Protection layer test device Fred Hartjes NIKHEF Protection

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Protection layer test device Fred Hartjes NIKHEF Protection layer meeting Nikhef Dec 4, 2015

Protection layer test device Fred Hartjes NIKHEF Protection layer meeting Nikhef Dec 4, 2015

Based on dedicated Micromegas board u Designed by Harry u Mounted on glass fibre

Based on dedicated Micromegas board u Designed by Harry u Mounted on glass fibre epoxy frame l 25 x 25 mm u Pitch 80 µm, gap 50 µm u Fabricated at CERN (Rui De Oliveira) Fred Hartjes Protection layer meeting. Dec 4, 2015 2

Laid down on (dummy) chip Dummy chip Micromegas u Pressed down by silicon rubber

Laid down on (dummy) chip Dummy chip Micromegas u Pressed down by silicon rubber wires u Electrical spring contact made by W-Au wires l 200 um (Micromegas) l 30 um (dummy chip) Joop’s double sticky tape u Micromegas voltage by Mini. HV u Field voltage by Wenzel u All controlled by Lab. VIEW Fred Hartjes Protection layer meeting. Dec 4, 2015 3

Protection layer test device Silicon rubber wire u 4 channels u PCB sandwiched by

Protection layer test device Silicon rubber wire u 4 channels u PCB sandwiched by insulating gas envelope and aluminium connector frame u Micromegas signal read out by Honeycomb strip amp Coppered kapton cathode Plastic blocks to guide the Micromegas Fred Hartjes Protection layer meeting. Dec 4, 2015 4

Fred Hartjes Protection layer meeting. Dec 4, 2015 5

Fred Hartjes Protection layer meeting. Dec 4, 2015 5

u Micromegas current registered by Lab. VIEW l n. A resolution l 0. 5

u Micromegas current registered by Lab. VIEW l n. A resolution l 0. 5 s sample rate Lab. VIEW DAQ u Normal grid current low (few n. A) u Spark discharge easily detected (few µA spike) u Grid current sampled every 0. 5 s l All 4 channels individually Fred Hartjes Protection layer meeting. Dec 4, 2015 6

Properties and prospects u New samples can be rapidly installed l Gas frame easily

Properties and prospects u New samples can be rapidly installed l Gas frame easily removed (only gas connections with quick couplings) l Spring contacts (W-Au wire) on sample and Micromegas l No gluing, wire bonding or soldering required u Rather small gas volume (~85 ml) u Irradiation with sources (90 Sr and 55 Fe) well possible u Analog RO of grid signal possible l Gain measurements using 55 Fe u In production l Parts (mechanics + PCB) expected mid January 2016 Fred Hartjes Protection layer meeting. Dec 4, 2015 7