Powersupply Decoupling Mosis IC Package Electrical Parasitics MOSIS Slides: 20 Download presentation Powersupply Decoupling Mosis IC Package Electrical Parasitics MOSIS packaging vendors use 1 mil gold wire by default. Other bond wire diameters (smaller 0. 8 mil or larger 1. 2 or 1. 3 mil) may be used in special cases. See Electrical Package Characterization. Under "Additional Information" select Plastic Packages' Electrical Performance: Reduced Bond Wire Diameter (PDF). Length Resistance (Ohm) Inductance (n. H) Capacitance (p. F) Mutual Inductance (n. H) Bond Wire Diameter Wire Length 0. 8 mil 1. 0 mil 1. 2 mil 1. 3 mil 5 mm 0. 383 0. 257 0. 198 0. 180 2 mm 0. 154 0. 103 0. 079 0. 072 5 mm 6. 103 5. 869 5. 668 5. 576 2 mm 2. 089 1. 996 1. 915 1. 879 5 mm 0. 202 0. 242 0. 279 0. 299 2 mm 0. 104 0. 122 0. 140 0. 149 5 mm 3. 320 3. 318 3. 314 3. 311 2 mm 0. 9798 0. 9787 0. 9770 0. 9758 -0. 0374 -0. 0488 -0. 0602 -0. 0698 -0. 0204 -0. 0261 -0. 0327 -0. 0364 Mutual capacitance 5 mm (p. F) 2 mm TI AN-1205 Electrical Performance of Packages – RLC Values for lead-frame based packages and micro SMD packages TI RLC Data for CSP Packages TI RLC Data for BGAs without planes TI IC Package Wirebond Inductance Intel Multilayer Package Lead Electrical Characteristics Intel Crosstalk Package Electrical Characteristics Inductive Parsasitics Intel Crosstalk Package Electrical Characteristics (continued) Capacitive Coupling Intel PQFP Package Electrical Parasitics Intel QFP Package Electrical Parasitics Intel SQFP/TQFP Package Electrical Parasitics Intel Package I/O Lead Electrical Parasitics for TCP Packages Intel Package Core Power Loop Electrical Characteristics Intel CQFP Electrical Data (a mature package) Intel MM Electrical Data (a mature package) Intel PQFP Electrical Data (a mature package) Intel PLCC Electrical Data (a mature package) Intel QFP Electrical Data (a mature package) Intel SQFP/TQFP Electrical Data (a mature package) Intel SOP Electrical Data (a mature package)