PCB SHEARING DF PHOTO IMAGE INNER LAYER LAMINATION

PCB流程簡介 SHEARING D/F PHOTO IMAGE (INNER LAYER) LAMINATION CNC DRILL PTH D/F PHOTO IMAGE (OUTER LAYER) ETCH LIQUID SOLDER MASK NC ROUTING ELECTRICAL TEST HAL(SURFACE TREATMENT) Page: 6 PANEL PLATING O. Q. C. Confidential

PCB流程簡介 Page: 7 1. 內層基板 (THIN CORE) Core Copper Foil 裁板(Panel Size) COPPER FOIL Epoxy Glass Confidential

PCB流程簡介 Page: 8 2. 內層線路製作(壓膜) (Dry Film Resist Coat) Etch Photoresist (D/F) Photo Resist Confidential

PCB流程簡介 Page: 9 3. 內層線路製作(曝光)(Expose) A/W Photo Resist Artwork (底片) Before Expose After Expose Confidential

PCB流程簡介 Page: 10 4. 內層線路製作(顯影)(Develop) Photo Resist Confidential

PCB流程簡介 Page: 11 5. 內層線路製作(蝕刻)(Etch) Photo Resist Confidential

PCB流程簡介 Page: 12 6. 內層線路製作(去膜)(Strip Resist) Confidential

PCB流程簡介 Page: 13 7. 黑氧化 ( Oxide Coating) Confidential

PCB流程簡介 Page: 14 8. 疊板 (Lay-up) LAYER 1 LAYER 2 LAYER 3 LAYER 4 LAYER 5 LAYER 6 Copper Foil Prepreg(膠片) Layer 1 Layer 2 Layer 3 Layer 4 Inner Layer Prepreg(膠片) Copper Foil Confidential

PCB流程簡介 Page: 15 9. 壓合 (Lamination) Confidential

PCB流程簡介 Page: 16 10. 鑽孔, 貫孔or盲孔 (Drilling) 鋁板 墊木板 Confidential

PCB流程簡介 Page: 17 11. 電鍍 Desmear & Copper Deposition Confidential

PCB流程簡介 Page: 18 12. 外層壓膜 Dry Film Lamination (Outer layer) Photo Resist Confidential

PCB流程簡介 Page: 19 13. 外層曝光 Expose 光源 Confidential

PCB流程簡介 Page: 20 14. After Exposed Confidential

PCB流程簡介 Page: 21 15. 外層顯影 Develop Confidential

PCB流程簡介 Page: 22 16. 蝕刻 Etch Confidential

PCB流程簡介 Page: 23 17. 去乾膜 Strip Resist Confidential

PCB流程簡介 Page: 24 18. 噴塗 Solder Mask (Spray Coating) Confidential

PCB流程簡介 Page: 25 19. 防焊曝光 (Expose) S/M A/W 20. 綠漆顯影 Develop Confidential

PCB流程簡介 Page: 26 21. 印文字(Legend) R 105 Confidential

PCB流程簡介 Page: 27 22. Surface Finished (Electroless Ni/Au , HAL……) R 105 Confidential

Page: 28 Confidential