Proto micromegas au LAPP DIF Inter DIF terminaison
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Proto micromegas au LAPP DIF Inter DIF terminaison USB FPC ASU Test Vendredi dernier…. 14 november 2008 The DHCAL Board for the m 2 and m 3 prototype 1
Intermediate board DIF Samtec connection Prototype for M 2 • ASU prototype contain 4 hardroc chips • Detector size of ASU prototype is 8 x 32 mm • Test with 3 ASU prototype (or 2 ASU minimum) First assembly in october 2008 ; Beam test in november 2008 : Flat Printed Circuit 14 november 2008 : Hardroc chip : Hirose connector : Terminaison board The DHCAL for the m 2 and m 3 prototype 2
From proto to Module with HR 2 2 M design Projet 6_HR 2 Proto with 4 HR 1 Projet 24_HR 2 Design with 24 HR 2 14 november 2008 The DHCAL for the m 2 and m 3 prototype 3
Detector module in M 2 ~1 m 32 x 48 cm ( 24 ASICs ) (HARDROC or DIRAC) Each ASIC process traitment of 64 pads (8 x 8 cm) 32 x 48 cm ( 24 ASICs ) (HARDROC or DIRAC) 32 x 48 cm PCB before assembly ( 24 ASICs ) (HARDROC or DIRAC) 32 x 48 cm ( 24 ASICs ) (HARDROC or DIRAC) Cut with bulk By cern 14 november 2008 The DHCAL for the m 2 and m 3 prototype 4
Samtec connection Intermediate board DIF Samtec connection Intermediate board Link in DIF : Flat Printed Circuit 14 november 2008 2 M : ASIC chip (64 channels) : Hirose connector : Terminaison board The DHCAL for the m 2 and m 3 prototype 5
Data flow: DIF ASIC Add buffer by precaution for CK_SC Put resistor on ASU => remove terminaison board ? Driver circuit on intermediate board Resistor on terminaison board = FPGA on DIF 14 november 2008 The DHCAL for the m 2 and m 3 prototype 6
Data flow: DIF ASIC Add buffer by precaution for Q_SC Put shunt and driver on ASU => remove terminaison board ? Shunt chain on intermediate board Shunt chain with driver on terminaison board = FPGA on DIF 14 november 2008 The DHCAL for the m 2 and m 3 prototype 7
Data flow: DIF ASIC Add OC driver by precaution for Dout, Ramfull, Transmit_on? Open Collector driver for digital signals Multiplexer for analog signal 14 november 2008 The DHCAL for the m 2 and m 3 prototype 8
Power distribution: DIF ASIC, dectector Micromegas High Voltage drift cathode Micromegas High Voltage mesh 1 Micromegas High Voltage mesh 2 Low Voltage Digital power Low Voltage Analog power 14 november 2008 : Power connector The DHCAL for the m 2 and m 3 prototype 9
Urgent Questions • 1 or 2 design for ASU • 1 or 2 connector by line 14 november 2008 The DHCAL Board for the m 2 and m 3 prototype 10
Detector module in M 2 Intermediate board DIF Samtec connection ~1 m 32 x 48 cm ( 24 ASICs ) (HARDROC or DIRAC) 32 x 48 cm 1 unified ASU PCB 32 x 48 cm ( 24 ASICs ) (HARDROC or DIRAC) 32 x 48 cm ( 24 ASICs ) (HARDROC or DIRAC) 14 november 2008 PCB before assembly + Terminaison board ( 24 ASICs ) (HARDROC or DIRAC) The DHCAL for the m 2 and m 3 prototype 11
Detector module in M 2 Intermediate board DIF Samtec connection ~1 m 32 x 48 cm 2 type of ASU PCB 32 x 48 cm ( 24 ASICs ) (HARDROC or DIRAC) 32 x 48 cm ( 24 ASICs ) (HARDROC or DIRAC) Type 1 ( 24 ASICs ) (HARDROC or DIRAC) Type 2 (with terminaison) 14 november 2008 The DHCAL for the m 2 and m 3 prototype 12
From proto to 2 M design 80 points Proto with 4 HR 1 30 points type 2 40 points 14 november 2008 40 points 68 points Change for type 1 or type 2? type 1 The DHCAL for the m 2 and m 3 prototype 13