Powerful administrative functions Real time alert systems option

Powerful administrative functions. • Real time alert systems (option): Alert when meets criterion of test fails. • Statistical systems: Automatic generate useful production administrative charts, such as components test value distribution charts, daily charts, period charts, test pins fails ranking, failure component ranking and test coverage rate analysis…etc. • ICT console (option): • Remote access test results data and their statistic charts to support manager analyze production problems, adjust the engineering process or trace back fail components to meet the key issue, original problem solving strategy. • Edit and debug test program at remote side. PRG. DEMO

Board View functions. • Physical tested board display on screen monitor. Support fail components physical outline on screen to make the trouble shooting work more easier. • Board view functions: Support smart board view function for trouble shooting station needs. See demo program for details. • Pin edit function: Show the physical outline of fail pins and their relative circuit and components to find the failure points or components easily. PRG. DEMO

Test program generator. ATPD: Automatic Test program Debug. • Test Program Conversion: Direct import CAD data from FABMASTER or other ICT test program from TRI、JET、OKANO、TESCON、TCO-5…. etc, and convert them to ICT 360 AT test program directly. • Auto learning functions: Auto learning for items of Open/Short, Component, IC, TAJ, ECJ respectively, then generate test program and their guarding points up to 95% automatically. It can save huge test program debugging and tuning time. PRG. DEMO

Unique test functions. • TA Jet : • EC Jet : • BGA IC test approach to 100% coverage rate. • SMD Connector test approach to 100% coverage rate. • Intel 845 north bridge approach to 100% coverage rate. • Explosion free capacitor: 100% missing part and polarity reverse detect rate. • Parallel capacitors: 100% missing part and polarity reverse detect rate. • 4 wires mini ohm • measurement: Up to 0. 05Ω，mini ohm grade measurement. PRG. DEMO

Compatibility • TAJ / HPJ compatibility. Just remove the ribbon connector cable from MUX card of HPJ system and plug it into Switch Card connector of TAJ system. • ECJ Fixture : Add 3 rd pin on upper side of the fixture for contacted the surface of each electrolytic capacitors. • Test program conversion : Import from TRI / JET / OKANO / TESTCON / TCO-5 test program or Fabmaster CAD data to generate ICT 360 AT test program directly. PRG. DEMO

Review PRG DEMO n Powerful administrative functions. • Quality Alert system / Statistic system / Remote console. TA Jet n Trouble shooting auxiliary. • Board View function / Show No-Go parts on screen monitor. • Test Pin edit function. EC Jet n Automatic test program debug. • Import from other Test Program or CAD data from fabmaster. • Automatic test program learning. Compare n Unique test function. • TA Jet / EC Jet / Mini ohm measurement. P 4 EVAL. n Excellent Compatibility. • TAJ / HPJ compatibility / ECJ fixture / Test program conversion. Evaluations n Return from investment. • ICT 360 AT evaluations(Excel) EXIT

Statistical charts. ICT 360 AT supports 7 kinds of charts: Daily chart. Period chart. Distribution chart. IC measure value distribution chart. Rank for bad pins of the bed of nails. Rank for fail components. Coverage rate analysis chart.

Statistical charts Performance. Test program tuning as well as upper/lower limits setting for each test step. Tested board quality monitoring and production problems real time tracking. Components quality monitoring and problems trace back (ISO 9001). Test pins quality monitoring and probe replace indication of the Bed of Nails.

Fixture convert for TAJ and HPJ wiring. MUX Card TAJ wiring Decoder Card SWC

Convert TAJ to HPJ: CASE 1 HPJ TAJ (HPJ fixture wiring application on ICT 360 AT. ) No such as Intel north bridge package IC, connector plug to SWC of ICT 360 AT directly. I. e. 100% HP pad compatible.

Convert TAJ to HPJ: CASE 2 HPJ TAJ (HPJ fixture wiring application on ICT 360 AT. Board pasted with IC package such as Intel North bridge. Drilling 3 rd hole for TA pad application and pull HP pad down then replace TAJ pad up. Then i. Pin+ / Pin- connect to Decoder Card of ICT 360 AT. ii. Connect 3 rd pin(Sync pin) connector to Switch Card of 360 AT.

Convert HPJ to TAJ: CASE 3 TAJ HPJ (TAJ fixture wiring application on HPJ fixture. • Replace TAJ pad to HPJ pad. • Connect TAJ pad Pin+ / Pin- fixture connector of ribbon cable to MUX Card connector. • Leave 3 rd Pin connector open circuit.

Test Programming Preparation The preparation for fixture making 1. CAD file or Gerber file of DUT 2. BOM of DUT 3. Bare board and assembled board (For high precision or multi-layer board, CAD file is recommend) Check list for fixture making 1. The probe for ECJ test should be Spherical type with long stroke and low spring force, the location of the probe should be precise. 2. The pitch of probe tube and the connection of the array-pin for TAJ test should be correct and can easily convert to HPJ test. *. DAT *. ICN Test programming preparation *. ICP 1. DUT: 1 bare board, 20 assembled boards. FORMAT. ASC 2. Pins diagram of fixture NAILS. ASC 3. BOM of DUT NETS. ASC 4. DUT circuit diagram(Option) PARTS. ASC 5. The files at right should be provided by fixture maker. PINS. ASC

EC Jet ECPD Technology ( Electrolytic Capacitor Polarity Discriminating Technology. ) On board electrolytic capacitor polarity and missing parts inspection.

The challenges on production line. Traditional ICT test systems. 1. Very low Electrolytic Capacitor polarity discriminating rate(30%-50%). 2. Unable to find out the capacitor miss part during the test. Missing Parts. Wrong Orientation.

Challenge on production line. Inspecting by human eyes not only waste of time and money but also un-reliable as well.

Traditional ICT Electrolytic Capacitor discriminate method. 2 Terminals 3 Terminals Leakage Current detect Method. + impedance detect method. Induce method. + Z- I- HP Test. Jet I+ + Z+ M + ~

Characteristics of EC Jet. § For EC Polarity Discriminating Rate = 100%. § Explosion free EC Polarity Discriminating rate = 100%. § Ultra High Speed, on board 50 Capacitors Test time < 2 sec. § Parallel EC missing part detective ability.

EC Jet know how. Signal source ~ Response Signal BLACK V BOX source T(time ) Un-know network analysis model. V Response ~ M T(time )

Principle of EC Jet technology. V Source V T(time ) Response ~ M V T(time ) STD Digital Signal Processing. DFT DSP Pattern Match FFT F(freq. ) V DUT F(freq. )

Principle of EC Jet capacitor miss detection. V ~ M DSP Pattern Match STD F(freq. ) V DUT F(freq. )

Why parallel capacitors missing parts can not be found? Vcc C 1 C 2 ? C 3 C 4 ? Cn ? Tolerance of electrolytic capacitance = -20% ~ +50%

Test limitations of EC Jet. Temperature. DUT with normal temperature between 0° ~ 55°C , failure rate = 0, 100% able to test. DUT with temp > 80°C , failure rate : about 20% DUT with temp >60°C , failure rate : less than 5% Parallel Capacitor Huge value of capacitor affect the testing time (15 -20 ms /PCS), due to sampling time is a little longer. Explosion free capacitor needs long testing time. Due to the polarity characteristics of explosion free capacitor is not so clear as normal capacitor. Testing time as long as 200 ms/ pcs.

Benefits of EC Jet. Less Effort. Use old ICT: JET 300 TR 518. Use EC Test. Jet Save 2 ~ 3 Operators. Use EC Jet. Higher Quality. Instead of human Eyes Inspection. Getting higher quality.

TA Jet Apply theory of electrostatic strength measurement to detect the solder joint’s open / contacted BGA pins up to 100%.

What’s the difference between TA Jet & HP Test. Jet? TA Jet HP Test. Jet Theory Electrostatic measurement. Capacitor coupling. Signal Processing. Through SW CARD Through MUX CARD. No. of Test Terminals. 3 2 Sensing signal ratio of contacted/open. 20~30 times，High. 10~15 times，Low. Test Frequency. 2 K~10 K automatic adjustable. Only one frequency at 10 KHz. Cost USD 3, 000 - USD 10, 000 - MUX Card cost. No USD 100/ board. Sensor pad price. USD 35/set USD 35 -85/set.

Know how(I) (Current Pre. AMP. ) HP Test. Jet MUX CARD M TA Jet SWITCH CARD M (Synchronous Detector AMP. )

Know how(II) Measuring the capacitance between bonding line and HP sensor pad. (f. F) HP Test. Jet TA Jet ε Electrostatic strength. (V/m)

Solder joints Contacted / Open sense level. TA Jet testing ability is over 20 times of HP Test Jet.

SMD coverage rate. FQFP, SOJ, SOP, PLCC HP Test. Jet test results : good. TA Jet test results : excellent.

BGA coverage rate. A HP Test. Jet ε Unstable to test under 100 f. F level. A TA Jet Coverage rate up to 100%. Normal IC BGA ε

Intel 845(North Bridge) coverage rate. HP Test. Jet about 10% level. A d d

Intel 845(North Bridge) Coverage Rate. TA Jet coverage rate up to 100%. r ε SWITCH CARD M DSP

Intel 845(North Bridge) coverage rate. V TA Jet OK Contacted SMD BGA 845 Noise open F fs SWITCH CARD M DSP

SCSI / PCI SMD Connector. TA Jet HP Test. Jet

Benefits of TA Jet • Up to 100% BGA pins of solder joint’s Contacted/ Open inspection. • Up to 100% Intel 845 BGA pins of solder joint’s Contacted/Open inspection. • Up to 100% SCSI / PCI SMD connector solder joint’s Contacted/Open inspection. • Make sure where the true BGA failures are.

Limitations of BGA Open/contacted test. Circuit impedance. If circuit impedance small than 10 ohms, the stimulus signal can not apply to almost a short circuit. Parallel pins. Logically BGA parallel pins are same circuit, we can not discriminate if one of them is open circuit. BGA relative components. If the BGA relative component in O/S, missing part, wrong part fail, it may affect the test value of BGA.