PHENIX upgrades view presented to DOE AuAu pp

PHENIX upgrades: view presented to DOE Au-Au p-p 200 Si-Si ++ p-p 500 Au-Au R&D $3. 5 M Construction $16. 6 M Muon trigger upgrades, missing since not aimed towards DO

D M Lee 6 -17 -2003 PHENIX

D M Lee 6 -17 -2003 PHENIX

D M Lee 6 -17 -2003 PHENIX Institutional Responsibilities task institution mechanical support, cooling HYTEC/LANL integration, infrastructure BNL pixel hybrids, sensor/readout LANL pixel pilot ISU pixel assembly, ladder bus LANL pixel fem SUNY-S/B DCM’s Columbia

D M Lee 6 -17 -2003 • Simulations Tasks endcap • • Implementation of new geometry in PISA • Continual update of geometry with evolving mechanical design • Ministrip size determination • Detailed simulation of pp capability • Detailed simulation of Au-Au capability • Vertex tracking code • Detailed track matching • Integration with barrel and HPD/TPC • Overall coordination • • UNM, Doug Fields has expressed an interest in helping with the simulation and has a student. He hasn’t defined the level of effort yet. The simulations to date for the end caps have been done by Pat. Mc. Gaughey and Dave Lee and the new geometry has been done by Hua Pei. Some interest in simulations has been expressed by Pat, Gerd, and Dave. • • Mechanical Tasks endcap and barrel • • Overall coordinaton Lee • Ladder prototyping cooling test HYTEC • Overall structure prototype HYTEC • Production liason Lee, HYTEC • Ladder assembly • Combined endcap/barrel assembly • Cooling system production • Integration with PHENIX/HBD/TPC • • Dave Lee has been working with a company, HYTEC, to do the mechanical design of the total support structure and cooling design for the barrel and endcap. They produced a conceptual design based on their work on ATLAS that covered ladder structures, cooling, and the combined barrel and endcap support. •

D M Lee 6 -17 -2003 • Sensor Tasks endcap • • Overall coordination Ministrip Design Prototyping Testing with bump bonded frontend chip Bump bonding Production liason • Electronics endcap • • Overall coordination Kunde? • Frontend ministrip chip design Kunde • Prototype Frontend chip fermilab • Testing frontend chip Kunde, fermilab • Production frontend chip Kunde, fermilab • Supporting chip design, pilot chip/chips • Test supporting chip • Slow control • HV design • Readout cable design • Power plant • DCM liason to Chi • • Gerd Kunde has established a collaboration with Ray Yarema of FERMILAB to design the frontend chip to bump bond to the sensors. In addition all facilities at FERMILAB are available to us for Q/A, assembly testing, etc. • • Construction where ? • Coordinator • • Integration electrical and mechanical who? •

D M Lee 6 -17 -2003 PHENIX Beginning cost basis Fermi. Lab Electronics Cost Estimate • Chip design/testing – 2 man-years - $275 K (includes all overhead costs) • Prototype chip fabrication- $40 K (small chip), or $80 K (large chip) • Test board $5 K • Engineering run (10 -12 wafers) $200 K • 9 Extra wafers using same masks - $45 K • Production wafer level testing –engineering, tech time, circuit board, probe card - $60 K • Contingency? ?

D M Lee 6 -17 -2003 PHENIX Fermilab Electronics Schedule Estimate • Design specifications completed 10/03 • Start design 12/03 • Submit prototype 7/04 • Prototype testing completed 12/04 • Redesign completed for engineering run 1/05 • Engineering run back 3/05

D M Lee 6 -17 -2003 PHENIX

D M Lee 6 -17 -2003 PHENIX LANL Manpower Estimate Physicist- mechanical liason, electronic liason, simulation – 3 FTE Electronic Engineer – Fermilab – construction Budget – 2 FTE Electronic Integration Engineer – construction Budget - 0. 5 FTE Tech – construction budget – 2 FTE Lab space, Q/A, Assembly Infrastructure – lab space, testing assembly, FNAL, HYTEC, LANL, BNL Institutionals LANL, ISU, Columbia, Uof. Col, UNM, NMSU? , Ecole Poly? , Saclay? , SUNY-SB,

D M Lee 6 -17 -2003 PHENIX Initial endcap cost estimate Construction Project 2 – End. Caps Mechanical support and cooling (2 endcaps) Hybrid pixel layers (2 encaps) Management Total Overhead on DOE contribution 50% contingency Total DOE (k$) 195 4766 100 5061 1257 2458 8849

D M Lee 6 -17 -2003 PHENIX Physicist Manpower Estimate Physicist • Barnes • Brooks • Burward-Hoy • Kunde • Leitch • Liu • Mc. Gaughey • Moss • Silvermyr • Sullivan van. Hecke Physics Analysis 20 75 100 40 25 100 75 50 100 40 50 Silicon Upgrade 20 25 40 50 25 50 20 50