Plasma bay modernised in 2011 Sentech SI 500

Plasma bay modernised in 2011

Sentech SI 500 RIE cluster Si 3 N 4, Si. O 2, poly. Si and Al etching 2 x Oxford System 100 ICP Si 3 N 4, Si. O 2, poly. Si, polymers, Al, noble metals etching

Oxford System 80 Plus PECVD Si. Nx and Si. O 2 deposition

Napson CRESBOX Semi-automatic four point probe for resistance/resistivity measurements. Zygo New. View 7100 Optical white light profilometer for non – contact, three - dimensional surface topography measurements as well as for dynamic measurements of MEMS structures. Dektak XT Stylus profiler for surface topography contact measurements.

To be installed till the end of 2012: • 3 x Thermco diffusion furnace (Si wet and dry oxidation, P diffusion) • Thermco LPCVD reactor (poly. Si, Si 3 N 4 deposition) • 2 x Oxford Instruments magnetron sputtering system (Al and noble metals deposition) • EVG 101 spray coater (PR deposition onto 3 d surfaces) • EVG 620 TB double side mask aligner (including large gap alignment optics for 3 d patterned surfaces) • IBS plasma immerse ion implanter (B, P, As, Si, C ion species; S/D doping, Trench doping, Backside wafer doping, High dose poly-silicon doping, Contact doping, Shallow junction forming, 3 D element doping, Nano precipitates and nano structure forming, Hydrogenation, Gettering, Resist curing) • 2 x Plasma Parylene System Resist ashers (PR including SU 8 removal) and other stuff such as wet benches, semi-automatic probe station, RTP system, microsystems assembling devices etc.