Powersupply Decoupling Mosis IC Package Electrical Parasitics MOSIS

  • Slides: 20
Download presentation
Powersupply Decoupling Mosis IC Package Electrical Parasitics MOSIS packaging vendors use 1 mil gold

Powersupply Decoupling Mosis IC Package Electrical Parasitics MOSIS packaging vendors use 1 mil gold wire by default. Other bond wire diameters (smaller 0. 8 mil or larger 1. 2 or 1. 3 mil) may be used in special cases. See Electrical Package Characterization. Under "Additional Information" select Plastic Packages' Electrical Performance: Reduced Bond Wire Diameter (PDF). Length Resistance (Ohm) Inductance (n. H) Capacitance (p. F) Mutual Inductance (n. H) Bond Wire Diameter Wire Length 0. 8 mil 1. 0 mil 1. 2 mil 1. 3 mil 5 mm 0. 383 0. 257 0. 198 0. 180 2 mm 0. 154 0. 103 0. 079 0. 072 5 mm 6. 103 5. 869 5. 668 5. 576 2 mm 2. 089 1. 996 1. 915 1. 879 5 mm 0. 202 0. 242 0. 279 0. 299 2 mm 0. 104 0. 122 0. 140 0. 149 5 mm 3. 320 3. 318 3. 314 3. 311 2 mm 0. 9798 0. 9787 0. 9770 0. 9758 -0. 0374 -0. 0488 -0. 0602 -0. 0698 -0. 0204 -0. 0261 -0. 0327 -0. 0364 Mutual capacitance 5 mm (p. F) 2 mm

TI AN-1205 Electrical Performance of Packages – RLC Values for lead-frame based packages and

TI AN-1205 Electrical Performance of Packages – RLC Values for lead-frame based packages and micro SMD packages

TI RLC Data for CSP Packages

TI RLC Data for CSP Packages

TI RLC Data for BGAs without planes

TI RLC Data for BGAs without planes

TI IC Package Wirebond Inductance

TI IC Package Wirebond Inductance

Intel Multilayer Package Lead Electrical Characteristics

Intel Multilayer Package Lead Electrical Characteristics

Intel Crosstalk Package Electrical Characteristics Inductive Parsasitics

Intel Crosstalk Package Electrical Characteristics Inductive Parsasitics

Intel Crosstalk Package Electrical Characteristics (continued) Capacitive Coupling

Intel Crosstalk Package Electrical Characteristics (continued) Capacitive Coupling

Intel PQFP Package Electrical Parasitics

Intel PQFP Package Electrical Parasitics

Intel QFP Package Electrical Parasitics Intel SQFP/TQFP Package Electrical Parasitics

Intel QFP Package Electrical Parasitics Intel SQFP/TQFP Package Electrical Parasitics

Intel Package I/O Lead Electrical Parasitics for TCP Packages

Intel Package I/O Lead Electrical Parasitics for TCP Packages

Intel Package Core Power Loop Electrical Characteristics

Intel Package Core Power Loop Electrical Characteristics

Intel CQFP Electrical Data (a mature package)

Intel CQFP Electrical Data (a mature package)

Intel MM Electrical Data (a mature package)

Intel MM Electrical Data (a mature package)

Intel PQFP Electrical Data (a mature package)

Intel PQFP Electrical Data (a mature package)

Intel PLCC Electrical Data (a mature package)

Intel PLCC Electrical Data (a mature package)

Intel QFP Electrical Data (a mature package)

Intel QFP Electrical Data (a mature package)

Intel SQFP/TQFP Electrical Data (a mature package)

Intel SQFP/TQFP Electrical Data (a mature package)

Intel SOP Electrical Data (a mature package)

Intel SOP Electrical Data (a mature package)

Foundry Services MOSIS as a model MOSIS MOSFoundry Services MOSIS as a model MOSIS MOS
package package package graphics package java io packagepackage package package graphics package java io package
package package package graphics package java io packagepackage package package graphics package java io package
DECOUPLING WLAW LLC What is decoupling One ownerDECOUPLING WLAW LLC What is decoupling One owner
Electrical Engineering Student Senior Capstone Project A MOSISElectrical Engineering Student Senior Capstone Project A MOSIS
Environmental Protection in Hungary Our powersupply system EnvironmentalEnvironmental Protection in Hungary Our powersupply system Environmental
Package Pacchetti e interfacce 28122001 package 1 PackagePackage Pacchetti e interfacce 28122001 package 1 Package
Android Androidsrc Package Name Package Activity package twAndroid Androidsrc Package Name Package Activity package tw
Parasitics Extraction PEX postsimulationposim EEKSU P H ChangParasitics Extraction PEX postsimulationposim EEKSU P H Chang
Topics Wire and via structures n Wire parasiticsTopics Wire and via structures n Wire parasitics
VLSI Design Lecture 3 Parasitics of CMOS WiresVLSI Design Lecture 3 Parasitics of CMOS Wires
Topics Wire and via structures n Wire parasiticsTopics Wire and via structures n Wire parasitics
Offchip Decoupling Capacitor Allocation for Chip Package CoDesignOffchip Decoupling Capacitor Allocation for Chip Package CoDesign
High Yield Integrated Circuit Design using the MOSISHigh Yield Integrated Circuit Design using the MOSIS
Electrical Safety Basic Electrical Safety Electrical Course notElectrical Safety Basic Electrical Safety Electrical Course not
Electrical Charge Electrical Force and Electric Fields ElectricalElectrical Charge Electrical Force and Electric Fields Electrical
Electrical Technology What is Electrical Technology n ElectricalElectrical Technology What is Electrical Technology n Electrical
Electrical Circuits Electrical Circuits l Electrical circuits willElectrical Circuits Electrical Circuits l Electrical circuits will
Electrical and RF Safety Electrical Safety Electrical SafetyElectrical and RF Safety Electrical Safety Electrical Safety