Photoresist pattern StepA StepK Remove and bonding TSV
賣點 Photoresist pattern Step-A Step-K Remove and bonding TSV dry etch CNT growth CMP Step-B Step-C Step-D Step-E Step-H Step-G solder coating CMP Step-J Remove the tape Step-I Reverse and bonding 1 st solder coating Reverse and stick to tape Step-F
圖三 本研究於Step-E 鍍上Cr/In 的solder coating所進行的 光阻曝光對位。 1 st solder coating Step-E
圖四 本研究於Step-E 鍍上Cr/In 的solder coating之後的焊 料凸塊樣貌。 1 st solder coating Step-E
圖五 Step-H的試片剖面圖，具 有完整的CNT TSV架構。 solder coating Step-H
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