Passive Components TWG Report NEMI Meeting March 25

Passive Components TWG Report NEMI Meeting March 25 TWG Chairman Needed Joe Dougherty - Penn State, Co-Chair Dennis Fritz - Mac. Dermid, reporting 1

NEMI • • • National Electronics Manufacturing Initiative Association driven by large OEMs - IBM, Motorola, Nortel, Cisco, Intel, etc. • TWG - Technology Working Group 2

Situation (Infrastructure) Analysis • Benchmark Traditional state of art – Production of 0201 Surface Mount Components – Production of Metric “ 0603” components – Integral and Network components - infrastructure • Crosscuts – – How many resistors, capacitors go into “SIP” modules Assembly - true “embedded” passives inside boards. Definition of “embedded” and “integral” components Embedded - “blur” with RFID devices 3

Situation (Infrastructure) Analysis • Benchmark Embedded Passive state of art (cont. ) – Infrastructure • • • Standards - under IPC and JPCA development UL - Satisfactory Design tools - Progressing Test tools - ? ? Training - Progressing Conceptual - Missing “Product Managers”? 4

Situation (Infrastructure) Analysis • Benchmark Embedded Passive state of art – Demonstrated U. S. laboratory capability • Capacitors - 4 Laminate, 2 Thin layer, 1 Ceramic • Resistors - 4 Thin Film, 1 Ceramic, 3 Polymer Film • Inductors - No new technology required – Demonstrated Commercial capability • Motorola - Pagers and cell phones • Distributed capacitance - being designed in and used • Specialty thin film resistors - being designed and used – Cost Analysis Tools - available, but not friendly 5

Situation (Infrastructure) Analysis 2002 (Review) 6

NEMI Emulators • • Portable Electronics Medical “System in a Package” = SIP Defense (Harsh Environment) Automotive (Harsh Environment) Office Systems “Netcomm” 7

Emulator Columns • • Passive Devices: Embedded Passives Max. Ohms Max. Capacitance • • • Type/Size # per sq. cm PWB Costs (FR 4) 2 layer flexible 4 layer conventional 8

Roadmap of Quantified Key Attribute Needs - 2003 9

Roadmap of Quantified Key Attribute Needs - 2005 10

Roadmap of Quantified Key Attribute Needs - 2007 11

Roadmap of Quantified Key Attribute Needs - 2009 12

Roadmap of Quantified Key Attribute Needs - 2013 13

Critical (Infrastructure) Issues • Paradigm Shifts – Embedded Active Devices – Broad Component Value Processes (Greater than 1. 5 decades in value) – E-Test Routinely Done at Board Fab – Simulation and Design Tools for Component/Package Combination • Cost Modeling – Tools readily available to designers - based on data, not projections 14

Technology Needs: • - Research, Development Priorities - Grouped Into Categories: – Mfg. Processes, • Better Singulated Capacitor Technology • Board Fabrication for Embedded Passives • Board Fabrication for Embedded Active Components – Energy - none – Systems Integration • Responsibility for function - Board Fab? CEM? ODM? – Materials • High Dk organic capacitors • High R “metallic like” materials 15

Gaps and Showstoppers • Discretes - Tiny Component Availability vs. Machine Placement Capability • Embedded Passive - “Chicken and Egg” - Risk Aversion • System Design Capability - Single CAD Tool • Test Capability - All Parameters at All Manufacture Levels 16

Recommendations on potential Alternative Technologies • Follow Japan JISSO on Embedded Active Components 17

Contributors • • • Joe Dougherty - Penn State Richard Ulrich - U of Arkansas John Galvagni - AVX Murata Rob Sheffield - Nortel Delphi Merix Coretec Sanmina Du. Pont Rohm and Haas Electronic Materials 18

Contributors (cont. ) • • • Mac. Dermid Gould Ohmegaply 3 M ESI 19

Contacts for Participation • NEMI (Passives Chapter will not include embedded passives) – Chuck. Richardson@nemi. org – jim. arnold@motorola. com – Bob. Pfahl@NEMI. org – jxd 6@psu. edu (Joseph Dougherty - Penn State) 20

Contacts for Participation • NEMI (Organic Substrates Chapter will include embedded passives) – fish 5 er@mindspring. com (Jack Fisher) – Dieter. Bergman@ipc. org 21