Physical Interfaces Carriers Japan TC Chapter Liaison Report

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Physical Interfaces & Carriers Japan TC Chapter Liaison Report March 30, 2017 Ver. 0.

Physical Interfaces & Carriers Japan TC Chapter Liaison Report March 30, 2017 Ver. 0. 1

Outline • • Leadership Current Structure of PI&C Japan TC Chapter Meeting Information Document

Outline • • Leadership Current Structure of PI&C Japan TC Chapter Meeting Information Document Review Summary Approved SNARFs Ballots to be reviewed Task Force Updates Other topic 2

Leadership • Committee Co-chairs – Tsuyoshi Nagashima (Miraial) – Kenji Yamagata (DAIFUKU) – Tsutomu

Leadership • Committee Co-chairs – Tsuyoshi Nagashima (Miraial) – Kenji Yamagata (DAIFUKU) – Tsutomu Okabe (TDK) • Step down as a co-chair at the last PIC Japan TC Chapter meeting in December 2016. – Noriyoshi Toyoda (Hirata Corporation) • Newly appointed by JRSC at the JRSC meeting on August 26, 2016. • Technical Architect – Shoji Komatsu (Acteon NEXT) 3

Current Structure of Japan TC Chapter Physical Interfaces & Carriers Japan TC Chapter Tsutomu

Current Structure of Japan TC Chapter Physical Interfaces & Carriers Japan TC Chapter Tsutomu Okabe (TDK) stepped down from co-chair. Tsuyoshi Nagashima (Miraial) Kenji Yamagata (Daifuku) Noriyoshi Toyoda (Hirata Corporation) Technical Architect Shoji Komatsu / Acteon NEXT Newly appointed Fiducial Mark Interoperability TF I&C Committee: M. Matsuda (Hitachi Kokusai Electric) PI&C Committee: S. Mashiro (Tokyo Electron) Silicon Wafer Committee: T. Nakai (SUMCO) Packaging Committee: S. Masuchi (DISCO) Traceability Committee: H. Tsunobuchi (KEYENCE) Global PIC Maintenance TF Larry Hartsough (U. A. Associates) Shoji Komatsu (Acteon NEXT) International 450 mm PI&C TF Melvin Jung (Intel) Shoji Komatsu (Acteon NEXT) JA Shipping Box TF Tsuyoshi Nagashima (Mirial) Shoji Komatsu (Acteon NEXT) International 450 mm Shipping Box TF Tom Quinn (Intel) Shoji Komatsu (Acteon NEXT) Under Silicon Wafer Japan TC Chapter International Reticle SMIF Pod and Lord Port Interoperability TF Jan Rothe (GLOBALFOUNDRIES) TF under PIC Japan TC Chapter was discharged International Activities 4

Meeting Information • Last meeting – Japan Winter 2016 Meetings in conjunction with SEMICON

Meeting Information • Last meeting – Japan Winter 2016 Meetings in conjunction with SEMICON Japan 2016 • Wednesday, December 14, 2016 14: 00 -17: 00 • @Tokyo Big Sight Conference Tower, Tokyo • Next meeting – Japan Spring 2017 Meetings • Wednesday, April 19, 2017 13: 30 -17: 00 • @SEMI Japan office, Tokyo 5

Document Review Summary at Japan Winter 2016 Meetings in conjunction with SEMICON Japan 2016

Document Review Summary at Japan Winter 2016 Meetings in conjunction with SEMICON Japan 2016 • None 6

Approved SNARF at Japan Winter 2016 Meetings in conjunction with SEMICON Japan 2016 Doc

Approved SNARF at Japan Winter 2016 Meetings in conjunction with SEMICON Japan 2016 Doc # 6130 Description Reapproval of SEMI E 84 -1109, “SPECIFICATION FOR ENHANCED CARRIER HANDOFF PARALLEL I/O INTERFACE” TF Global PIC Maintenance TF 7

Ballots to be reviewed at Japan Spring 2017 Meetings Cycle 1 - 2017 Doc

Ballots to be reviewed at Japan Spring 2017 Meetings Cycle 1 - 2017 Doc # 6130 Description Reapproval of SEMI E 84 -1109, “SPECIFICATION FOR ENHANCED CARRIER HANDOFF PARALLEL I/O INTERFACE” TF Global PIC Maintenance TF 8 8

Task Force Updates [1/3] • Fiducial Mark Interoperability TF – Last TF meeting was

Task Force Updates [1/3] • Fiducial Mark Interoperability TF – Last TF meeting was held on November 18, 2015 – T 7 issues • #5890 – Delete all position specifications from SEMI T 7 because position specifications are also described on SEMI M 1 and other related Silicon Standard. – The ballot passed with editorial changes at the Traceability Japan TC Chapter meeting on Dec. 18, 2015 and published as T 7 -0516. – Disbandment of this TF • TF leaders decided to propose disbanding this TF to each technical committee • If this proposal is agreed by all Japan TC Chapters of Assembly & Packaging, I&C, PIC, Silicon Wafers and Traceability, then the TF will be discharged. – Silicon Wafers Japan TC Chapter and Assembly & Packaging Japan TC Chapter agreed in March 2017 respectively. – To be proposed at the next Japan TC Chapter meeting of PIC, I&C and Traceability TCs respectively. – Backend alignment issues with introducing fiducial mark wafer is left. • Would be discussed in Assembly & Packaging Japan TC Chapter after its disbandment. 9q

Task Force Updates [2/3] • Global PIC Standards Maintenance Task Force (JA Side) –

Task Force Updates [2/3] • Global PIC Standards Maintenance Task Force (JA Side) – #6130, Reapproval of SEMI E 84 -1109, “SPECIFICATION FOR ENHANCED CARRIER HANDOFF PARALLEL I/O INTERFACE” • SNARF was approved at the PIC Japan TC Chapter meeting on December 14, 2016 • Ballot was submitted for Cycle 1 -2017 – Rejects and comments to be reviewed at the TF meeting during NA Standards Spring 2017 Meetings – Ballot results to be reviewed at the PIC Japan TC Chapter meeting on April 19, 2017. 10

Task Force Updates [3/3] • International 450 mm Physical Interfaces & Carriers Task Force

Task Force Updates [3/3] • International 450 mm Physical Interfaces & Carriers Task Force (JA Side) – #5974: New Auxiliary Information: “ 450 mm PIC INTEROPERABILITY” • SNARF was approved at the Japan TC Chapter meeting on December 16 in conjunction with 2015 • The publication for this AUX was approved by the PIC Japan TC Chapter at the TC Chapter meeting on December 14, 2016 and would be forwarded to GCS and A&R for subsequent approval. • However, Safety Check and IP Check were not done at this TC Chapter meeting on this approval procedure, so these checks to be done at the next PIC Japan TC Chapter meeting on April 19, 2017. 11

Other topic • Proposal of New Standards, Specification for Lamella Carriers Used in Transmission

Other topic • Proposal of New Standards, Specification for Lamella Carriers Used in Transmission Electron Microscopes – According to the decision at the EU TC Chapter meeting in October during SEMICON Europa 2016, the meeting to introduce proposal was held on December 13 at SEMI Japan Office in conjunction with SEMICON Japan 2016 • Back ground of this standardization • Presentation on “Enabling HVM TEM metrology support - standards for TEM lamella carriers” • Proposed drafts of SNARF and TFOF – The Japan TC Chapter agreed to support for conducting a survey regarding standardization of TEM and potential further standardization of TEM grid carrier. • SEMI HQ will conduct this survey. – Currently contents of survey form is under drafting. 12

Thank You! For more information or participate in any Japan PI&C activities, please contact

Thank You! For more information or participate in any Japan PI&C activities, please contact Chie Yanagisawa at SEMI Japan ([email protected] org)

Backup 14

Backup 14

5 Year Review • SEMI E 84 -1109 – The Global PIC Standards Maintenance

5 Year Review • SEMI E 84 -1109 – The Global PIC Standards Maintenance TF will discuss what to do for SEMI E 84 -1109 and then propose any action at the next Japan TC Chapter meeting in conjunction with SEMICON Japan 2016. • SEMI E 23 -1104 (Reapproved 0710) – The TC Chapter did not decide any further support action to this standard and let it go inactive. 15

Task Force Updates [4/4] • International Process Module Physical Interface (IPPI) TF – The

Task Force Updates [4/4] • International Process Module Physical Interface (IPPI) TF – The document worked by this task force was published. – The disbandment of IPPI TF was approved, with pending the EU TC Chapter’s agreement, at the Japan TC Chapter meeting on April 15, 2015. – NA TC Chapter approved the disbandment of IPPI TF at the NA PIC TC Chapter meeting in conjunction with NA Standards Spring 2016 Meetings, so that the disbandment of this TF was completed. 16