metrology, interconnects, modelling, packaging, architectures Call 1: € 86 mn CP, No. E, CSA Design increased complexity, changed performance, heterogeneity in Si. P & So. C, productivity & “Design for Manufacturing” Manufacturing Cost-efficient, flexible production for silicon < 45 nm; for So. C & Si. P; 450 mm wafer size; small batch/fast cycle time; equipment assessment

Organic & Large‐Area Electronics & Display Systems Provisional draft • Organic & large-area technologies: Call 1: € 63 mn CP, No. E, CSA – Large‐area & low‐cost manufacturing – Advanced modelling, simulation & circuit design characterisation – Enabling functions: • logic, memory, e‐paper, systems‐on‐tags, RFIDs, lab‐on‐chip, lighting, signage, energy scavenging/storage & power management • Advanced display systems: – Visualisation systems supporting • Multi‐viewer unaided, unrestricted 3 D‐viewing & natural interaction – Signal acquisition, processing & representation for 3 D‐systems – Portable display systems • Zero‐power displays, ruggedised displays • Flexible/transparent devices • Energy‐efficient micro‐projectors • Lightweight high‐resolution vision glasses EF_to_NCPs. Mtg_Challenge 3 ‐ 10

Provisional draft Embedded Systems Design • Target outcomes Call 1: € 40 mn CP, No. E, CSA – Theory & methods for embedded systems design Key issues: heterogeneity, composability, predictability & adaptivity • International cooperation is encouraged • – Suites of interoperable design tools for rapid design & prototyping • Research will contribute to interoperability of tools from SME vendors; consolidating tool developers’ joint R&D work; pen tool frameworks • Expected impact – Increase system development productivity (at least 1 order of magnitude) – Stimulate growth of European high‐tech companies in the field – Reinforce S&T leadership in complex systems engineering EF_to_NCPs. Mtg_Challenge 3 ‐ 11

Provisional draft Computing systems • Target outcomes – Novel architectures for multi‐core computing systems Architectures & system software for scalable & customisable on‐chip computing systems incorporating multiple networked, symmetric or heterogeneous, fixed or reconfigurable processing elements • Key issues: power & performance versatility; reliability & availability • Call 1: € 25 mn CP (STREP), No. E – Reference architectures for generic embedded platforms • Key issues: composability, networking, robustness/security, diagnosis/ maintainability, resource management, evolvability & self‐organisation • Expected impact – Inexpensive generic platforms with high European added value enabling European supplier companies to increase market share – Develop European competences in the use of high‐end computing for the development of new applications – European excellence in computing architectures, system software & platforms EF_to_NCPs. Mtg_Challenge 3 ‐ 12

Provisional draft Foreseen activities under Call 2: 3. 3. 2. 1: Photonic components & subsystems 3. 3. 2. 2: Micro/Nanosystems 3. 3. 2. 3: Networked Embedded & Control Systems

Photonic Components & Subsystems Provisional draft Components & Subsystems Core € 90 mn CP, No. E, CSA Integration Complementary measures Support measures ‐ ‐ ‐ Lasers & solid‐state sources ‐ Image sensors ‐ New sensors Call 2: Underlying technologies Application specific Broadband core networks Broadband access & LAN Medical diagnosis & prevention Sensors for environment, safety & security applications Manufacturing Assessment of prototypes Access: Expertise centres & foundries Design methodology & tools Networking, integration & structuring Education: Young people & graduates Consensus building: R&D strategies, int’ cooperation

Provisional draft Micro/Nanosystems • Next generation smart systems • Nano‐Bio‐ICTechnologies convergence • Smart fabrics and interactive textiles • From smart systems to viable products • Innovative memory systems • Support actions Sensor- & actuator-based systems Biosensors, lab-on-a-chip, bio. MEMS, autonomous implants Integration of intelligence in textile materials Microsystems manufacturing technologies Emerging technologies for high density mass storage capacity Technology access, education and training, coordination & dissemination at EU level Call 2: € 83 mn CP, No. E, CSA EF_to_NCPs. Mtg_Challenge 3 ‐ 15

Provisional draft Networked Embedded & Control Systems • Target outcomes – Middleware platforms for embedded systems • • Call 2: € 47 mn CP, No. E, CSA Key issues: composability, minimum power consumption, openness Emphasis: programmability, reconfiguration, privacy & trust – Cooperating objects and Wireless Sensor Networks • • Spontaneous cooperation of objects in spatial proximity Emphasis on new methods & algorithms, hardware/software platforms for distributed execution & programming & tools for self‐organising systems – Control of large‐scale complex distributed systems • • Key issues: efficiency, robustness, safety, security Applications: manufacturing plants, infrastructures • Expected impact • • • Enable entirely new services & applications Make large infrastructures more efficient, flexible & productive 100% plant availability, reduce maintenance & accidents EF_to_NCPs. Mtg_Challenge 3 ‐ 16

Provisional draft European Technology Platforms A spiral model of innovation capitalising on the multiple reciprocal relationships between public & private stakeholders at various knowledge stages POLICY RESEARCH BUSINESS 30+ European Technology Platforms launched so far: • • • Addressing major technological challenges in specific domains Aiming to leverage public & private investment for R&D & innovation Involving key R&D stakeholders — eg industry, the research community & public authorities • Bundling fragmented R&D efforts towards agreed goals — Vision 2020 document & Strategic Research Agenda cordis. europa. eu/technology-platforms EF_to_NCPs. Mtg_Challenge 3 ‐ 17

Provisional draft Joint Technology Initiatives: A way to implement a Strategic Research Agenda 1. Emergence & setting up: – „Bottom‐up“ process with key stakeholders in a specific domain – Key deliverable: Strategic vision document 2. Definition of a Strategic Research Agenda – Co‐ordinated by an Advisory Council – Consensus‐based – Deployment strategy 3. Implementation of the Strategic Research Agenda ‐ Through collaborative research in FP 7 & with other resources, or ‐ Through a Joint Technology Initiative (JTI) which integrates funding sources, eg Framework Programme, transnational & nat’l research programmes, industrial funding, 3 rd party private finance Commission Staff Working Paper, SEC(2005)800 of 10 June 2005 & Status Report 2 of May 2006 cordis. europa. eu/technology-platforms/further_en. html EF_to_NCPs. Mtg_Challenge 3 ‐ 18

Provisional draft For more information European research on the web: http: //cordis. europa. eu/fp 7 http: //ec. europa. eu/comm/research/future/ Information Society and Media: http: //ec. europa. eu/information_society/ http: //cordis. europa. eu/ist Directorate G: http: //cordis. europa. eu/ist/directorate_g Contact: erastos. filos@ec. europa. eu EF_to_NCPs. Mtg_Challenge 3 ‐ 19