PCB LOGO PCB LOGO v 3 DES DevelopingEtchingStrip
Sign up to view full document!
SIGN UP
PCB流程詳解 LOGO
PCB流程詳解 LOGO v 3. 縮寫名詞 § DES: Developing(顯影)+Etching(蝕刻)+Strip(去膜) § AOI: Automatic Optical Inspection(自动光学检测) § VRS: Verify Repair Station(确认检修系统 ) v 4. 無塵室定義 § 1000級無塵室: 1 ft 3空气中含有0. 5μm以上的 微粒子在 1000个以内. per美国联邦标准《Fed-Sta-209 E》
PCB流程詳解 FR-4參數 LOGO
PCB流程詳解 v 4. 外層后測阻抗 § 單端阻抗 single-ended IMP § 差動阻抗 Differential IMP § 表面型阻抗 Surface IMP § 埋入式阻抗 Embedded IMP LOGO
PCB流程詳解 v 6. 常用名詞 § Coverage § Solder Dam § Clearance § Annual Ring LOGO
PCB流程詳解 LOGO
- Slides: 28