Pixel 2002 Carmel The ATLAS Pixel Detector Pixel

Pixel 2002 - Carmel The ATLAS Pixel Detector Pixel 2002 Workshop M. Garcia-Sciveres Lawrence Berkeley National Lab Sept. 9, 2002 M. Garcia-Sciveres - The ATLAS Pixel Detector 1

Pixel 2002 - Carmel Aerial View of the LHC Site Circumference of 27 km Main CERN Site Sept. 9, 2002 M. Garcia-Sciveres - The ATLAS Pixel Detector 2

Pixel 2002 - Carmel A Toroidal LHC Apparatu. S Muon Detectors Superconducting Toroids Inner Tracking LHC beam pipe Calorimeters Sept. 9, 2002 Tall person Superconducting Solenoid M. Garcia-Sciveres - The ATLAS Pixel Detector 3

Pixel 2002 - Carmel ATLAS Inner Detector Sept. 9, 2002 M. Garcia-Sciveres - The ATLAS Pixel Detector 4

Pixel 2002 - Carmel Pixel Detector 3 hit design 1. 3 m Sept. 9, 2002 M. Garcia-Sciveres - The ATLAS Pixel Detector 5

Pixel 2002 - Carmel ATLAS Pixel Collaboration • • • University of Toronto, Canada Academy of Sciences of the Czech Republic Czech Technical University Charles University, Czech Republic CPPM, France U. of Bonn, Germany U. of Dortmund, Germany MPI, Germany U. of Siegen, Germany U. of Wuppertal, Germany INFN Genova, Italy Sept. 9, 2002 • • • INFN Milano, Italy INFN Udine, Italy Academia Sinica, Taiwan SUNY Albany, USA LBNL, USA Iowa State U. , USA U. of New Mexico, USA Ohio State U. , USA U. of Oklahoma, USA UC Santa Cruz, USA U. of Wisconsin Madison. USA M. Garcia-Sciveres - The ATLAS Pixel Detector 6

Pixel 2002 - Carmel Detector Parameters • • • • 3 Barrel layers, 3+3 Disks covering |h|<2. 5 Inner radius: ~5 cm Outer radius: ~12 cm n+ on n oxygenated sensors, 400 mm (z, R) x 50 mm (phi) pixels. Number of channels 67 M (barrel) + 13 M (disks). Readout type: zero-suppressed time over threshold. Lifetime Dose, 1015 neq/cm 2, 50 MRad. LHC Interaction rate: 40 MHz. Max readout rate: 160 Gb/sec => 7 KHz trigger at 1% occupancy. ASICs: 0. 25 mm CMOS with rad. Tolerant layout. AC signal protocol: LVDS in active volume, optical outside. Active volume operating power: 6. 5 k. W at 2 V Silicon operating temperature: <0 o. C Cooling system: evaporative C 3 F 8. Radiation length at normal incidence: ~10% R. L. Sept. 9, 2002 M. Garcia-Sciveres - The ATLAS Pixel Detector 7

Pixel 2002 - Carmel Performance s=9 mm s=13 mm 1 Test beam measurement of single Front End chip bump bonded assembly. For single hits expect s=sqrt(12) x pitch ~ 14 mm. Efficiency Test beam measurement of hit efficiency unirradiated and fully irradiated assemblies. 0 Time (10 ns/div. ) Sept. 9, 2002 Time (10 ns/div. ) M. Garcia-Sciveres - The ATLAS Pixel Detector 8

Pixel 2002 - Carmel Sensors • 2 Manufacturers: CIS and Tesla • Basic Requirements: – – Leakage current after 1015 neq/cm 2: <50 n. A / pixel Total input capacitance: <400 f. F Inter-pixel capacitance: small Signal after irradiation: >10 Ke- Simulation of 70% depletion voltage at innermost layer. 150% LHC nominal fluence. Sept. 9, 2002 M. Garcia-Sciveres - The ATLAS Pixel Detector 9

Pixel 2002 - Carmel Sensors (cont. ) Detail of p-side multi guard ring structure Charge collection efficiency (meas) Sept. 9, 2002 100 mm wafer with 3 “tiles”, n side n+ implants and bias grid M. Garcia-Sciveres - The ATLAS Pixel Detector 10

Pixel 2002 - Carmel Custom ASIC Electronics • Suite of chips all fabricated in 0. 25 mm commercial bulk CMOS. • Use circuit library with special layout rules for radiation tolerance (based on RD 49 library) Front End Chip 2880 channels Module Control Chip Manages data & control between module’s 16 chips Optical interface chips Doric (from PIN diode to decoded LVDS) VDC array (from LVDS to laser diodes) Sept. 9, 2002 M. Garcia-Sciveres - The ATLAS Pixel Detector 11

Pixel 2002 - Carmel Readout architecture sensor FE chip Module Control Chip FE chip Optical driver 1 m 100 m Optical receiver power HV bias bump bonds LVDS control optical LVDS data out Sept. 9, 2002 M. Garcia-Sciveres - The ATLAS Pixel Detector 12

Pixel 2002 - Carmel The “Bare” Module Indium Bumps Solder Bumps OR 2 cm 50 mm 16 chips. 46, 080 bump bonds Sensor Xray of bumps ICs 6. 3 cm Sept. 9, 2002 M. Garcia-Sciveres - The ATLAS Pixel Detector 13

Pixel 2002 - Carmel Pixel Module Pigtail (beyond) Sensor ASICs Flex Hybrid (green) Bumps Wirebonds Schematic Cross Section (through here) Sept. 9, 2002 M. Garcia-Sciveres - The ATLAS Pixel Detector 14

Pixel 2002 - Carmel Interconnection Flex hybrid. Interconnects 16 Front End chips to 1 Module Control. Distributes power to all chips and bias to sensor. All connections wirebonded. Flex pigtail + Al/Cu wire bundle connect flex hybrid to patch panels at either end of pixel detector. Transition to optical at ends of pixel detector. Power continues on Al/Cu wires to end or inner detector. Sept. 9, 2002 M. Garcia-Sciveres - The ATLAS Pixel Detector 15

Pixel 2002 - Carmel Production line oriented design Bar code Fully assembled module on frame • • Flex hybrids mounted on frames immediately after fabrication. All module assembly proceeds on frame. Allows safe shipping & handling, testing, bar-code tracking, storage. Modules are removed from frame (by cutting sacrificial ends of flex) only at the time of attaching to a local support. Sept. 9, 2002 M. Garcia-Sciveres - The ATLAS Pixel Detector 16

Pixel 2002 - Carmel Detector building blocks Sector is replicated to form disks. 3+3 modules (back side looks the same) Bi-stave assembly Is replicated to form Barrel layers. 2 x 13 modules Same unit repeated many times for production line assembly, uniformity of work at different sites Sept. 9, 2002 M. Garcia-Sciveres - The ATLAS Pixel Detector 17

Pixel 2002 - Carmel Mechanics and services • In the detector volume: – – high power density minimum material (=> no thermal mass) cold operation <10 mm alignment maintained between room and operating temperatures – Remain cold & dry even during down times • Outside detector volume: – – Supply 2 V power from 100 m away with acceptable voltage drop Supply adequate cooling with minimal plumbing Meet overall detector geometry and installation constraints Minimize material in front of calorimeters at low angles Sept. 9, 2002 M. Garcia-Sciveres - The ATLAS Pixel Detector 18

Pixel 2002 - Carmel Module support Stave Exploded view of sector Sept. 9, 2002 M. Garcia-Sciveres - The ATLAS Pixel Detector 19

Pixel Global Support 2002 - Carmel Solid computer model of frame (cutaway view) disks Need very stiff low mass structures with near zero CTE (build at room temperatureoperate down to – 25 C). Use carbon composites, intense computer modeling & simulation Real life prototype Disk section of frame TV Holograph image disks barrel F. E. A. 1 st mode 546 Hz Sept. 9, 2002 M. Garcia-Sciveres - The ATLAS Pixel Detector 1 st mode 515. 6 Hz 20

Pixel and Beam Pipe Assembly e A “package” that can be inserted in place into the inner detector (and removed also) ort a ce rvi e S e d. B ip mp an Sept. 9, 2002 e pp u S pip m a 2002 - Carmel ort p p Su e ice v r e B nd a S Pixel Detector Fits into a support tube that provides mechanical support, but also electrical and environmental isolation from the outside. Cold inside & dry inside & out no matter outside conditions M. Garcia-Sciveres - The ATLAS Pixel Detector 21

Pixel 2002 - Carmel Construction Timeline • • Sensor production: started Pre-production chip submission: Dec. 2002 Production chip submission: Summer 2003 End Production Module assembly: Dec. 2004 Start integration at CERN: Jan. 2005 Start lowering detector into cavern: Fall 2005 Begin commissioning: Spring 2006 First collisions: 2007 Sept. 9, 2002 M. Garcia-Sciveres - The ATLAS Pixel Detector 22