Processing Ryan Rivers rdriverseecs berkeley edu 510 809
Processing Ryan Rivers rdrivers@eecs. berkeley. edu (510) 809 -8627 Jeff Clarkson jclarks@berkeley. edu (510) 809 -8628 Kim Chan kim@eecs. berkeley. edu (510) 809 -8631 Aug 16 th, 2016 Richelieu Hemphill rhemp@eecs. berkeley. edu (510) 809 -8615 Joanna Bettinger joannabettinger@berkeley. edu (510) 809 -8629 1
Research Community Commitment Community Communication Aug 16 th, 2016 Assistance Awareness 2
Nanolab Engineers Process and Equipment engineers are here to assist you Each tool has assigned engineers Process/Equipment Engineer 1 is in charge of that equipment Process Engineer 1 approves special processes on equipment Aug 16 th, 2016 3
Plan Your Work ! Time = Money Some tools are heavily reserved Plan ahead one week – minimize idle time Aug 16 th, 2016 4
Working in the Nano. Lab Nanolab Rule #1: NEVER WORK ALONE 3 rd to last person to leave must go notify the other two! Aug 16 th, 2016 5
Working in the Nano. Lab Entrance Checklist: ü ü ü Passed the Safety Quiz There are no announcements preventing lab access The Haz. Mat alarm is not active Have blue shoe covers on No food or drink on person Aug 16 th, 2016 6
Gowning Procedure: Top Down Shoe Covers Enter Gowning Bouffant Cap Bunny Suit Shoe Covers Gloves Safety Glasses Complete De-gowning occurs in reverse order Aug 16 th, 2016 7
Entering the Lab Area Gowning Checklist: ü ü ü No chemicals in storage box Safety Glasses on Name tag visible on coverall Changed damaged or stained coveralls/shoes/other gear Using proper size coverall and shoe cover Log on at the computer terminal before entering lab Aug 16 th, 2016 8
Equipment Qualification Complete Prerequisite Requirements Read the Manual Get Training (Any Qualified Member) Take Equipment Test (520 SDH Front Desk) Oral Qualification (Superuser) When in doubt – ASK STAFF Aug 16 th, 2016 9
Complete Prerequisite Qualifications • Many equipment sets have prerequisite qualifications and/or classes offered by staff • Evaporation, SEM, E-beam Litho, and confocal microscopy classes are offered periodically • Some toolsets have gateway tools (e. g. msink 6/8, tystar 1 -4, Leo SEM) Aug 16 th, 2016 10
Read the Manual All major equipment has a lab manual on website Process engineers update manual – send any suggestions to us! Manual inconsistencies are reported on Mercury as process faults Aug 16 th, 2016 11
Training – All qualified can train! Check reservations for the tool Find a member using equipment E-mail: <membername>@silicon. eecs. berkeley. edu Request to observe run and get training Each One Teach One – Train someone at least 1 x per semester Aug 16 th, 2016 12
Take Equipment Test Equipment tests available at 520 SDH (Front Desk) Usually available online via Mercury Specific tests are written only – copies at front desk Aug 16 th, 2016 13
Oral Qualification – Superuser Only Check Mercury for superuser names/email E-mail: <membername>@silicon. eecs. berkeley. edu Request qualification. Make reservation with superuser Sometimes process staff are the only superusers Aug 16 th, 2016 14
Process Specification • Process Specification describes and tracks standard processes • Data is posted monthly on Nanolab Website Aug 16 th, 2016 15
Process Specification • Reports show • Valuable data trends • Standard process conditions for the monitor • Reports indicate pre-processing steps for substrate Aug 16 th, 2016 16
Material and Process Compatibility • The Nanolab is a diverse processing environment • Nanolab materials restrictions are as open as possible • Many processes are very sensitive (e. g. , Sinks/Furnaces) • Duplicate process capability allows separation of materials • Materials restrictions are given by tool and group • Materials restricted by: • Substrate, Process, and Maintenance Aug 16 th, 2016 17
The Lab Manual Aug 16 th, 2016 18
Ch 1 - Material and Process Compatibility • Chapter 1. 7 – Furnace pre-clean & substrate restrictions • Equipment manuals define material compatibility/cleaning • Every piece of equipment has specific material restrictions • Several equipment may have group contamination protocols • Specific tools and processes require specific cleaning Aug 16 th, 2016 19
Ch 1 - Material and Process Compatibility Aug 16 th, 2016 20
Ch 2 - Sink Information / Restrictions Sink Name (Maximum Processes Available Wafer Size) Marvell Lab Locati on Important Comments msink 1 (8") PR strip, tank develop, pre-furnace metal clean 382 Note 2 msink 2 (6") PR strip, tank develop all metals allowed 382 Metal contaminated sink - Note 1 msink 3 (8") Manual Resist Processing 382 msink 4 (6") TMAH & KOH etch 382 Staff Review required before wafers processed at this sink returning to msink 6, msink 7, msink 8. msink 5 (8") HF, BHF etch special project etch (check labels at tanks) 382 Metal contaminated sink, PR coated wafers allowedsee Note 1 msink 6 (8") Final Piranha - MOS clean sink 386 No metals allowed - MOS clean sink msink 7 (6") Hot phosphoric, HF, silicon etch 386 No metals, PR coated wafers allowed msink 8 (8") Piranha clean, BHF, aluminum etch 386 No metals except aluminum in the aluminum etch tank, no PR coated wafers msink 16 (N/A) General clean - beaker process/part clean 582 A Metal contaminated sink - Note 1 msink 18 (N/A) General clean - beaker process/part clean 582 A Metal contaminated sink - Note 1 Note 2 - Aug 16 th, 2016 Wafers processed at this sink are metal contaminated, ARE NOT ALLOWED to return to msink 6, msink 7, msink 8. Gold, copper and or other highly diffusive metals ARE NOT ALLOWED at this sink. 21
Ch 2 - Working at the Sinks • PPE must be worn when working at the sinks! • Chemically resistant gloves • Face shield • Chemically resistant apron Aug 16 th, 2016 22
Ch 2 - Working at the Sinks • Mixing chemistry can get HOT! • Always use caution when adding chemicals and be aware of exothermic reactions • Working at general purpose sinks (MSink 16/18) • You MUST be qualified • Describe your processes to each other • Process Tag all work at the station • Do not heat up a solvent directly on the heater chuck Aug 16 th, 2016 23
Ch 2 - General Wet Chemistry Cabinets • Located in 582 A, 381/383 • Standard chemicals available to members at no charge • Special chemical storage needs pre-approval and label • Use partial bottles first! If empty – ask staff to restock Aug 16 th, 2016 24
Ch 2 - Changing Organic Bottles Aug 16 th, 2016 25
Ch 2 - Chemical Waste Management Log Sheet Every pour requires an entry with a volume! Aug 16 th, 2016 26
Ch 3 - Mask Making at MNL provides in-house mask making • L-Edit Layout Software • GCA 3600 Pattern Generator • Refer to MNL Chapter 3 for complete details • Contact Process Engineer Jeff Clarkson for assistance Aug 16 th, 2016 27
Ch 4 - Photolithography Equipment GCA 8500 5 X i-Line Stepper Typical Resolution: 0. 8 um Minimum Resolution: 0. 6 um PE 1: Jeff Clarkson EE 1: Greg Mullins ASML 5500/300 4 X DUV Stepper Typical Resolution: 0. 35 um Minimum Resolution: 0. 25 um PE 1: Jeff Clarkson EE 1: Greg Mullins Crestec CABL 9510 E-Beam Typical Resolution: 40 nm Minimum Resolution : 10 nm PE 1: Kim Chan EE 1: Greg Mullins Quintel Q 4000 Mask Aligner Typical Resolution: 2. 5 um Minimum Resolution: 1. 0 um PE 1: Kim Chan EE 1: Greg Mullins Karl Suss MA 6 Mask Aligner Typical Resolution: 2. 5 um Minimum Resolution: 1. 0 um PE 1: Kim Chan EE 1: Greg Mullins Canon 4 X Projection MA Typical Resolution: 1. 5 um Minimum Resolution: 1. 0 um PE 1: Kim Chan EE 1: Greg Mullins Aug 16 th, 2016 28
Ch 5 - Furnaces – AP and LPCVD Tystar 1 -4, Dry/Wet Ox, Anneal, Sinter, 4” & 6” wafers Tystar 17 -20, Nitride, Hi-Temp Oxide, Sinter, Si-Ge, 4” & 6” wafers Aug 16 th, 2016 Tystar 5 -7, Dry/Wet Ox, Dopant Diffusion, Anneal, 4”, 6” & 8” wafers Tystar 9 -12, Nitride, poly-Si, a-Si, Low-Temp Oxide, 4” & 6” wafers Tystar 13 -16, Dopant Diffusion, Si. C, poly-Si, a-Si, 4” & 6” wafers 1. Furnaces are divided into MOS & non-MOS. 2. Substrates must be cleaned before furnace use. Last pre-furnace step: Msink 6 for non-metal substrates, and, Msink 1 for metal substrates going into metal approved furnaces. 3. III-V compounds are not allowed in any furnace. 29
Ch 5 - Rapid Thermal Processors RTP 1 – III-V, PZT, metals; up to 6” wafers RTP 2 – III-V; process up to 6” wafers RTP 3 – Si non-MOS, metals; up to 6” wafers RTP 4 – Si MOS, silicidation; up to 6” wafers Rapid Thermal Processing has time scales on the order of seconds to reach up to 1100ºC. Applications include thermal oxidation, anneal, dopant activation and metal reflow. RTP 8 – Si MOS Gate Oxidation; Process up to 8” wafers Aug 16 th, 2016 30
Ch 6 - Thin Film Deposition – PECVD/HFCVD System Name Power Type Temp Materials oxford 2 RF Plasma 100 -350 C a-Si, Six. Ny, Si. O 2 pqecr ECR Plasma 25 -300 C Al, Cr, Cu, Fe*, ITO, Ni*, Si. O 2, Ti, W sp 3 Hot Filament 700 C Diamond Aug 16 th, 2016 31
Ch 6 - Thin Film Deposition – ALD System Name ALD type Temp Materials cambridge RF Plasma/Thermal 100 -500 C Al 2 O 3, Ti. O 2, Zr. O 2, Ti. N, Ru, Si. O 2 picosun Thermal 160 -300 C Al 2 O 3, Ti. O 2 Aug 16 th, 2016 32
Ch 6 - Thin Film Dep – PVD Sputter System Name Type Porous Reactive Targets User Changed? Materials mrc 944 RF Magnetron No No 4 N Al/2%Si, Al/Mn, Ni. V, W, Ti edwards RF/DC Magnetron Yes 3 Y Al, Cr, Cu, Fe*, ITO, Ni*, Si. O 2, Ti, W randex DC Diode Yes 2 N gartek DC Magnetron No No 3 N Al, Nb aln 2 AC/DC Magnetron No Yes 4 N Mo, Al. N, Al Topgun DC Magnetron No Yes 4 N Al, Cu, Si, Ti All PVD tools require use of light blue “vacuum” gloves Aug 16 th, 2016 33
Ch 6 - Thin Film Dep – PVD Evaporation System Name Type Temp Porous Dielectrics Magnetics Sources Materials cha E-beam High Yes No No 6 Ag, Al, Au, Cr, Cu, Nb, Pd, Pt, Sn, Ti tescal Thermal High Yes No Yes 3 Ag, Al, Au, Cr, Nb, Pd, Pt, Ir, Ru nrc Thermal Low-High Yes No (TBD) Yes 2 Ag, Al, Au, Co, Cr, Cu, Fe, In, Ni, Pd, Pt, Si, Sn, Ti, ITO, TCO ultek E-beam High No No No 3 Al, Au, Cr, Cu, Pd, Pt, Ti edwardseb 3 E-beam Mid-High No Yes No 4 Ag, Al, Mn, Mg, Si. O 2 dw E-beam Low-High No Yes No 4 Ag, Al, Mn, Zn Evaporators require Evaporation Training Workshop Qualification Aug 16 th, 2016 34
Ch 7 – Etching Systems – Plasma System Name Type Chemistry He cooling Materials Group Lam 6 RIE Fluorine Yes Si. N, Si. O 2, BARC Lam 7 TCP/Bias Cl 2/BCl 3 Yes Al, Ti Lam 8 TCP/Bias HBr/Cl 2 Yes Silicon, Si. C, Si. Ge Technics-c RIE SF 6/He No Si. N, Si. O 2, Si Centura-3 -5 ICP/Bias Various, Cl 2 Yes III-V Nitrides Centura-met ICP/Bias Cl 2/BCl 3 Yes Al, Ti, W Centura-mxp RIE CF 4/CHF 3/CH 3 F Yes Si. N, Si. O 2 Matrix-etch RIE CF 4/SF 6/O 2 No Si, Si. N, Si. O 2, Mo Semi RIE CF 4/O 2 No Nb, Si. O 2 Ptherm RIE Various No Various Sts 2 DRIE SF 6/O 2, C 4 F 8 Yes Si Sts-oxide DRIE C 4 F 8, H 2 Yes Si. O 2 Aug 16 th, 2016 35
Ch 7 – Etching Systems – Other System Name Type Chemistry Materials Group Primaxx Vapor Anhydrous HF Si. O 2 Xetch Vapor Xe. F 2 Si Ionmill 6 Ion Mill Physical Ar Sputter Various Aug 16 th, 2016 36
Ch 8 -Testing and Inspection Equipment MNL has a wide range of test and inspection equipment. See Chapter 8 in the MNL Manual for a complete list. Contact MNL Process Engineer Jeff Clarkson for assistance. Aug 16 th, 2016 37
Thank You for your attention! Aug 16 th, 2016 38
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