Product Selector Interconnect Technologies PWB Jan 2014 PWB
Product Selector Interconnect Technologies PWB Jan 2014
PWB Product Selector Innerlayer Manufacture Surface Prep Photo Resist Image Transfer Develop Etch Film Strip Innerlayer Bond Outerlayer Manufacture Drill Deburr Desmear PTH Photo Resist Image Transfer Develop Final Finish Solder Mask Surface Prep Tin Strip Etch Film Strip Plate Cu & Sn Dow EM No Dow EM Dow Company Confidential Multilayer
DES & SES Developers Film Strippers Resolve 9033 Surfacestrip 715 Surfacestrip 419 § § § Resolve 9033 Surfacestrip 419 Surfacestrip 715 Envirostrip 785 Antifoam 2750 Dowfax DF 146 Antifoam § EQC-1 Equipment Cleaner Tin / Tin Lead Strippers Ancillaries Envirostrip 785 Antifoam 2750 Dowfax DF-146 EQC-1 Equipment Cleaner High concentration potassium carbonate developer Fast, clean Outerlayer stripper, 3 -6% v. v Lower cost stripper with higher caustic content than SS 419 Nitric based tin stripper Silicone based antifoam Non silicone antifoam recommended for developer, stripper and waste treatment applications Equipment Cleaner for developer modules Dow Company Confidential
Innerlayer Bond Black Oxide Alternative Preclean Spray Cleaner 742 Circuposit Etch 3330 § § Acid spray cleaner Mono Persulphate etch Black Oxide Probond 80 § Traditional black oxide Oxide Reducer PB Oxide Converter § Oxide reducer, to eliminate pink ring Preclean Circubond Cleaner 140 § Alkaline cleaner to remove light oxides and chlorides Predip Circubond Predip 2217 § Acidic Predip Etch Circubond Treatment 2218§ Peroxide, sulphuric etch for enhanced structure and peel strength DOW CONFIDENTIAL - Do not share without permission Dow Company Confidential
Liquid Resist Negative LPR Positive LPR Negative ED Positive ED Photoposit SN 68 H-3 Photoposit SP 24 EAGLE 2100 ED Photoresist PEPR 2400 Photoresist § Photoposit SN 68 H-3 thickness § Photoposit SP 24 Exceptional resolution & fine line capability. 5 - 6 um thickness § Eagle 2100 ED Photoresist Negative working electrophoretic resist § PEPR 2400 Photoresist Positive working electrophoretic resist Fast photo speed, developing & stripping. 8 - 10 um Dow Company Confidential
Inkjet Etch Resist Lithojet 210 § Lithojet 210 UV Cure able acrylic hybrid MP 65 – 72 C Print and Etch Dow Company Confidential
Making Holes Conductive Desmear PTH Circuposit 3000 -1 Solvent Swell Hole Prep 3304 Hole Prep 4126 § § Standard choice for most materials Permanganate Etch Promoter 3308 § Sodium permanganate concentrate Neutraliser 4190 Neutraliser 3314 § § Non peroxide neutraliser. Contains conditioner Stabilised peroxide neutraliser Conditioner 3320 A Conditioner 3325 Conditioner 3323 A § § § Acidic, mild conditioner Neutral – mild alkaline conditioner Strong, alkaline conditioner Microetch Circuposit 3330 Circuposit 3336 § § Mono Persulphate etch Stabilised peroxide microetch Catalyst Circuposit Predip 3340 § Circuposit Catalyst 3344 § Accelerator Electroless Copper Circuposit 3350 -1 New high performance sweller Salt Predip for Catalyst 3344 Palladium Tin colloidal catalyst § No accelerator required with C 3000 -1 § § Universal electroless copper Low build, high build, vertical or horizontal Dow Company Confidential
Electroplate Copper Cleaners Electroposit PC Cleaner Ronaclean PC-960 § § General purpose acid cleaner Easy to rinse, general purpose acid cleaner § DC Vertical Copper Gleam HT-55 Electroposit 1400 Electroposit 1300 § § § High throw, excellent distribution DC Copper bath. CVS Control Thick panel, low CD bath Low cost Hull Cell control DC bath compatible with DM Bright, high CD horizontal DC bath processes Matt, high CD horizontal bath High levelling, low stress for flex DC Horizontal Copper Gleam HS-200 Copper Gleam SB-H Copper Glean HGX PPR Vertical Copper Gleam Cu. Pulse § High performance vertical pulse bath PPR Horizontal Copper Gleam PPR-H § High throw, high CD, horizontal pulse bath Viafill Microfill EVF Microfill LVF-3 § § DC Viafilling for HDI at low surface copper thickness Dow Company Confidential
Electroplate Tin / Tin-lead Tin Ronastan EC-1 Solderon PC-T § § Sulphuric acid based tin etch resist MSA based tin etch resist Tin Lead Solderon PC § MSA based tin lead etch resist Dow Company Confidential
Final Finish ENEPIG ENIG Preclean Catalyst | Nickel | Palladium Gold Aurolectroless SMT Ronaclean PC 960 Electroposit PC Cleaner. Ronamerse SMT CF Duraposit SMT 88 Pallamerse SMT 2000 Aurolectroless SMT-G Aurolectroless SMT 525 G Circuposit Etch 3330 § § § Aurolectroless SMT-G Aurolectroless SMT 525 G savings Standard immersion gold EDTA Free immersion gold New EDTA free Low Gold (0. 6 g/l). Very dense gold offering major cost Dow Company Confidential
Final Finish Electrolytic Nickel Nikal PC-5 § Sulphate or sulphamate nickel Electrolytic Gold Ronovel CM-97 Ronovel N Auronal BGA § § § Cobalt hardened Gold Nickel hardened Gold Pure Gold Dow Company Confidential
DOW CONFIDENTIAL - Do not share without permission Dow Company Confidential
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