Photodetector on Silicon Heng Yang Outline Introduction Si

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Photodetector on Silicon Heng Yang

Photodetector on Silicon Heng Yang

Outline • Introduction • Si Photodetector in 770 ~ 850 nm Range • IR

Outline • Introduction • Si Photodetector in 770 ~ 850 nm Range • IR Schottky barrier photodetector

Introduction • Essentially - p-n diode under the reverse bias • Operate in the

Introduction • Essentially - p-n diode under the reverse bias • Operate in the photoconductive mode • Main usage - for the conversion of the optical signal • works at 0. 3 - 1. 1 µm (peak responsivity at 0. 8 µm).

Si Photodetector in 770 ~ 850 nm Range • • Optical communication range. Absorption

Si Photodetector in 770 ~ 850 nm Range • • Optical communication range. Absorption length for Si: 10 ~ 15 mm. Requirements: High responsivity and Fast? pn, pin and msm. n Depletion region p J = Jdrfit + Jdiff

Interdigitated Electrode Interdigitated electrodes are often used to increase the active region area while

Interdigitated Electrode Interdigitated electrodes are often used to increase the active region area while optimizing the electric fields in the carrier collection region. Electrode can either be P+/N+ or just metal.

Silicon Lateral Trench Photodetector Finger space = 3. 3 mm Trench depth = 8

Silicon Lateral Trench Photodetector Finger space = 3. 3 mm Trench depth = 8 mm Finger size = 0. 35 mm For l=845 nm, BW=1. 5 GHz, Responsivity = 0. 47 A/W at 5 V Min Yang, Kern Rim, Dennis L. Rogers, et al. , IEEE ELECTRON DEVICE LETTERS, VOL. 23, NO. 7, JULY 2002

MSM Photodetector by Trench Formation For l = 790 nm, BW = 2. 2

MSM Photodetector by Trench Formation For l = 790 nm, BW = 2. 2 GHz, Responsivity = 0. 14 A/W @ 5 V Jacob Y. L. Ho and K. S. Wong, IEEE Photonics Technology Letters, 8(8), 1996

Resonant-Cavity-Enhanced High. Speed Si Photodetector Three pair of quarter wavelength Si. O 2 and

Resonant-Cavity-Enhanced High. Speed Si Photodetector Three pair of quarter wavelength Si. O 2 and polysilicon at bottom (LPCVD). Etched seed window. Si. O 2 Side-wall to prevent defects at the edge of poly. RPCVD Si. Two pairs of Zn. Se-Mg. F on top (evaporated). J. D. Schaub, R. Li, C. L. Schow, J. C. Campbell, G. W. Neudeck, and J. Denton , IEEE PHOTONICS TECHNOLOGY LETTERS, VOL. 11, NO. 12, DECEMBER 1999

Photodetector on SOI • Thin active layer, and small finger space result in high

Photodetector on SOI • Thin active layer, and small finger space result in high speed. • Device with 100 nm active layer and 100 nm finger space was made. l=780 nm BW=140 GHz, responsivity=5. 7 m. A/W @ 5 V. Silicon dioxide Silicon M. Y. Liu, E. Chen, and S. Y. Chou, Appl. Phys. Lett. 65 (7), 15 August 1994

IR Schottky Barrier (SB) Photodetector 300, 000 Pt. Si/p-Si Schottky barrier IR detector focal

IR Schottky Barrier (SB) Photodetector 300, 000 Pt. Si/p-Si Schottky barrier IR detector focal plane arrays have been developed and used on Air Force B-52

IR Schottky Barrier Photodetector Internal Photoemission Intrinsic Mechanism

IR Schottky Barrier Photodetector Internal Photoemission Intrinsic Mechanism

Issues • High dark current, has to operate at low temperature (40 ~ 80

Issues • High dark current, has to operate at low temperature (40 ~ 80 K). • Low quantum efficiency (QE). High l. C gives high QE. In order to expand the spectrum, efforts were made to decrease the barrier height.

Fowler Plot • The dark current is thermionic limited. It is given by: •

Fowler Plot • The dark current is thermionic limited. It is given by: • A** is Richardson constant • By plotting J 0/T 2 vs 1/T, qf. B can be obtained from the slope.

Pt. Si/p-Si Schottky Barrier • Second lowest barrier height (0. 22 e. V). More

Pt. Si/p-Si Schottky Barrier • Second lowest barrier height (0. 22 e. V). More than Ir. Si (0. 16 e. V). • Low expense. • Compatible with standard IC process. • Stable. • Good uniformity over large area. • Good growth and etching selectivity.

Pt. Si Schottky-Barrier Infrared Focal Plane Arrays Masafumi Kimata, Tatsuo Ozaki, Natsuro Tsubouchi and

Pt. Si Schottky-Barrier Infrared Focal Plane Arrays Masafumi Kimata, Tatsuo Ozaki, Natsuro Tsubouchi and Sho Ito, Proceeding of SPIE, 1998

SBD with a shallow P+ layer • Pt. Si/p-Si, q. FB = 0. 22

SBD with a shallow P+ layer • Pt. Si/p-Si, q. FB = 0. 22 e. V, lc = 5. 6 mm. (M. Kimata, M. Denda et. al, Inter. J. of Infrared and millimeter waves, 6(10), 1985) • Pt. Si/p+ (100 ~ 300 nm)/p-Si, q. FB < 0. 22 e. V, with hole tunneling, lc = 7 mm. (CY Wei, W. Trantraporn, W. Katz and G. Smith, 93, 1981) • Pt. Si/p+ (1 nm)/p-Si, q. FB = 0. 057 e. V, lc = 22 mm. (TL Lin, JS Park et. al, Appl. Phys. Lett. 62(25), 1993) TL Lin, JS Park et al. Appl. Phys. Lett. 62(25), 1993

Porous Silicon (PS) Schottky Barrier Detector • The modification was made just to make

Porous Silicon (PS) Schottky Barrier Detector • The modification was made just to make the Pt. Si on top of the PS in stead of Si. Pt was deposited by electrodeposition • The cut-off wavelength of 7 mm was reported. • QE ~ 10% @ 7 mm • Random orientation of the junctions increase the number of holes that can be injected into Si. Farshid Raissi and Mansoor Mohtashami Far, IEEE Sensors Journal, 2 (5) 2002