Precision Bump Formation Mushroom type bump Fabrication process

Precision Bump Formation Mushroom type bump Fabrication process X-Sec laser ablate plated up bump Delphi Confidential

Precision Bump Formation Mushroom type bump Design considerations (dot to dot spacings) – Simultaneous Laser Operation » Define dot location » Define alignment hole location » Position tolerance +/-. 002” h b h = bump height 0. 003 -0. 005 in. b = bump base w+h w = bump opening 6, 8, 10 mils The bump is plated within and above the coverlay material. Delphi Confidential w

Precision Bump Formation Mushroom type bump Examples of mushroom type bump parts For military and commercial applications Delphi Confidential

Photolithography Bump Formation Photoresist defined bump Fabrication process. 004” Laminate Photoresist . 008” Photo / Develope Plating Strip Photoresist The shape of the bump is controlled by the photoresist image, so various shapes can be defined. Typically used with larger or gross opening in the coverlay. Delphi Confidential Bump heights are 0. 003 -0. 005 in. Bump Widths are 0. 004 in. smaller than the trace widths

Photolithography Bump Formation Photoresist defined bump Examples of mushroom type bump parts For military and commercial. 004” applications . 008” Delphi Confidential

Precision Bump Formation Etch-a-dot type bump Fabrication process Laminate coverlay Laser coverlay openings Plasma Clean openings Plate mushroom bump The bump is plated within and above The coverlay surface. Etch smaller bump tip On mushroom bump Delphi Confidential

Precision Bump Formation Etch-a-dot type bump Examples of mushroom type bump parts For military and commercial applications Typical bump dimensions Delphi Confidential

Typical Gold dot circuit layout Circuit Trace Capabilities: . 0025/. 0025[0. 0635/0. 0635] Width/ Space Bump Height* Bump Base Diameter Bump Base Pad Diameter . 0045[0. 114] . 008[0. 216] . 0145[0. 368] Calculating Contact Pitch: For Column Pitch: Pcolumn=(No rows-1) x (Trace width) + Base Pad Dia + (No Rows) x Conductor Spacing Column of Contacts Rows of Contacts Circuit Trace Bump Base Pad Delphi Confidential

Precision Bump Formation Typical Performance Characteristics • Rated current per dot 1 amp Max @ room temp • Contact Resistance <10 m. Ohms • Contact Force 0 -150 gms per contact • Vibration 10 G max. peak, 10 -500 Hz • Mechanical shock 30 G, 294 m/s peak Accel. 11 ms duration • Operating temp. -40 to +125 C, continuous • Bump contact Au Plated over Nickel and Copper • Mating surface Immersion/hard gold & solder Delphi Confidential