PCB 2002 03 1 Process Flow Customer Sales

PCB 개요 2002. 03. 1

첨부. Process Flow Customer Sales Dept. Inner Layer Photo Art Work Pre-Engineering Etching 1 Law Materials Control 1 AOI Inspection Lamination Inspection 2 3 Oxidation Routing V-Cut First Article Report Drilling S/R E/T Desmear Silk V/M Q/A Photo Cu Plating Finish Treatment Packaging Delivery 2 3

PCB 주요 불량 대분류 신뢰성 PCB 기능성 외관 Try & Turn Around 항목 검사 확인 방법 Hole Interconnection IST, Micro-Section Delamination Micro-Section Solderability Wave , Reflow Soldering Open, Short AOI, Electrical Tester Impedance 측정기 Bow & Twist Bow, Twist Checker Solder Resist Tape Test Dimension 2차원 치수 측정기 Scratch Visual Inspection(3~6 X) 1/2

Through Hole 관련 불량 항목 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. 26. 27. 28. 29. 30. 31. 32. 33. 34. A. B. C. Try & Turn Around 2/2 PLATING VOID WEDGE VOID PLATING CRACK /BARREL CRACK FOIL CRACK BURNED PLATING DELAMINATION PINKRING BLISTERING CRAZING/MEASLING LAMINATE VOID PREPREG VOID RESIN RECESSION INNERLAYER STRESS CRACK RESIN CRACK FIBREBUNDLE CRACK DRILLING CRACK LIFTED LAND/PAD LIFTED PAD ROTATION PULL AWAY RESIN RECESSION WICKING GLASSFIBRE PROTRUSION BURR NODULE INNERLAYER INCLUSION INNERLAYER SEPARATION ETCHBACK NEGATIVE ETCHBACK POSITIVE SHADOWING NAIL HEADING ARROW HEADING WAVE EXPOSURE WEAVE TEXTURE UNDERCUT OUTGROWTH OVERHANG

Net Work向 Back Plane PCB Layer Count : 42 Layer Thickness : 7. 4 mm Controlled Impedance Board Press fit Hole 채택 Layer Count : 18 Layer Thickness : 3. 9 mm Controlled Impedance Board Press fit Hole 채택 Try & Turn Around

Net Work向 Back Plane PCB Layer Count : 18 Layer Thickness : 5. 0 mm Controlled Impedance Board Press fit Hole 채택 Net Work向 HDI PCB Rigid-Flexible PCB Layer Count : 12 Layer Thickness : 1. 6 mm Polyimide 재질 Try & Turn Around Layer Count : 18 Layer Thickness : 2. 7 mm Controlled Impedance Board Buried Capacitance 채택 FR-4 Laser Drill

High Speed PCB Layer Count : 8 Layer IVH Thickness : 1. 60 mm Ceramic Base 低 유전율 재질 (ROGES) + GETEK Material Try & Turn Around High Speed PCB Layer Count : 8 Layer IVH Thickness : 2. 0 mm 低 유전율 재질 (PTFE) + GETEK Material